NCP552, NCP553, NCV553
80 mA CMOS Low Iq
NOCAP Voltage Regulator
This series of fixed output NOCAP linear regulators are designed
for handheld communication equipment and portable battery powered
applications which require low quiescent. This series features an
ultra−low quiescent current of 2.8 A. Each device contains a voltage
reference unit, an error amplifier, a PMOS power transistor, resistors
for setting output voltage, current limit, and temperature limit
protection circuits. The NCP552 series provides an enable pin for
ON/OFF control.
These voltage regulators have been designed to be used with low
cost ceramic capacitors. The devices have the ability to operate
without an output capacitor. The devices are housed in the
micro−miniature SC82−AB surface mount package. Standard voltage
versions are 1.5, 1.8, 2.5, 2.7, 2.8, 3.0, 3.3, and 5.0 V. Other voltages
are available in 100 mV steps.
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4
1
SC82−AB (SC70−4)
SQ SUFFIX
CASE 419C
Features
•
Pb−Free Packages are Available*
Low Quiescent Current of 2.8 A Typical
Low Output Voltage Option
Output Voltage Accuracy of 2.0%
Industrial Temperature Range of −40°C to 85°C
(NCV553, TA = −40°C to +125°C)
NCP552 Provides an Enable Pin
PIN CONNECTIONS &
MARKING DIAGRAMS
GND 1
4 Enable
xxxM
•
•
•
•
•
Vin 2
3 Vout
Typical Applications
Battery Powered Consumer Products
Hand−Held Instruments
Camcorders and Cameras
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
(NCP552 Top View)
GND 1
4 N/C
xxxM
•
•
•
•
Vin 2
3 Vout
ON
GND Enable
(NCP553, NCV553 Top View)
OFF
Output
Input
Vin
C1
xxx = Device Code
M = Date Code
Vout
+
+
C2
ORDERING INFORMATION
This device contains 32 active transistors
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
Figure 1. NCP552 Typical Application Diagram
GND
N/C
Vin
Vout
Input
Output
C1
+
+
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
C2
This device contains 32 active transistors
Figure 2. NCP553 Typical Application Diagram
Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. 5
1
Publication Order Number:
NCP552/D
NCP552, NCP553, NCV553
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PIN FUNCTION DESCRIPTION
NCP552
NCP553
Pin Name
Description
1
1
GND
2
2
Vin
Positive power supply input voltage.
3
3
Vout
Regulated output voltage.
4
−
Enable
−
4
N/C
Power supply ground.
This input is used to place the device into low−power standby. When this input is pulled low, the
device is disabled. If this function is not used, Enable should be connected to Vin.
No internal connection.
MAXIMUM RATINGS
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Rating
Symbol
Value
Unit
Vin
12
V
Enable
−0.3 to Vin +0.3
V
Output Voltage
Vout
−0.3 to Vin +0.3
V
Power Dissipation and Thermal Characteristics
Power Dissipation
Thermal Resistance, Junction−to−Ambient
PD
RJA
Internally Limited
400
W
°C/W
Operating Junction Temperature
TJ
+125
°C
Operating Ambient Temperature
NCP552, NCP553
NCV553
TA
Storage Temperature
Tstg
Input Voltage
Enable Voltage (NCP552 ONLY)
°C
−40 to +85
−40 to +125
−55 to +150
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model 2000 V per MIL−STD−883, Method 3015
Machine Model Method 200 V
2. Latch up capability (85°C) 200 mA DC with trigger voltage.
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2
NCP552, NCP553, NCV553
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 F, Cout = 1.0 F, TJ = 25°C, unless
otherwise noted.)
Characteristic
Symbol
Min
Typ
Max
1.455
1.746
2.425
2.646
2.744
2.94
3.234
4.900
1.5
1.8
2.5
2.7
2.8
3.0
3.3
5.0
1.545
1.854
2.575
2.754
2.856
3.06
3.366
5.100
1.455
1.746
2.425
2.619
2.716
2.910
3.201
4.900
1.5
1.8
2.5
2.7
2.8
3.0
3.3
5.0
1.545
1.854
2.575
2.781
2.884
3.09
3.399
5.100
Unit
Output Voltage (TA = 25°C, Iout = 10 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
5.0 V
Vout
Output Voltage (TA = −40°C to 85°C, Iout = 10 mA)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
5.0 V
Vout
Output Voltage (TA = −40°C, Iout = 10 mA)
NCV553 −5.0 V
Vout
4.900
5.0
5.100
V
Output Voltage (TA = +125°C, Iout = 10 mA)
NCV553 −5.0 V
Vout
4.850
5.0
5.150
V
Line Regulation (Vin = Vout + 1.0 V to 12 V, Iout = 10 mA)
Regline
−
2.0
4.5
mV/V
Load Regulation (Iout = 1.0 mA to 80 mA, Vin = Vout + 2.0 V)
Regload
−
0.3
0.8
mV/mA
Output Current (Vout = (Vout at Iout = 80 mA) −3.0%)
1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V−5.0 V (Vin = 6.0 V)
Io(nom.)
80
80
180
180
−
−
Dropout Voltage (TA = −40°C to 125°C, Iout = 80 mA, Measured at
Vout −3.0%)
1.5 V
1.8 V
2.5 V
2.7 V
2.8 V
3.0 V
3.3 V
5.0 V
Vin−Vout
Quiescent Current
(Enable Input = 0 V)
(Enable Input = Vin, Iout = 1.0 mA to Io(nom.), Vin = Vout +2.0 V)
V
V
mA
mV
−
−
−
−
−
−
−
−
1300
1100
800
750
730
680
650
470
1800
1600
1400
1200
1200
1000
1000
800
−
−
0.1
2.8
1.0
6.0
100
100
300
300
450
450
−
90
−
1.3
−
−
−
−
0.3
−
100
−
A
IQ
Output Short Circuit Current (Vout = 0 V)
1.5 V−3.9 V (Vin = Vout(nom.) + 2.0 V)
4.0 V−5.0 V (Vin = 6.0 V)
Iout(max)
Output Voltage Noise (f = 20 Hz to 100 kHz, Iout = 10 mA)
(Cout = 1.0 F)
Vn
Enable Input Threshold Voltage (NCP552 ONLY)
(Voltage Increasing, Output Turns On, Logic High)
(Voltage Decreasing, Output Turns Off, Logic Low)
mA
Vth(en)
Output Voltage Temperature Coefficient
TC
V
3. Maximum package power dissipation limits must be observed.
T
TA
PD J(max)
RJA
4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
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3
Vrms
ppm/°C
NCP552, NCP553, NCV553
DEFINITIONS
Load Regulation
Line Regulation
The change in output voltage for a change in output
current at a constant temperature.
The change in output voltage for a change in input voltage.
The measurement is made under conditions of low
dissipation or by using pulse technique such that the average
chip temperature is not significantly affected.
Dropout Voltage
The input/output differential at which the regulator output
no longer maintains regulation against further reductions in
input voltage. Measured when the output drops 3.0% below
its nominal. The junction temperature, load current, and
minimum input supply requirements affect the dropout level.
Line Transient Response
Typical over and undershoot response when input voltage
is excited with a given slope.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 160°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Maximum Power Dissipation
The maximum total dissipation for which the regulator
will operate within its specifications.
Quiescent Current
The quiescent current is the current which flows through
the ground when the LDO operates without a load on its
output: internal IC operation, bias, etc. When the LDO
becomes loaded, this term is called the Ground current. It is
actually the difference between the input current (measured
through the LDO input pin) and the output current.
Maximum Package Power Dissipation
The maximum power package dissipation is the power
dissipation level at which the junction temperature reaches
its maximum operating value, i.e. 125°C. Depending on the
ambient power dissipation and thus the maximum available
output current.
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4
1
3.03
Vout(nom.) = 3.0 V
0.9
Vout, OUTPUT VOLTAGE (VOLTS)
Vin − Vout, DROPOUT VOLTAGE (VOLTS)
NCP552, NCP553, NCV553
0.8
0.7
80 mA
0.6
0.5
0.4
40 mA
0.3
0.2
0.1
0
−50
−25
0
25
50
75
100
Vout(nom.) = 3.3 V
3.025 Iout = 5 mA
3.02
3.01
3.005
3
−60
125
−20
−40
20
0
60
40
80
TEMPERATURE (C)
TEMPERATURE (C)
Figure 3. Dropout Voltage versus Temperature
Figure 4. Output Voltage versus Temperature
3
2.75
2.5
2.25
2
1.75
−60
Vout(nom.) = 3 V
Iout = 0 mA
4
3.5
3
2.5
2
1.5
1
0.5
0
−40
−20
0
20
40
60
80
100
0
2
TEMPERATURE (C)
3.5
3
2.5
OUTPUT VOLTAGE
DEVIATION (mV)
10 mA
1.5
50 mA
0.5
0
10
100
1000
10000
8
6
10
12
Figure 6. Quiescent Current versus Input Voltage
Vin, INPUT
VOLTAGE (V)
4
2
4
Vin, INPUT VOLTAGE (VOLTS)
Figure 5. Quiescent Current versus Temperature
1
100
4.5
Iout = 0 mA
Vin = 4 V
Iq, QUIESCENT CURRENT (A)
Iq, QUIESCENT CURRENT (A)
Vin = 4 V
3.015
3.25
OUTPUT NOISE (V/Hz)
Vin = 12 V
100000
1000000
6
Iout = 1 mA
Cout = 1 F
5
4
200
100
0
−100
0
0.5
1
1.5
2
2.5
3
3.5
FREQUENCY (Hz)
TIME (s)
Figure 7. Output Noise Density
Figure 8. Line Transient Response
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5
4
4.5
Vin = 4 V
Cout = 10 F
400
200
ENABLE
VOLTAGE (V)
200
0
−200
0
Vin = 4 V
Cout = 10 F
−400
Iout, OUTPUT
CURRENT (V)
150
100
50
0
100
50
0
−50
0
OUTPUT VOLTAGE
(V)
OUTPUT VOLTAGE
DEVIATION (mV)
600
10
20
30
40
0
50
0.5
1
1.5
2
TIME (ms)
TIME (ms)
Figure 9. Load Transient Response
Figure 10. Load Transient Response
3.5
Vout, OUTPUT VOLTAGE (VOLTS)
Iout, OUTPUT
CURRENT (mA)
OUTPUT VOLTAGE
DEVIATION (mV)
NCP552, NCP553, NCV553
5
0
3
2
Iout = 10 mA
Cin = 1 F
Cout = 0.1 F
Vin = 4 V
1
0
0
100
200
300
400
3
2.5
2
1.5
1
Cin = 1 F
Cout = 1 F
TA = 25 C
0.5
0
500
600
700
0
2
4
6
8
10
12
TIME (s)
Vin, INPUT VOLTAGE (VOLTS)
Figure 11. Turn−On Response (NCP552 ONLY)
Figure 12. Output Voltage versus Input Voltage
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6
NCP552, NCP553, NCV553
APPLICATIONS INFORMATION
A typical application circuit for the NCP552 series and
NCP553 series is shown in Figure 1 and Figure 2, front page.
chance to pick up noise or cause the regulator to
malfunction.
Set external components, especially the output capacitor,
as close as possible to the circuit, and make leads as short as
possible.
Input Decoupling (C1)
A 1.0 F capacitor either ceramic or tantalum is
recommended and should be connected close to the package.
Higher values and lower ESR will improve the overall line
transient response. If large line or load transients are not
expected, then it is possible to operate the regulator without
the use of a capacitor.
TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Thermal
As power across the NCP552 and NCP553 increases, it
might become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material and also the
ambient temperature effect the rate of temperature rise for
the part. This is stating that when the devices have good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
The maximum dissipation the package can handle is
given by:
Output Decoupling (C2)
The NCP552 and NCP553 are very stable regulators and
do not require any specific Equivalent Series Resistance
(ESR) or a minimum output current. If load transients are not
to be expected, then it is possible for the regulator to operate
with no output capacitor. Otherwise, capacitors exhibiting
ESRs ranging from a few m up to 10 can thus safely be
used. The minimum decoupling value is 0.1 F and can be
augmented to fulfill stringent load transient requirements.
The regulator accepts ceramic chip capacitors as well as
tantalum devices. Larger values improve noise rejection and
load regulation transient response.
TDK capacitor: C2012X5R1C105K, C1608X5R1A105K,
or C3216X7R1C105K
T
TA
PD J(max)
RJA
If junction temperature is not allowed above the
maximum 125°C, then the NCP552 and NCP553 can
dissipate up to 250 mW @ 25°C.
The power dissipated by the NCP552 and NCP553 can be
calculated from the following equation:
Enable Operation (NCP552 ONLY)
Ptot [Vin * Ignd (Iout)] [Vin Vout] * Iout
The enable pin will turn on the regulator when pulled high
and turn off the regulator when pulled low. These limits of
threshold are covered in the electrical specification section
of this data sheet. If the enable is not used then the pin should
be connected to Vin.
or
P Vout * Iout
VinMAX tot
Ignd Iout
If an 80 mA output current is needed then the ground
current from the data sheet is 2.8 A. For an NCP552 or
NCP553 (3.0 V), the maximum input voltage will then be
6.12 V.
Hints
Please be sure the Vin and GND lines are sufficiently
wide. When the impedance of these lines is high, there is a
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7
NCP552, NCP553, NCV553
ORDERING INFORMATION
Nominal
Output Voltage
(Note 5)
Marking
NCP552SQ15T1
NCP552SQ18T1
NCP552SQ25T1
NCP552SQ27T1
NCP552SQ28T1
NCP552SQ30T1
NCP552SQ33T1
NCP552SQ50T1
1.5
1.8
2.5
2.7
2.8
3.0
3.3
5.0
LAW
LAX
LAY
LAZ
LBA
LBB
LBC
LBD
NCP553SQ15T1
NCP553SQ18T1
NCP553SQ25T1
NCP553SQ27T1
NCP553SQ28T1
NCP553SQ30T1
NCP553SQ33T1
NCP553SQ50T1
1.5
1.8
2.5
2.7
2.8
3.0
3.3
5.0
LBE
LBF
LBG
LBH
LBI
LBJ
LBK
LBL
NCP553SQ15T1G
NCP553SQ30T1G
1.5
3.0
LBE
LBJ
(Pb−Free)
NCV553SQ50T1 (Note 6)
5.0
LFT
SC82−AB
(SC70−4)
Device
Package
Shipping†
SC82 AB
SC82−AB
(SC70−4)
3000 Units/
8″ Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
5. Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative.
6. Automotive qualified.
NOCAP is a trademark of Semiconductor Components Industries, LLC.
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8
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−82AB
CASE 419C−02
ISSUE F
DATE 22 JUN 2012
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
3
4
K
B
S
1
2
H
J
F
L
0.05 (0.002)
0.90
0.035
0.70
0.028
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.008
0.016
0.012
0.020
0.043
0.059
0.000
0.004
0.004
0.010
0.004
−−−
0.002 BSC
0.008 REF
0.07
0.09
XXX M
G
0.65
0.026
0.95
0.037
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.20
0.40
0.30
0.50
1.10
1.50
0.00
0.10
0.10
0.26
0.10
−−−
0.05 BSC
0.20 REF
1.80
2.40
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
1.30
0.0512
DIM
A
B
C
D
F
G
H
J
K
L
N
S
1
XXX = Specific Device Code
M
= Month Code
G
= Pb−Free Package
1.90
0.075
SCALE 10:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ARB18939C
SC−82AB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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