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NCV8170AMX280TCG

NCV8170AMX280TCG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    XDFN4

  • 描述:

    IC REG LINEAR 2.8V 150MA 4XDFN

  • 数据手册
  • 价格&库存
NCV8170AMX280TCG 数据手册
DATA SHEET www.onsemi.com LDO Regulator Ultra‐Low IQ, CMOS 6 1 150 mA NCV8170 The NCV8170 series of CMOS low dropout regulators are designed specifically for continuous on battery-powered applications which require ultra-low quiescent current. The ultra-low consumption of typ. 500 nA ensures long battery life and dynamic transient boost feature improves device transient response for wireless communication applications. The device is available in small 1 × 1 mm xDFN4 and SOT−563 packages. Features • • • • • • • • • • • • 1 SOT−563 XV SUFFIX CASE 463A XDFN4 MX SUFFIX CASE 711AJ Operating Input Voltage Range: 2.2 V to 5.5 V Output Voltage Range: 1.2 V to 3.6 V (0.1 V Steps) Ultra-Low Quiescent Current Typ. 0.5 mA Low Dropout: 170 mV Typ. at 150 mA High Output Voltage Accuracy ±1% Stable with Ceramic Capacitors 1 mF Over-Current Protection Thermal Shutdown Protection NCV8170A for Active Discharge Option Available in Small 1 × 1 mm xDFN4 and SOT−563 Packages NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MARKING DIAGRAMS XDFN4 XX M 1 XX = Specific Device Code M = Date Code SOT−563 XX MG 1 XX = Specific Device Code M = Month Code G = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information on page 19 of this data sheet. Typical Applications • • • • Telematics and Infotainment Systems Automotive Keyless Entry Systems ADAS Camera Modules Navigation Systems VIN CIN IN 1 mF NCV8170 VOUT OUT COUT EN 1 mF GND Figure 1. Typical Application Schematic © Semiconductor Components Industries, LLC, 2015 September, 2022 − Rev. 7 1 Publication Order Number: NCV8170/D NCV8170 PIN FUNCTION DESCRIPTION Pin No. XDFN4 Pin No. SOT−563 Pin Name 4 1 IN 2 2 GND 3 6 EN 1 3 OUT Output Pin EPAD Internally Connected to GND EPAD Description Power Supply Input Voltage Power Supply Ground Chip Enable Pin (Active “H”) 4 NC No Connect 5 GND Power Supply Ground ABSOLUTE MAXIMUM RATINGS Symbol VIN Rating Input Voltage (Note 1) VOUT Output Voltage VCE Chip Enable Input TJ(MAX) TSTG Maximum Junction Temperature Storage Temperature Value Unit 6.0 V −0.3 to VIN + 0.3 V −0.3 to 6.0 V 125 °C −55 to 150 °C ESDHBM ESD Capability, Human Body Model (Note 2) 2000 V ESDMM ESD Capability, Machine Model (Note 2) 200 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 THERMAL CHARACTERISTICS Symbol RqJA Rating Value Thermal Characteristics, Thermal Resistance, Junction-to-Air XDFN4 1 × 1 mm SOT−563 Figure 2. Simplified Block Diagram www.onsemi.com 2 250 200 Unit °C/W NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.2 V (−40°C ≤ TJ ≤ 125°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 3) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 1.188 1.2 1.212 V −40°C ≤ TJ ≤ 125°C 1.176 1.2 1.224 Operating Input Voltage Output Voltage LineReg Line Regulation 2.5 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 2.5 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage (Note 4) − − − mV IOUT Output Current (Note 5) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 225 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pin Current VEN ≤ VIN ≤ 5.5 V (Note 6) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.2 V + 200 mVpp Modulation IOUT = 150 mA IOUT = 10 mA − − 57 63 − − VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA, f = 100 Hz to 1 MHz, COUT = 1 mF − 85 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 6) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 6) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 6) − 25 − °C IEN RLOW dB Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 4. Not Characterized at VIN = 2.2 V, VOUT = 1.2 V, IOUT = 150 mA. 5. Respect SOA. 6. Guaranteed by design and characterization. www.onsemi.com 3 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.5 V (−40°C ≤ TJ ≤ 125°C; VIN = 2.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 7) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 1.485 1.5 1.515 V −40°C ≤ TJ ≤ 125°C 1.470 1.5 1.530 Operating Input Voltage Output Voltage LineReg Line Regulation 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V − 0.05 0.20 %/V −20 − 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 8) − − − mV IOUT Output Current (Note 9) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 225 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pin Current VEN ≤ VIN ≤ 5.5 V (Note 10) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.5 V + 200 mVpp Modulation IOUT = 150 mA − 57 − VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA, f = 100 Hz to 1 MHz, COUT = 1 mF − 90 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 10) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 10) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 10) − 25 − °C IEN RLOW dB Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Not Characterized at VIN = 2.2 V, VOUT = 1.5 V, IOUT = 150 mA. 9. Respect SOA. 10. Guaranteed by design and characterization. www.onsemi.com 4 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 1.8 V (−40°C ≤ TJ ≤ 125°C; VIN = 2.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 11) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 1.782 1.8 1.818 V −40°C ≤ TJ ≤ 125°C 1.764 1.8 1.836 Operating Input Voltage Output Voltage LineReg Line Regulation 2.8 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 2.8 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 12) − 350 500 mV IOUT Output Current (Note 13) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 225 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 14) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 2.8 V + 200 mVpp Modulation IOUT = 150 mA − 57 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 95 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 14) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 14) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 14) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 11. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 12. Characterized when VOUT falls 54 mV below the regulated voltage and only for devices with VOUT = 1.8 V. 13. Respect SOA. 14. Guaranteed by design and characterization. www.onsemi.com 5 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.5 V (−40°C ≤ TJ ≤ 125°C; VIN = 3.5 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 15) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 2.475 2.5 2.525 V −40°C ≤ TJ ≤ 125°C 2.450 2.5 2.550 Operating Input Voltage Output Voltage LineReg Line Regulation 3.5 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 3.5 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 16) − 240 350 mV IOUT Output Current (Note 17) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 225 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 18) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 3.5 V + 200 mVpp Modulation IOUT = 150 mA − 57 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 125 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 18) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 18) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 18) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 15. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 16. Characterized when VOUT falls 75 mV below the regulated voltage and only for devices with VOUT = 2.5 V. 17. Respect SOA. 18. Guaranteed by design and characterization. www.onsemi.com 6 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 2.8 V (−40°C ≤ TJ ≤ 125°C; VIN = 3.8 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 19) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 2.772 2.8 2.828 V −40°C ≤ TJ ≤ 125°C 2.744 2.8 2.856 Operating Input Voltage Output Voltage LineReg Line Regulation 3.8 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 3.8 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 20) − 210 315 mV IOUT Output Current (Note 21) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 195 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 22) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 3.8 V + 200 mVpp Modulation IOUT = 150 mA − 40 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 125 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 22) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 22) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 22) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 19. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 20. Characterized when VOUT falls 84 mV below the regulated voltage and only for devices with VOUT = 2.8 V. 21. Respect SOA. 22. Guaranteed by design and characterization. www.onsemi.com 7 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V (−40°C ≤ TJ ≤ 125°C; VIN = 4.0 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 23) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 2.97 3.0 3.03 V −40°C ≤ TJ ≤ 125°C 2.94 3.0 3.06 Operating Input Voltage Output Voltage LineReg Line Regulation 4.0 V < VIN ≤ 5.5 V, IOUT = 1 mA − 0.05 0.20 %/V LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4 V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 24) − 190 260 mV IOUT Output Current (Note 25) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 195 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 26) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.0 V + 200 mVpp Modulation IOUT = 150 mA − 47 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 120 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 26) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 26) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 26) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 23. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 24. Characterized when VOUT falls 90 mV below the regulated voltage and only for devices with VOUT = 3.0 V. 25. Respect SOA. 26. Guaranteed by design and characterization. www.onsemi.com 8 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.3 V (−40°C ≤ TJ ≤ 125°C; VIN = 4.3 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 27) Symbol VIN VOUT Parameter Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 3.267 3.3 3.333 V −40°C ≤ TJ ≤ 125°C 3.234 3.3 3.366 Operating Input Voltage Output Voltage LineReg Line Regulation 4.3 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.3 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 28) − 180 250 mV IOUT Output Current (Note 29) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 195 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 30) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.3 V + 200 mVpp Modulation IOUT = 150 mA − 41 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 125 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 30) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 30) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 30) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 27. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 28. Characterized when VOUT falls 99 mV below the regulated voltage and only for devices with VOUT = 3.3 V. 29. Respect SOA. 30. Guaranteed by design and characterization. www.onsemi.com 9 NCV8170 ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.6 V (−40°C ≤ TJ ≤ 125°C; VIN = 4.6 V; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted. Typical values are at TA = +25°C.) (Note 31) Symbol Parameter VIN Test Conditions Min Typ Max Unit 2.2 − 5.5 V TA = +25°C 3.564 3.6 3.636 V −40°C ≤ TJ ≤ 125°C 3.528 3.6 3.672 Operating Input Voltage VOUT Output Voltage LineReg Line Regulation 4.6 V < VIN ≤ 5.5 V, IOUT = 1 mA LoadReg Load Regulation 0 mA < IOUT ≤ 150 mA, VIN = 4.6 V − 0.05 0.20 %/V −20 1 20 mV VDO Dropout Voltage IOUT = 150 mA (Note 32) − 170 240 mV IOUT Output Current (Note 33) 150 − − mA ISC Short Circuit Current Limit VOUT = 0 V − 195 − mA IQ Quiescent Current IOUT = 0 mA − 0.5 0.9 mA ISTB Standby Current VEN = 0 V, TJ = 25°C − 0.1 0.5 mA VENH EN Pin Threshold Voltage EN Input Voltage “H” 1.2 − − V VENL EN Pin Threshold Voltage EN Input Voltage “L” − − 0.4 V EN Pull Down Current VEN ≤ VIN ≤ 5.5 V (Note 34) − 10 − nA PSRR Power Supply Rejection Ratio f = 1 kHz, VIN = 4.6 V + 200 mVpp Modulation IOUT = 150 mA − 30 − dB VNOISE Output Noise Voltage VIN = 5.5 V, IOUT = 1 mA f = 100 Hz to 1 MHz, COUT = 1 mF − 130 − mVrms Active Output Discharge Resistance (A option only) VIN = 5.5 V, VEN = 0 V (Note 34) − 100 − W TSD Thermal Shutdown Temperature Temperature Increasing from TJ = +25°C (Note 34) − 175 − °C TSDH Thermal Shutdown Hysteresis Temperature Falling from TSD (Note 34) − 25 − °C IEN RLOW Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 31. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 32. Characterized when VOUT falls 108 mV below the regulated voltage and only for devices with VOUT = 3.6 V. 33. Respect SOA. 34. Guaranteed by design and characterization. TYPICAL CHARACTERISTICS 1.202 1.802 OUTPUT VOLTAGE (V) Vin = 5.5 V 1.198 Vin = 3.0 V Vin = 2.2 V 1.196 1.194 NCV8170xxx120TyG Cin = Cout = 1 mF Iout = 1 mA 1.192 1.190 −40 −20 0 20 40 60 80 100 1.800 OUTPUT VOLTAGE (V) 1.200 Vin = 5.5 V 1.798 Vin = 2.8 V 1.796 Vin = 3.5 V 1.794 NCV8170xxx180TyG Cin = Cout = 1 mF Iout = 1 mA 1.792 1.790 −40 −20 120 0 20 40 60 80 100 TEMPERATURE (°C) TEMPERATURE (°C) Figure 3. Output Voltage vs. Temperature, Vout = 1.2 V Figure 4. Output Voltage vs. Temperature, Vout = 1.8 V www.onsemi.com 10 120 NCV8170 TYPICAL CHARACTERISTICS 3.008 3.604 3.600 Vin = 5.5 V 3.000 2.996 Vin = 5.0 V Vin = 3.3 − 4.5 V 2.992 NCV8170xxx300TyG Cin = Cout = 1 mF Iout = 1 mA 2.988 2.984 −40 −20 0 20 40 80 60 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) 3.004 NCV8170xxx360TyG Cin = Cout = 1 mF Iout = 1 mA −20 0 20 40 60 100 80 TEMPERATURE (°C) Figure 5. Output Voltage vs. Temperature, Vout = 3.0 V Figure 6. Output Voltage vs. Temperature, Vout = 3.6 V 120 1.802 1.800 Vin = 3.0 V 1.197 Vin = 4.0 V 1.196 NCV8170xxx120TyG Cin = Cout = 1 mF TA = 25°C 1.195 0 20 40 60 Vin = 5.5 V 80 100 120 OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V) Vin = 2.5 V 1.198 Vin = 2.8 V 1.798 Vin = 4.0 V 1.796 Vin = 4.5 V 1.794 NCV8170xxx180TyG Cin = Cout = 1 mF TA = 25°C 1.792 1.790 140 0 20 40 60 Vin = 5.5 V 80 100 120 140 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 7. Output Voltage vs. Output Current, Vout = 1.2 V Figure 8. Output Voltage vs. Output Current, Vout = 1.8 V 3.002 3.599 Vin = 4.0 V 3.000 Vin = 4.5 V 2.999 Vin = 5.0 V 2.998 NCV8170xxx300TyG Cin = Cout = 1 mF TA = 25°C 2.997 0 20 40 60 3.598 OUTPUT VOLTAGE (V) 3.001 OUTPUT VOLTAGE (V) Vin = 3.8 − 4.5 V TEMPERATURE (°C) 1.199 2.996 Vin = 5.0 V 3.588 3.580 −40 1.200 1.194 3.592 3.584 120 100 Vin = 5.5 V 3.596 3.597 Vin = 4.3 V 3.596 Vin = 4.6 V 3.595 NCV8170xxx360TyG Cin = Cout = 1 mF TA = 25°C 3.594 Vin = 5.5 V 80 100 120 3.593 140 0 20 40 60 Vin = 5.0 V Vin = 5.5 V 80 100 120 140 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 9. Output Voltage vs. Output Current, Vout = 3.0 V Figure 10. Output Voltage vs. Output Current, Vout = 3.6 V www.onsemi.com 11 NCV8170 TYPICAL CHARACTERISTICS 350 NCV8170xxx180TyG Cin = Cout = 1 mF 400 TA = 125°C TA = 25°C 300 TA = −40°C 200 100 0 0 20 40 60 80 100 120 DROPOUT VOLTAGE (mV) DROPOUT VOLTAGE (mV) 500 150 TA = −40°C 100 50 0 20 40 60 80 100 120 140 Figure 11. Dropout Voltage vs. Output Current, Vout = 1.8 V Figure 12. Dropout Voltage vs. Output Current, Vout = 2.5 V NCV8170xxx300TyG Cin = Cout = 1 mF 250 TA = 125°C TA = 25°C 200 150 TA = −40°C 100 50 0 20 40 60 80 100 120 DROPOUT VOLTAGE (mV) 250 TA = 125°C NCV8170xxx360TyG Cin = Cout = 1 mF 200 TA = 25°C 150 100 TA = −40°C 50 0 140 0 20 40 60 80 100 120 140 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 13. Dropout Voltage vs. Output Current, Vout = 3.0 V Figure 14. Dropout Voltage vs. Output Current, Vout = 3.6 V 0.65 NCV8170xxx120TyG Cin = Cout = 1 mF Iout = 0 Vout = 1.2 V 0.60 0.55 0.50 Vin = 2.5 − 4.0 V 0.45 Vin = 5.0 V 0.40 0.35 −40 −20 0 20 40 60 80 100 0.60 0.55 Vin = 3.5 − 4.0 V 0.50 0.45 Vin = 5.0 V 0.40 0.35 −40 120 Vin = 5.5 V NCV8170xxx250TyG Cin = Cout = 1 mF Iout = 0 Vout = 2.5 V Vin = 5.5 V QUIESCENT CURRENT (mA) DROPOUT VOLTAGE (mV) 200 OUTPUT CURRENT (mA) 0.65 QUIESCENT CURRENT (mA) TA = 25°C OUTPUT CURRENT (mA) 300 0 TA = 125°C 250 0 140 NCV8170xxx250TyG Cin = Cout = 1 mF 300 −20 0 20 40 60 80 100 120 TEMPERATURE (°C) TEMPERATURE (°C) Figure 15. Quiescent Current vs. Temperature, Vout = 1.2 V Figure 16. Quiescent Current vs. Temperature, Vout = 2.5 V www.onsemi.com 12 NCV8170 TYPICAL CHARACTERISTICS 70 NCV8170xxx360TyG Cin = Cout = 1 mF Iout = 0 Vout = 3.6 V 0.60 0.55 Vin = 5.5 V GROUND CURRENT (mA) QUIESCENT CURRENT (mA) 0.65 Vin = 4.0 V 0.50 0.45 Vin = 5.0 V 0.40 0.35 −40 −20 0 20 40 60 80 100 20 10 0.01 80 NCV8170xxx250TyG Cin = Cout = 1 mF TA = 25°C Vout = 2.5 V 0.1 1 NCV8170xxx360TyG Cin = Cout = 1 mF TA = 25°C Vout = 3.6 V 70 Vin = 3.5 V Vin = 4.5 V Vin = 5.5 V 30 20 10 100 1000 60 Vin = 4.6 V Vin = 5.0 V 50 Vin = 5.5 V 40 30 20 10 10 0.01 0.1 1 10 100 0 1000 0.01 0.1 1 10 100 1000 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 19. Ground Current vs. Output Current, Vout = 2.5 V Figure 20. Ground Current vs. Output Current, Vout = 3.6 V 80 80 70 70 Iout = 1 mA Iout = 1 mA 60 60 10 mA 100 mA PSRR (dB) PSRR (dB) 30 Figure 18. Ground Current vs. Output Current, Vout = 1.2 V 40 50 Vin = 5.5 V 40 Figure 17. Quiescent Current vs. Temperature, Vout = 3.6 V 50 0 Vin = 3.5 V OUTPUT CURRENT (mA) GROUND CURRENT (mA) GROUND CURRENT (mA) 60 Vin = 2.5 V TEMPERATURE (°C) 80 70 50 0 120 NCV8170xxx120TyG Cin = Cout = 1 mF TA = 25°C Vout = 1.2 V 60 40 30 NCV8170xxx120TyG 20 Cout = 1 mF Vin = 2.2 V+ 200 mVpp modulation 10 TA = 25°C Vout = 1.2 V 0 100 1k 10k 150 mA 100k 1M 50 10 mA 100 mA 40 30 NCV8170xxx180TyG 20 Cout = 1 mF Vin = 2.8 V+ 200 mVpp modulation 10 TA = 25°C Vout = 1.8 V 0 100 1k 10k 150 mA 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 21. PSRR vs. Frequency, Vout = 1.2 V Figure 22. PSRR vs. Frequency, Vout = 1.8 V www.onsemi.com 13 1M NCV8170 TYPICAL CHARACTERISTICS 70 70 Iout = 1 mA 60 60 PSRR (dB) 50 40 30 NCV8170xxx300TyG Cout = 1 mF Vin = 4.0 V+ 200 mVpp modulation TA = 25°C Vout = 3.0 V 10 100 1k 10k OUTPUT VOLTAGE NOISE SPECTRAL DENSITY (mV/√Hz) 100k 1M 30 NCV8170xxx360TyG 20 Cout = 1 mF Vin = 4.6 V+ 200 mVpp modulation 10 TA = 25°C Vout = 3.6 V 0 100 1k 10k 150 mA 100k Figure 23. PSRR vs. Frequency, Vout = 3.0 V Figure 24. PSRR vs. Frequency, Vout = 3.6 V 2.0 NCV8170xxx120TyG Cin = Cout = 1 mF Vin = 5.5 V Vout = 1.2 V Iout = 1 mA TA = 25°C 1.0 0.8 0.6 0.4 0.2 10 100 1k 10k 100k 1M 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10 100 1k 10k 100k Figure 25. Output Voltage Noise Spectral Density, Vout = 1.2 V Figure 26. Output Voltage Noise Spectral Density, Vout = 1.8 V 3.0 2.5 2.0 4.0 1.5 1.0 0.5 10 1.6 FREQUENCY (Hz) NCV8170xxx300TyG Cin = Cout = 1 mF Vin = 5.5 V Vout = 3.0 V Iout = 1 mA TA = 25°C 100 1k 10k 100k 1M 1M NCV8170xxx360TyG Cin = Cout = 1 mF Vin = 5.5 V Vout = 3.6 V Iout = 1 mA TA = 25°C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 10 100 1k 10k 100k FREQUENCY (Hz) FREQUENCY (Hz) Figure 27. Output Voltage Noise Spectral Density, Vout = 3.0 V Figure 28. Output Voltage Noise Spectral Density, Vout = 3.6 V www.onsemi.com 14 1M NCV8170xxx180TyG Cin = Cout = 1 mF Vin = 5.5 V Vout = 1.8 V Iout = 1 mA TA = 25°C 1.8 FREQUENCY (Hz) 3.5 0 40 FREQUENCY (Hz) 1.2 0 10 mA 100 mA FREQUENCY (Hz) 1.4 OUTPUT VOLTAGE NOISE SPECTRAL DENSITY (mV/√Hz) 150 mA OUTPUT VOLTAGE NOISE SPECTRAL DENSITY (mV/√Hz) 20 OUTPUT VOLTAGE NOISE SPECTRAL DENSITY (mV/√Hz) PSRR (dB) 10 mA 100 mA 50 0 Iout = 1 mA 1M NCV8170 TYPICAL CHARACTERISTICS Figure 29. Load Transient Response at Load Step from 1 mA to 50 mA, Vout = 1.2 V Figure 30. Load Transient Response at Load Step from 0.1 mA to 50 mA, Vout = 1.2 V Figure 31. Load Transient Response at Load Step from 1 mA to 50 mA, Vout = 2.5 V Figure 32. Load Transient Response at Load Step from 0.1 mA to 50 mA, Vout = 2.5 V Figure 33. Load Transient Response at Load Step from 1 mA to 50 mA, Vout = 3.0 V Figure 34. Load Transient Response at Load Step from 0.1 mA to 50 mA, Vout = 3.0 V www.onsemi.com 15 NCV8170 TYPICAL CHARACTERISTICS Figure 35. Load Transient Response at Load Step from 1mA to 50 mA, Vout= 3.6 V Figure 36. Load Transient Response at Load Step from 0.1 mA to 50 mA, Vout = 3.6 V Figure 37. Output Voltage With and Without Active Discharge Feature, Vout = 1.2 V Figure 38. Output Voltage With and Without Active Discharge Feature, Vout = 2.5 V Figure 39. Output Voltage With and Without Active Discharge Feature, Vout = 3.0 V Figure 40. Output Voltage With and Without Active Discharge Feature, Vout = 3.6 V www.onsemi.com 16 NCV8170 TYPICAL CHARACTERISTICS Figure 41. Enable Turn−on Response at Vout = 1.2 V Figure 42. Enable Turn−on Response at Vout = 2.5 V Figure 43. Enable Turn−on Response at Vout = 3.6 V www.onsemi.com 17 NCV8170 APPLICATIONS INFORMATION General circuitry is switched off and the desired output voltage is available at output pin. In case the Enable function is not required the EN pin should be connected directly to input pin. The NCV8170 is a high performance 150 mA Linear Regulator with Ultra Low IQ. This device delivers low Noise and high Power Supply Rejection Ratio with excellent dynamic performance due to employing the Dynamic Quiescent Current adjustment which assure ultra low IQ consumption at no – load state. These parameters make this device very suitable for various battery powered applications. Thermal Shutdown When the die temperature exceeds the Thermal Shutdown point (TSD = 175°C typical) the device goes to disabled state and the output voltage is not delivered until the die temperature decreases to 150°C. The Thermal Shutdown feature provides a protection from a catastrophic device failure at accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Input Decoupling (CIN) It is recommended to connect at least a 1 mF Ceramic X5R or X7R capacitor between IN and GND pins of the device. This capacitor will provide a low impedance path for any unwanted AC signals or Noise superimposed onto constant Input Voltage. The good input capacitor will limit the influence of input trace inductances and source resistance during sudden load current changes. Higher capacitance and lower ESR Capacitors will improve the overall line transient response. Power Dissipation and Heat sinking The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCV8170 device can handle is given by: Output Decoupling (COUT) The NCV8170 does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. The device is designed to be stable with standard ceramics capacitors with values of 1.0 mF or greater up to 10 mF. The X5R and X7R types have the lowest capacitance variations over temperature thus they are recommended. There is recommended connect the output capacitor as close as possible to the output pin of the regulator. P D(MAX) + ƪTJ(MAX) * TAƫ R qJA (eq. 1) The power dissipated by the NCV8170 device for given application conditions can be calculated from the following equations: P D [ V INǒI GND(I OUT)Ǔ ) I OUTǒV IN * V OUTǓ (eq. 2) or Enable Operation The NCV8170 uses the EN pin to enable /disable its device and to activate /deactivate the active discharge function at devices with this feature. If the EN pin voltage is pulled below 0.4 V the device is guaranteed to be disable. The active discharge transistor at the devices with Active Discharge Feature is activated and the output voltage VOUT is pulled to GND through an internal circuitry with effective resistance about 100 ohms. If the EN pin voltage is higher than 1.2 V the device is guaranteed to be enabled. The internal active discharge V IN(MAX) [ P D(MAX) ) ǒV OUT I OUT ) I GND I OUTǓ (eq. 3) Hints VIN and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV8170, and make traces as short as possible. www.onsemi.com 18 NCV8170 ORDERING INFORMATION Nominal Output Voltage Marking NCV8170AMX120TCG (Note 35) 1.2 CC NCV8170AMX150TCG (Note 35) 1.5 CJ NCV8170AMX180TCG (Note 35) 1.8 CD NCV8170AMX250TCG (Note 35) 2.5 CE NCV8170AMX280TCG (Note 35) 2.8 CF NCV8170AMX300TCG (Note 35) 3.0 CA NCV8170AMX310TCG 3.1 CN NCV8170AMX330TCG (Note 35) 3.3 CG NCV8170AMX360TCG (Note 35) 3.6 CM NCV8170BMX120TCG (Note 35) 1.2 3C NCV8170BMX150TCG (Note 35) 1.5 3J NCV8170BMX180TCG (Note 35) 1.8 3D NCV8170BMX250TCG (Note 35) 2.5 3E NCV8170BMX280TCG (Note 35) 2.8 3F NCV8170BMX300TCG 3.0 3A NCV8170BMX310TCG (Note 35) 3.1 3Y NCV8170BMX330TCG (Note 35) 3.3 3G NCV8170BMX360TCG (Note 35) 3.6 3M NCV8170AXV120T2G 1.2 CC NCV8170AXV150T2G 1.5 CJ NCV8170AXV180T2G 1.8 CD NCV8170AXV250T2G 2.5 CE NCV8170AXV280T2G 2.8 CF NCV8170AXV300T2G 3.0 CA NCV8170AXV310T2G 3.1 CN NCV8170AXV330T2G 3.3 CG NCV8170AXV360T2G 3.6 CM NCV8170BXV120T2G 1.2 3C NCV8170BXV150T2G 1.5 3J NCV8170BXV180T2G 1.8 3D NCV8170BXV250T2G 2.5 3E NCV8170BXV280T2G 2.8 3F NCV8170BXV300T2G 3.0 3A NCV8170BXV310T2G 3.1 3Y NCV8170BXV330T2G 3.3 3G NCV8170BXV360T2G 3.6 3N Device Active Discharge Package Shipping† XDFN4 1.0 x 1.0 (Pb−Free) 3000 or 5000 / Tape & Reel (Note 35) SOT − 563 (Pb−Free) 4000 / Tape & Reel Yes No Yes No †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 35. Products processed after October 1, 2022 are shipped with quantity 5000 units / tape & reel. www.onsemi.com 19 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A ISSUE H 6 1 SCALE 4:1 DOCUMENT NUMBER: DESCRIPTION: 98AON11126D SOT−563, 6 LEAD DATE 26 JAN 2021 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOT−563, 6 LEAD CASE 463A ISSUE H DATE 26 JAN 2021 GENERIC MARKING DIAGRAM* XX MG 1 XX = Specific Device Code M = Month Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON11126D SOT−563, 6 LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS XDFN4 1.0x1.0, 0.65P CASE 711AJ ISSUE C GENERIC MARKING DIAGRAM* XX M 1 DOCUMENT NUMBER: DESCRIPTION: XX = Specific Device Code M = Date Code 98AON67179E XDFN4, 1.0X1.0, 0.65P DATE 08 MAR 2022 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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