NCV8664

NCV8664 Ultra−Low Iq Low Dropout Linear Regulator The NCV8664 is a precision 5.0 V fixed output, low dropout integrated voltage regulator with an output current capability of 150 mA. Careful management of light load current consumption, combined with a low leakage process, achieve a typical quiescent current of 22 mA. NCV8664 is pin and functionally compatible with NCV4264 and NCV4264−2, and it could replace these parts when very low quiescent current is required. The output voltage is accurate within "2.0%, and maximum dropout voltage is 600 mV at full rated load current. It is internally protected against input supply reversal, output overcurrent faults, and excess die temperature. No external components are required to enable these features. Features http://onsemi.com MARKING DIAGRAMS TAB 1 2 3 SOT−223 ST SUFFIX CASE 318E AYM V6645 1 1 DPAK DT SUFFIX CASE 369C V66450G ALYWW 4 12 • • • • • • • • • 5.0 V Fixed Output "2.0% Output Accuracy, Over Full Temperature Range 30 mA Maximum Quiescent Current at IOUT = 100 mA 600 mV Maximum Dropout Voltage at 150 mA Load Current Wide Input Voltage Operating Range of 5.5 V to 45 V Internal Fault Protection ♦ −42 V Reverse Voltage ♦ Short Circuit/Overcurrent ♦ Thermal Overload NCV Prefix for Automotive and Other Applications Requiring Site and Control Changes AEC−Q100 Qualified This is a Pb−Free Device 3 A L Y WW M G = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb−Free Package PIN CONNECTIONS PIN 1 2, TAB 3 FUNCTION VIN GND VOUT ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 1 1 Publication Order Number: NCV8664/D NCV8664 IN Bias Current Generators 1.3 V Reference OUT + Error Amp − Thermal Shutdown GND Figure 1. Block Diagram PIN FUNCTION DESCRIPTION Pin No. 1 2 3 TAB Symbol VIN GND VOUT GND Unregulated input voltage; 5.5 V to 45 V. Ground; substrate. Regulated output voltage; collector of the internal PNP pass transistor. Ground; substrate and best thermal connection to the die. Function OPERATING RANGE Pin Symbol, Parameter VIN, DC Input Operating Voltage Junction Temperature Operating Range Symbol VIN TJ Min 5.5 −40 Max +45 +150 Unit V _C MAXIMUM RATINGS Rating VIN, DC Voltage VOUT, DC Voltage Storage Temperature ESD Capability, Human Body Model (Note 1) ESD Capability, Machine Model (Note 1) Symbol VIN VOUT Tstg VESDHB VESDMIM Min −42 −0.3 −55 4000 200 Max +45 +16 +150 − − Unit V V _C V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series incorporates ESD protection and is tested by the following methods: ESD HBM tested per AEC−Q100−002 (EIA/JESD22−A 114C) ESD MM tested per AEC−Q100−003 (EIA/JESD22−A 115C) Thermal Resistance Parameter Junction−to−Ambient Junction−to−Ambient Junction−to−Case Junction−to−Case 2. 1 oz., 100 mm2 copper area. DPAK SOT−223 DPAK SOT−223 Symbol RqJA RqJA RqJC RqJC Condition Min − − − − Max 101 (Note 2) 99 (Note 2) 9.0 17 Unit °C/W °C/W °C/W °C/W http://onsemi.com 2 NCV8664 Lead Soldering Temperature and MSL Rating Lead Temperature Soldering Reflow (SMD Styles Only), Lead Free (Note 3) Moisture Sensitivity Level SOT223 DPAK 3. Lead Free, 60 sec – 150 sec above 217_C, 40 sec max at peak. Symbol Tsld MSL 1 1 − − Min − Max 265 pk Unit _C − ELECTRICAL CHARACTERISTICS (VIN = 13.5 V, Tj = −40_C to +150_C, unless otherwise noted.) Characteristic Output Voltage Symbol VOUT DVOUT vs. VIN DVOUT vs. IOUT VIN−VOUT Iq Test Conditions 0.1 mA v IOUT v 150 mA (Note 4) 6.0 V v VIN v 28 V IOUT = 5.0 mA 6.0 V v VIN v 28 V 1.0 mA v IOUT v 150 mA (Note 4) IQ = 100 mA (Notes 4 & 5) IQ = 150 mA (Notes 4 & 5) IOUT = 100 mA TJ = 25_C TJ = −40_C to +85_C IOUT = 50 mA (Note 4) IOUT = 150 mA (Note 4) VRIPPLE = 0.5 VP−P, F = 100 Hz IOUT = 0.1 mA to 150 mA (Note 4) Min 4.900 Typ 5.000 Max 5.100 Unit V Line Regulation Load Regulation Dropout Voltage Quiescent Current −25 −35 − 5.0 5.0 265 315 21 22 1.3 8.0 TBD − − +25 +35 500 600 29 30 3 15 − − 9.0 mV mV mV mA − − − − − 10 − Active Ground Current Power Supply Rejection Output Capacitor for Stability PROTECTION Current Limit Short Circuit Current Limit Thermal Shutdown Threshold IG(ON) PSRR COUT ESR mA %/V mF W IOUT(LIM) IOUT(SC) TTSD VOUT = 4.5 V (Note 4) VOUT = 0 V (Note 4) (Note 9) 150 100 150 − − − 500 500 200 mA mA _C 4. Use pulse loading to limit power dissipation. 5. Dropout voltage = (VIN–VOUT), measured when the output voltage has dropped 100 mV relative to the nominal value obtained with VIN = 13.5 V. 6. Not tested in production. Limits are guaranteed by design. 5.5−45 V Input II CI1 1.0 mF 100 nF Vin 1 8664 2 GND 3 Vout IQ COUT 10 mF Output RL Figure 2. Measurement Circuit 5.5−45 V Input Vin Cin 100 nF 1 8664 2 GND 3 Vout COUT 10 mF 5.0 V Output Figure 3. Applications Circuit http://onsemi.com 3 NCV8664 Typical Curves 1000 100 10 1.0 0.1 Stable Region 0.01 0 20 40 60 80 100 120 Vin = 13.5 V 140 160 180 Maximum ESR Cout = 10, 22 mF OUTPUT VOLTAGE (V) 6.0 5.0 4.0 3.0 2.0 1.0 0 ESR (W) 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 LOAD CURRENT (mA) INPUT VOLTAGE (V) Figure 4. ESR Characterization 9.0 QUIESCENT CURRENT (mA) 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 50 100 150 200 Vin = 13.5 V 0.40 QUIESCENT CURRENT (mA) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0 0 Figure 5. Output Voltage vs. Input Voltage 125°C 25°C −40°C Vin = 13.5 V 125°C 25°C −40°C 5.0 10 15 20 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) Figure 6. Current Consumption vs. Output Load 45 QUIESCENT CURRENT (mA) QUIESCENT CURRENT (mA) 40 35 30 25 20 15 10 5.0 0 −50 0 50 TEMPERATURE (°C) 100 150 Vin = 13.5 V Iout = 100 mA 12 Figure 7. Current Consumption vs. Output Load (Low Load) Vin = 13.5 V 10 Iout = 150 mA 8.0 6.0 4.0 2.0 0 −50 Iout = 100 mA 0 50 TEMPERATURE (°C) 100 150 Figure 8. Quiescent Current vs. Temperature Figure 9. Quiescent Current vs. Temperature http://onsemi.com 4 NCV8664 Typical Curves 0.45 CURRENT CONSUMPTION (mA) 0.40 0.35 DROPOUT (V) 0.30 0.25 0.20 0.15 0.10 0.05 0 0 50 100 OUTPUT LOAD (mA) 150 200 25°C −40°C 125°C 18 16 14 12 10 8.0 6.0 4.0 2.0 0 0 10 RL = 100 W 20 30 40 50 RL = 50 W INPUT VOLTAGE (V) Figure 10. Dropout Voltage vs. Output Load 160 140 OUTPUT CURRENT (mA) 120 100 80 60 40 20 0 0 10 20 30 40 50 TA = 125°C TA = 25°C OUTPUT VOLTAGE (V) 5.10 5.08 5.06 5.04 5.02 5.00 4.98 4.96 4.94 4.92 4.90 −50 Figure 11. Current Consumption vs. Input Voltage Vin = 13.5 V Load = 10 mA 0 50 TEMPERATURE (°C) 100 150 INPUT VOLTAGE (V) Figure 12. Output Current vs. Input Voltage Figure 13. Output Voltage vs. Temperature 400 350 OUTPUT CURRENT (mA) 300 250 200 150 100 50 0 −50 0 50 TEMPERATURE (°C) 100 150 Vin = 13.5 V Figure 14. Current Limit vs. Temperature http://onsemi.com 5 NCV8664 Circuit Description The NCV8664 is a precision trimmed 5.0 V fixed output regulator. Careful management of light load consumption combined with a low leakage process results in a typical quiescent current of 22 mA. The device has current capability of 150 mA, with 600 mV of dropout voltage at full rated load current. The regulation is provided by a PNP pass transistor controlled by an error amplifier with a bandgap reference. The regulator is protected by both current limit and short circuit protection. Thermal shutdown occurs above 150°C to protect the IC during overloads and extreme ambient temperatures. Regulator Calculating Power Dissipation in a Single Output Linear Regulator The maximum power dissipation for a single output regulator (Figure 3) is: PD(max) + [VIN(max) * VOUT(min)] @ IQ(max) ) VI(max) @ Iq (eq. 1) The error amplifier compares the reference voltage to a sample of the output voltage (Vout) and drives the base of a PNP series pass transistor by a buffer. The reference is a bandgap design to give it a temperature−stable output. Saturation control of the PNP is a function of the load current and input voltage. Over saturation of the output power device is prevented, and quiescent current in the ground pin is minimized. Regulator Stability Considerations Where: VIN(max) is the maximum input voltage, VOUT(min) is the minimum output voltage, IQ(max) is the maximum output current for the application, and Iq is the quiescent current the regulator consumes at IQ(max). Once the value of PD(Max) is known, the maximum permissible value of RqJA can be calculated: PqJA + 150 oC * TA PD (eq. 2) The input capacitor CIN1 in Figure 2 is necessary for compensating input line reactance. Possible oscillations caused by input inductance and input capacitance can be damped by using a resistor of approximately 1 W in series with CIN2. The output or compensation capacitor, COUT helps determine three main characteristics of a linear regulator: startup delay, load transient response and loop stability. The capacitor value and type should be based on cost, availability, size and temperature constraints. Tantalum, aluminum electrolytic, film, or ceramic capacitors are all acceptable solutions, however, attention must be paid to ESR constraints. The aluminum electrolytic capacitor is the least expensive solution, but, if the circuit operates at low temperatures (−25°C to −40°C), both the value and ESR of the capacitor will vary considerably. The capacitor manufacturer’s data sheet usually provides this information. The value for the output capacitor COUT shown in Figure 2 should work for most applications; however, it is not necessarily the optimized solution. Stability is guaranteed at values COUT ≥ 10 mF and an ESR ≤ 9 W within the operating temperature range. Actual limits are shown in a graph in the Typical Performance Characteristics section. The value of RqJA can then be compared with those in the package section of the data sheet. Those packages with RqJA’s less than the calculated value in Equation 2 will keep the die temperature below 150°C. In some cases, none of the packages will be sufficient to dissipate the heat generated by the IC, and an external heat sink will be required. The current flow and voltages are shown in the Measurement Circuit Diagram. Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of RqJA: RqJA + RqJC ) RqCS ) RqSA (eq. 3) Where: RqJC = the junction−to−case thermal resistance, RqCS = the case−to−heat sink thermal resistance, and RqSA = the heat sink−to−ambient thermal resistance. RqJA appears in the package section of the data sheet. Like RqJA, it too is a function of package type. RqCS and RqSA are functions of the package type, heat sink and the interface between them. These values appear in data sheets of heat sink manufacturers. Thermal, mounting, and heat sinking are discussed in the ON Semiconductor application note AN1040/D, available on the ON Semiconductor Website. http://onsemi.com 6 NCV8664 120 100 80 60 40 20 0 SOT223 DPAK qJA (°C/W) 0 100 200 300 400 500 600 700 COPPER AREA (mm2) Figure 15. qJA vs. Copper Spreader Area 100 SOT223 10 R(t) (°C/W) DPAK 1.0 0.1 0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 PULSE TIME (sec) Figure 16. Single−Pulse Heating Curves ORDERING INFORMATION Device NCV8664DT50RKG NCV8664ST50T3G Marking V66450G V6645 Package DPAK SOT−223 Shipping† 2500/T ape & Reel 4000/T ape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 7 NCV8664 PACKAGE DIMENSIONS SOT−223 (TO−261) ST SUFFIX CASE 318E−04 ISSUE L D b1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. MILLIMETERS NOM MAX 1.63 1.75 0.06 0.10 0.75 0.89 3.06 3.20 0.29 0.35 6.50 6.70 3.50 3.70 2.30 2.40 0.94 1.05 1.75 2.00 7.00 7.30 10 ° − INCHES NOM 0.064 0.002 0.030 0.121 0.012 0.256 0.138 0.091 0.037 0.069 0.276 − 4 HE 1 2 3 E e1 b e A q L1 C DIM A A1 b b1 c D E e e1 L1 HE q MIN 1.50 0.02 0.60 2.90 0.24 6.30 3.30 2.20 0.85 1.50 6.70 0° MIN 0.060 0.001 0.024 0.115 0.009 0.249 0.130 0.087 0.033 0.060 0.264 0° MAX 0.068 0.004 0.035 0.126 0.014 0.263 0.145 0.094 0.041 0.078 0.287 10 ° 0.08 (0003) A1 SOLDERING FOOTPRINT* 3.8 0.15 2.0 0.079 2.3 0.091 2.3 0.091 6.3 0.248 2.0 0.079 1.5 0.059 mm inches SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NCV8664 PACKAGE DIMENSIONS DPAK (Single Gauge) DT SUFFIX CASE 369C ISSUE O −T− B V R 4 SEATING PLANE C E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 −−− 0.035 0.050 0.155 −−− MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 −−− 0.89 1.27 3.93 −−− S A 1 2 3 Z U K F L D G 2 PL J H 0.13 (0.005) M T RECOMMENDED FOOTPRINT 6.20 0.244 3.0 0.118 2.58 0.101 5.80 0.228 1.6 0.063 6.172 0.243 SCALE 3:1 mm inches ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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