NCV876950D250R2G

NCV8769 Ultra Low Iq 150 mA LDO Regulator with Reset and Early Warning The NCV8769 is 150 mA LDO regulator with integrated reset and early warning functions dedicated for microprocessor applications. Its robustness allows NCV8769 to be used in severe automotive environments. Ultra low quiescent current as low as 25 mA typical for NCV8769 makes it suitable for applications permanently connected to battery requiring ultra low quiescent current with or without load. The NCV8769 contains protection functions as current limit, thermal shutdown and reverse output current protection. Features • • • • • • • • • http://onsemi.com MARKING DIAGRAMS 14 14 1 Output Voltage Options: 5 V Output Voltage Accuracy: $2% Output Current up to 150 mA Ultra Low Quiescent Current: − typ 25 mA for Adjustable Early Warning Threshold Option Very Low Dropout Voltage Microprocessor Compatible Control Functions: − Reset with Adjustable Power−on Delay − Early Warning Wide Input Voltage Operation Range: up to 40 V Protection Features: − Current Limitation − Thermal Shutdown These are Pb−Free Devices Y Z XX A WL Y WW G SO−14 D SUFFIX CASE 751A V8769YZXXG AWLYWWG 1 = Timing and Reset Threshold Option* = Early Warning Option* = Voltage Option 5.0 V (XX = 50) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *See Application Information Section. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 13 of this data sheet. Typical Applications • • • • Body Control Module Instruments and Clusters Occupant Protection and Comfort Powertrain VBAT Cin 0.1 mF RSI2 RSI1 Vout Vin SI NCV8769y0 VDD Cout 1 mF Microprocessor DT GND SO I/O RO RESET Figure 1. Application Circuit © Semiconductor Components Industries, LLC, 2011 June, 2011 − Rev. 1 1 Publication Order Number: NCV8769/D NCV8769 Vin Vout ** ** Driver with Current Limit RO Thermal Shutdown Vref TIMING CIRCUIT and RESET OUTPUT DRIVER and SENSE OUTPUT DRIVER SO SI DT V ref * GND *Pull−down Resistor (~150 kW) active only in Reset State. ** 5 V option only. Figure 2. Simplified Block Diagram http://onsemi.com 2 NCV8769 NC 1 14 SI Vin DT GND GND GND GND GND GND GND Vout SO RO SO−14 Figure 3. Pin Connections (Top View) PIN FUNCTION DESCRIPTION Pin No. Pin Name 1 NC Not connected Description 2 DT Reset Delay Time Select. Short to GND or connect to Vout to select time. 3, 4, 5, 6, 10, 11, 12 GND 7 RO Reset Output. 30 kW internal Pull−Up resistor connected to Vout. RO goes Low when Vout drops by more than 7% (typ.) from its nominal value. 8 SO Early Warning Output. 30 kW internal Pull−Up resistor connected to Vout. It can be used to provide early warning of an impending reset condition. Leave open if not used. 9 Vout Regulated Output Voltage. Connect 1 mF capacitor with ESR < 100 W to ground. 13 Vin Positive Power Supply Input. Connect 0.1 mF capacitor to ground. 14 SI Sense Input; If not used, connect to Vout. See Electrical Characteristics Table and Application Information sections for more information. Power Supply Ground. http://onsemi.com 3 NCV8769 ABSOLUTE MAXIMUM RATINGS Symbol Min Max Unit Input Voltage DC (Note 1) Rating Vin −0.3 40 V Input Voltage Transient (Note 1) Vin − 45 V Input Current Iin −5 − mA Output Voltage (Note 2) Vout −0.3 5.5 V Output Current Iout −3 Current Limited mA DT (Reset Delay Time Select) Voltage VDT −0.3 5.5 V DT (Reset Delay Time Select) Current IDT −1 1 mA Reset Output Voltage VRO −0.3 5.5 V Reset Output Current IRO −3 3 mA Sense Input Voltage DC VSI −0.3 40 V Sense Input Voltage Transient VSI − 45 V Sense Input Current ISI −1 1 mA Sense Output Voltage VSO −0.3 5.5 V Sense Output Current ISO −3 3 mA TJ(max) −40 150 °C TSTG −55 150 °C ESD Capability, Human Body Model (Note 3) ESDHBM −2 2 kV ESD Capability, Machine Model (Note 3) ESDMM −200 200 V TSLD − 265 peak °C Maximum Junction Temperature Storage Temperature Lead Temperature Soldering Reflow (SMD Styles Only) (Note 4) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 2. 5.5 or (Vin + 0.3 V), whichever is lower 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) 4. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D http://onsemi.com 4 NCV8769 THERMAL CHARACTERISTICS Rating Symbol Thermal Characteristics, SO−14 (Note 5) Thermal Resistance, Junction−to−Air (Note 6) Thermal Reference, Junction−to−Pin4 (Note 6) Value Unit °C/W 94 18 RθJA YψJP4 5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. OPERATING RANGES (Note 7) Rating Symbol Min Max Unit Input Voltage (Note 8) Vin 5.5 40 V Junction Temperature TJ −40 150 °C 7. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area. 8. Minimum Vin = 5.5 V or (Vout + VDO), whichever is higher. ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VDT = GND, VSI = Vout, RSI1 & RSI2 not used, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values TJ = −40 °C to 150°C; unless otherwise noted. (Notes 9 and 10) Test Conditions Parameter Symbol Min Typ Max Unit 4.9 4.9 (−2 %) 5.0 5.0 5.1 5.1 (+2%) V 4.9 (−2 %) 5.0 5.1 (+2%) REGULATOR OUTPUT Output Voltage (Accuracy %) Vin = 5.6 V to 40 V, Iout = 0.1 mA to 100 mA Vin = 5.8 V to 16 V, Iout = 0.1 mA to 150 mA Vout Output Voltage (Accuracy %) TJ = −40°C to 125°C Vin = 5.8 V to 28 V, Iout = 0 mA to 150 mA Vout Line Regulation Vin = 6 V to 28 V, Iout = 5 mA Regline −20 0 20 mV Load Regulation Iout = 0.1 mA to 150 mA Regload −40 10 40 mV Dropout Voltage (Note 11) Iout = 100 mA Iout = 150 mA VDO − − 225 300 450 600 mV Output Capacitor for Stability (Note 12) Iout = 0 mA to 150 mA Cout ESR 1.0 0.01 − − 100 100 mF W Iq − − 25 − 31 33 mA V QUIESCENT CURRENTS Quiescent Current, Iq = Iin − Iout Iout = 0.1 mA, TJ = 25°C Iout = 0.1 mA to 150 mA, TJ ≤ 125°C CURRENT LIMIT PROTECTION Current Limit Vout = 0.96 x Vout_nom ILIM 205 − 525 mA Short Circuit Current Limit Vout = 0 V ISC 205 − 525 mA PSRR − 60 − dB − 2 − − 0.8 − − − 1 PSRR Power Supply Ripple Rejection (Note 12) f = 100 Hz, 0.5 Vpp DT (Reset Delay Time Select) DT Threshold Voltage DT Input Current Vth(DT) Logic Low Logic High VDT = 5 V IDT V μA 9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V. 12. Values based on design and/or characterization. 13. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options. http://onsemi.com 5 NCV8769 ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VDT = GND, VSI = Vout, RSI1 & RSI2 not used, Cin = 0.1 mF, Cout = 1 mF, for typical values TJ = 25°C, for min/max values TJ = −40 °C to 150°C; unless otherwise noted. (Notes 9 and 10) Parameter Test Conditions Symbol Min Typ Max Unit 90 93 96 VRH − 2.0 − %Vout IROmax 1.75 − − mA VROL − 0.15 0.25 V Reset Output High Voltage VROH 4.5 − − V Integrated Reset Pull Up Resistor RRO 15 30 50 kW tRD 12.8 25.6 16 32 19.2 38.4 ms tRR 16 25 38 μs 1.25 1.20 1.33 1.25 1.40 1.33 ISI −1 0.1 1 μA RSO 15 30 50 kW VSOL − 0.15 0.25 V VSOH 4.5 − − V 1.75 − − RESET OUTPUT RO Output Voltage Reset Threshold (Note 13) Vout decreasing Vin > 5.5 V VRT Reset Hysteresis Maximum Reset Sink Current Vout = 4.5 V, VRO = 0.25 V Reset Output Low Voltage Vout > 1 V, IRO < 200 mA Reset Delay Time (Note 13) DT connected to GND DT connected to Vout Reset Reaction Time (see Figure 29) %Vout EARLY WARNING (SI and SO) Sense Input Threshold (NCV8769y0) VSI(th) High Low Sense Input Current (NCV8769y0) VSI = 5 V Integrated Sense Output Pull Up Resistor Sense Output Low Voltage VSI < 1.2 V, ISO < 200 mA, Vout > 1 V Sense Output High Voltage ISOmax V Maximum Sense Output Sink Current Vout = 4.5 V, VSI < 1.2 V, VSO = 0.25 V mA SI High to SO High Reaction Time VSI increasing tPSOLH − 7 12 μs SI Low to SO Low Reaction Time VSI decreasing tPSOHL − 3.8 5.0 μs Thermal Shutdown Temperature (Note 12) TSD 150 175 195 °C Thermal Shutdown Hysteresis (Note 12) TSH − 25 − °C THERMAL SHUTDOWN 9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area. 10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V. 12. Values based on design and/or characterization. 13. See APPLICATION INFORMATION section for Reset Thresholds and Reset Delay Time Options. http://onsemi.com 6 NCV8769 TYPICAL CHARACTERISTICS 300 Vin = 13.2 V Iout = 100 mA 29 28 Iq, QUIESCENT CURRENT (mA) Iq, QUIESCENT CURRENT (mA) 30 27 26 25 24 23 22 21 20 −40 −20 0 20 40 60 80 150 100 50 5 10 15 20 25 35 Figure 4. Quiescent Current vs. Temperature Figure 5. Quiescent Current vs. Input Voltage 5.10 Vout, OUTPUT VOLTAGE (V) 28 TJ = 150°C 27 26 TJ = −40°C 25 TJ = 25°C 24 23 22 21 Vin = 13.2 V 20 0 25 50 75 100 125 5.05 5.00 4.95 4.90 −40 −20 150 0 20 40 60 80 100 120 140 160 Iout, OUTPUT CURRENT (mA) TJ, JUNCTION TEMPERATURE (°C) Figure 6. Quiescent Current vs. Output Current Figure 7. Output Voltage vs. Temperature 6 500 Iout = 1.0 mA 5 4 3 TJ = 25°C 2 1 TJ = −40°C TJ = 150°C 0 1 2 3 4 5 6 7 40 Vin = 13.2 V Iout = 100 mA 29 0 30 Vin, INPUT VOLTAGE (V) VDO, DROPOUT VOLTAGE (mV) Iq, QUIESCENT CURRENT (mA) 200 TJ, JUNCTION TEMPERATURE (°C) 30 Vout, OUTPUT VOLTAGE (V) 250 0 0 100 120 140 160 Iout = 0 mA TJ = 25°C 400 TJ = 25°C 200 100 0 0 8 TJ = 150°C 300 TJ = −40°C 25 50 75 100 125 Vin, INPUT VOLTAGE (V) Iout, OUTPUT CURRENT (mA) Figure 8. Output Voltage vs. Input Voltage Figure 9. Dropout vs. Output Current http://onsemi.com 7 150 NCV8769 TYPICAL CHARACTERISTICS 400 400 ILIM, ISC, CURRENT LIMIT (mA) VDO, DROPOUT VOLTAGE (mV) 500 Iout = 150 mA 300 Iout = 100 mA 200 100 0 −40 −20 0 20 40 60 80 ILIM @ Vout = 4.8 V 200 100 0 5 10 15 20 25 30 35 TJ, JUNCTION TEMPERATURE (°C) Vin, INPUT VOLTAGE (V) Figure 10. Dropout vs. Temperature Figure 11. Output Current Limit vs. Input Voltage 400 100 Vin = 13.2 V ESR, STABILITY REGION (W) ILIM, ISC, CURRENT LIMIT (mA) 300 0 100 120 140 160 TJ = 25°C ISC @ Vout = 0 V 350 ISC @ Vout = 0 V 300 ILIM @ Vout = 4.8 V 250 200 −40 −20 0 20 40 60 80 Vin = 13.2 V TJ = −40°C to 150°C Cout = 1 mF − 100 mF 10 STABLE REGION 1 0.1 0.01 100 120 140 160 40 0 50 100 150 200 250 300 350 TJ, JUNCTION TEMPERATURE (°C) Iout, OUTPUT CURRENT (mA) Figure 12. Output Current Limit vs. Temperature Figure 13. Cout ESR Stability vs. Output Current TJ = 25°C Iout = 1 mA Cout = 10 mF trise/fall = 1 ms (Vin) 14.2 V Vin (1 V/div) 13 V TJ = 25°C Vin = 13.2 V Cout = 10 mF trise/fall = 1 ms (Iout) 150 mA Iout (100 mA/div) 12.2 V 0.1 mA 5.08 V 5.15 V Vout (50 mV/div) Vout (200 mV/div) 5V 5V 4.97 V 4.79 V TIME (20 ms/div) TIME (500 ms/div) Figure 15. Load Transients Figure 14. Line Transients http://onsemi.com 8 NCV8769 TYPICAL CHARACTERISTICS 100 TJ = 25°C Rout = 5 kW TJ = 25°C Vin = 13.2 V ±0.5 VPP Cout = 1 mF Iout = 1 mA 90 Vin (5 V/div) 80 PSRR (dB) 70 Vout (5 V/div) 60 50 40 VRO (5 V/div) 30 VSO (5 V/div) 10 20 0 TIME (100 ms/div) 10 100 10000 100000 f, FREQUENCY (Hz) Figure 16. Power Up and Down Transient Figure 17. PSRR vs. Frequency 40 4.80 Vin = 13.2 V tRD, RESET DELAY TIME (ms) Vin = 13.2 V 4.75 4.70 4.65 4.60 −40 −20 35 VDT = Vout 30 25 20 VDT = GND 15 10 −40 −20 0 20 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) 0 20 40 VSI_(th),H (VSI Increasing) 1.32 1.3 1.28 1.26 VSI_(th),L (VSI Decreasing) 1.24 1.22 −40 −20 0 20 80 100 120 140 160 Figure 19. Reset Time vs. Temperature 1.36 1.34 60 TJ, JUNCTION TEMPERATURE (°C) Figure 18. Reset Threshold vs. Temperature SENSE INPUT VOLTAGE (V) VRT, RESET THRESHOLD (V) 1000 40 60 80 100 120 140 160 TJ, JUNCTION TEMPERATURE (°C) Figure 20. SI Threshold vs. Temperature http://onsemi.com 9 NCV8769 Vin t Vout