NE5532

NE5532, SA5532, SE5532, NE5532A, SE5532A Internally Compensated Dual Low Noise Operational Amplifier The 5532 is a dual high-performance low noise operational amplifier. Compared to most of the standard operational amplifiers, such as the 1458, it shows better noise performance, improved output drive capability and considerably higher small-signal and power bandwidths. This makes the device especially suitable for application in high-quality and professional audio equipment, instrumentation and control circuits, and telephone channel amplifiers. The op amp is internally compensated for gains equal to one. If very low noise is of prime importance, it is recommended that the 5532A version be used because it has guaranteed noise voltage specifications. Features http://onsemi.com SOIC−8 D SUFFIX CASE 751 8 1 8 1 PDIP−8 N SUFFIX CASE 626 • • • • • • • • • • Small-Signal Bandwidth: 10 MHz Output Drive Capability: 600 W, 10 VRMS Input Noise Voltage: 5.0 nV Hz (Typical) DC Voltage Gain: 50000 AC Voltage Gain: 2200 at 10 kHz Power Bandwidth: 140 kHz Slew Rate: 9.0 V/ms Large Supply Voltage Range: "3.0 to "20 V Compensated for Unity Gain Pb−Free Packages are Available 16 1 SOIC−16 WB D SUFFIX CASE 751G PIN CONNECTIONS N, D8 Packages OUTA −INA +INA V1 2 3 4 A B 8 V+ 7 OUTB 6 −INB 5 +INB Top View D Package* −INA +INA NC V− NC NC +INB −INB 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC NC NC OUTA V+ OUTB NC NC Top View *SOL and non-standard pinout. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 6 of this data sheet. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 1 1 Publication Order Number: NE5532/D NE5532, SA5532, SE5532, NE5532A, SE5532A + _ Figure 1. Equivalent Schematic (Each Amplifier) MAXIMUM RATINGS Rating Supply Voltage Input Voltage Differential Input Voltage (Note 1) Operating Temperature Range NE5532/A SA5532 SE5532/A Storage Temperature Junction Temperature Maximum Power Dissipation, Tamb = 25°C (Still-Air) 8 D8 Package 8 N Package 16 D Packagee Thermal Resistance, Junction−to−Ambient 8 D8 Package 8 N Package 16 D Packagee Lead Soldering Temperature (10 sec max) Symbol VS VIN VDIFF Tamb Value "22 "VSUPPLY "0.5 0 to 70 −40 to +85 −55 to +125 −65 to +150 150 780 1200 1200 182 130 140 230 Unit V V V °C Tstg Tj PD °C °C mW RqJA °C/W Tsld °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to "10 mA. http://onsemi.com 2 NE5532, SA5532, SE5532, NE5532A, SE5532A DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) (Notes 2, 3 and 4) SE5532/A Characteristic Offset Voltage Symbol VOS − DVOS/DT Offset Current IOS − DIOS/DT Input Current IB − DIB/DT Supply Current ICC − Common-Mode Input Range Common-Mode Rejection Ratio Power Supply Rejection Ratio Large-Signal Voltage Gain VCM CMRR PSRR AVOL Test Conditions − Overtemperature − − Overtemperature − − Overtemperature − − Overtemperature − − − RL w 2.0 kW; VO = "10 V Overtemperature RL w 600 W; VO = "10 V Overtemperature Output Swing VOUT RL w 600 W Overtemperature RL w 600 W; VS = "18 V Overtemperature RL w 2.0 kW Overtemperature Input Resistance Output Short Circuit Current RIN ISC − − Min − − − − − − − − − − − "12 80 − 50 25 40 20 "12 "10 "15 "12 "13 "12 30 10 Typ 0.5 − 5.0 − − 200 200 − 5.0 8.0 − "13 100 10 100 − 50 − "13 "12 "16 "14 "13.5 "12.5 300 38 Max 2.0 3.0 − 100 200 − 400 700 − 10.5 13 − − 50 − − − − − − − − − − − 60 NE5532/A, SA5532 Min − − − − − − − − − − − "12 70 − 25 15 15 10 "12 "10 "15 "12 "13 "10 30 10 Typ 0.5 − 5.0 10 − 200 200 − 5.0 8.0 − "13 100 10 100 − 50 − "13 "12 "16 "14 "13.5 "12.5 300 38 Max 4.0 5.0 − 150 200 − 800 1000 − 16 − − − 100 − − − − − − − − − − − 60 kW mA V V dB mV/V V/mV Unit mV mV mV/°C nA nA pA/°C nA nA nA/°C mA 2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to "10 mA. 3. For operation at elevated temperature, derate packages based on the package thermal resistance. 4. Output may be shorted to ground at VS = "15 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded. http://onsemi.com 3 NE5532, SA5532, SE5532, NE5532A, SE5532A AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) NE/SE5532/A, SA5532 Characteristic Output Resistance Overshoot Symbol ROUT − Test Conditions AV = 30 dB Closed-loop f = 10 kHz, RL = 600 W Voltage-Follower VIN = 100 mVP-P CL = 100 pF; RL = 600 W Gain Gain Bandwidth Product Slew Rate Power Bandwidth AV GBW SR − f = 10 kHz CL = 100 pF; RL = 600 W − VOUT = "10 V VOUT = "14 V; RL = 600 W VCC = "18 V − − − − − 2.2 10 9.0 140 100 − − − − − V/mV MHz V/ms kHz − 10 − Min − Typ 0.3 Max − Unit W % ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = "15 V, unless otherwise noted.) NE/SE5532 Characteristic Input Noise Voltage Symbol VNOISE INOISE − Test Conditions fO = 30 Hz fO = 1.0 kHz Input Noise Current fO = 30 Hz fO = 1.0 kHz Channel Separation f = 1.0 kHz; RS = 5.0 kW Min − − − − − Typ 8.0 5.0 2.7 0.7 110 Max − − − − − NE/SA/SE5532A Min − − − − − Typ 8.0 5.0 2.7 0.7 110 Max 12 6.0 − − − dB pA/√Hz Unit nV/√Hz http://onsemi.com 4 NE5532, SA5532, SE5532, NE5532A, SE5532A TYPICAL PERFORMANCE CHARACTERISTICS 60 120 TYPICAL VALUES 80 GAIN (dB) GAIN (dB) 40 RF = 10 kW; RE = 100 W 30 RF = 9 kW; RE = 1 kW TYPICAL VALUES 40 VS = "15 V TYPICAL VALUES 40 20 (V) Vo(p-p) 20 0 0 RF = 1 kW; RE = ∞ 10 -40 10 102 103 104 f (Hz) 105 106 107 -20 103 104 105 106 f (Hz) 107 108 0 102 103 104 105 f (Hz) 106 107 Figure 2. Open-Loop Frequency Response 80 VS = "15 V 60 Figure 3. Closed-Loop Frequency Response 1,4 VS = "15 V 1,2 Figure 4. Large−Signal Frequency Response 30 TYPICAL VALUES 20 IO 40 (mA) II (mA) 0,8 VIN (V) 10 20 0,4 TYP 0 -55 0 -25 0 25 50 75 100 +125 -55 -25 0 25 50 75 100 +125 Tamb (oC) Tamb (oC) 0 0 10 Vp; −VN (V) 20 Figure 5. Output Short−Circuit Current 6 Figure 6. Input Bias Current Figure 7. Input Common−Mode Voltage Range IO = 0 TYP 10−2 4 IP IN 10 TYP (nV Hz) 1 (mA) 2 10−1 0 0 10−2 10 Vp; −VN (V) 20 10 102 f (Hz) 103 104 Figure 8. Supply Current Figure 9. Input Noise Voltage Density http://onsemi.com 5 NE5532, SA5532, SE5532, NE5532A, SE5532A + 5532 (1/2) RS 25 W − RF 5532 VIN 1 kW VI RE 100 pF 800 W V− − + 100 pF VOUT V+ 600 W Closed-Loop Frequency Response Voltage-Follower Figure 10. Test Circuits MARKING DIAGRAMS 8 N5532 ALYWA G 8 N5532 ALYW G 8 S5532 ALYWA G NE5532AN AWL YYWWG NE5532N AWL YYWWG SA5532N AWL YYWWG SE5532N AWL YYWWG 1 1 1 SOIC−8 D SUFFIX CASE 751 16 NE5532D AWLYYWWG PDIP−8 N SUFFIX CASE 626 1 SOIC−16 WB D SUFFIX CASE 751G A WL, L YY, Y WW, W G or G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Packagee http://onsemi.com 6 NE5532, SA5532, SE5532, NE5532A, SE5532A ORDERING INFORMATION Device NE5532AD8 NE5532AD8G NE5532AD8R2 NE5532AD8R2G NE5532AN NE5532ANG NE5532D NE5532DG NE5532DR2 NE5532DR2G NE5532D8 NE5532D8G NE5532D8R2 NE5532D8R2G NE5532N NE5532NG SA5532N SA5532NG SE5532AD8 SE5532AD8G SE5532AD8R2 SE5532AD8R2G SE5532N SE5532NG Description 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 16−Pin Plastic Small Outline (SO−16 WB) Package 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 16−Pin Plastic Small Outline (SO−16 WB) Package 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Small Outline (SO−8) Packagee 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 8−Pin Plastic Dual In−Line Package (PDIP−8) 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) Temperature Range 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C 0 to 70°C −40 to +85°C −40 to +85°C −55 to +125°C −55 to +125°C −55 to +125°C −55 to +125°C −55 to +125°C −55 to +125°C Shipping† 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail 47 Units / Rail 47 Units / Rail 1000 Tape & Reel 1000 Tape & Reel 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail 50 Units / Rail 50 Units / Rail 98 Units / Rail 98 Units / Rail 2500 / Tape & Reel 2500 / Tape & Reel 50 Units / Rail 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 7 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244 − X− A 8 5 B 1 S 4 0.25 (0.010) M Y M −Y− G K C −Z− H D 0.25 (0.010) M SEATING PLANE N X 45 _ 0.10 (0.004) M J ZY S X S DIM A B C D G H J K M N S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE L 8 5 − B− 1 4 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC −−− 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC −−− 10_ 0.030 0.040 F NOTE 2 − A− L C −T− SEATING PLANE J N D K M M TA M H G 0.13 (0.005) B M http://onsemi.com 9 NE5532, SA5532, SE5532, NE5532A, SE5532A PACKAGE DIMENSIONS SOIC−16 WB D SUFFIX CASE 751G−03 ISSUE C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS DIM MIN MAX A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0_ 7_ D 16 M 9 A q H B 1 16X 8 B TA S B B S 0.25 M A h X 45_ SEATING PLANE M 8X 0.25 E A1 14X e T C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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