NHP220SF, NRVHP220SF
Surface Mount
Ultrafast Power Rectifier
Plastic SOD−123FL Package
This SOD−123FL ultrafast rectifier provides fast switching
performance with soft recovery in a compact thermally efficient
package. Its compact footprint makes it ideally suited to portable and
automotive applications where board space is at a premium. Its low
profile makes it a good option for flat panel display and other
applications with limited vertical clearance. The device offers low
leakage over temperature making it a good match for applications
requiring low quiescent current.
www.onsemi.com
ULTRAFAST RECTIFIER
2.0 AMPERES
200 VOLTS
Features
•
•
•
•
•
Fast Soft Switching for Reduced EMI and Higher Efficiency
Low Profile − Maximum Height of 1.0 mm
Small Footprint − Footprint Area of 5.94 mm2
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SOD−123FL
CASE 498
PLASTIC
Mechanical Characteristics:
•
•
•
•
•
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 11.7 mg (Approximately)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
MSL 1
Applications
• Instrumentation
• Output Rectification in Switching Power Supplies Including Mini
•
•
•
•
Adapters and Flat Panel Display
LED Lighting
Freewheeling Diode Where Space is at a Premium
Engine Control
Infotainment and Other Space Constrained Center−stack
Applications
MARKING DIAGRAM
P22MG
G
P22
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NHP220SFT3G
SOD−123
(Pb−Free)
10000/Tape &
Reel
NRVHP220SFT3G
SOD−123
(Pb−Free)
10000/Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
December, 2014 − Rev. 2
1
Publication Order Number:
NHP220SF/D
NHP220SF, NRVHP220SF
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRRM
VRWM
VR
200
V
Average Rectified Forward Current
(TL = 140°C)
IO
2.0
A
Peak Repetitive Forward Current
(Square Wave, 20 kHz, TL = 135°C)
IFRM
4.0
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
40
A
Tstg, TJ
−65 to +175
°C
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Storage and Operating Junction Temperature Range (Note 1)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction−to−Lead (Note 2)
YJCL
23
°C/W
Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
85
°C/W
Thermal Resistance, Junction−to−Ambient (Note 3)
RqJA
330
°C/W
Symbol
Value
Unit
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 4)
(IF = 1.0 A, TJ = 25°C)
(IF = 2.0 A, TJ = 25°C)
(IF = 1.0 A, TJ = 125°C)
(IF = 2.0 A, TJ = 125°C)
VF
Maximum Instantaneous Reverse Current (Note 4)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 125°C)
IR
Reverse Recovery Time
IF = 2.0 A; VR = 30 V; dl/dt = 50 A/ms
TJ = −40°C to 150°C
trr
V
1.0
1.05
0.86
0.90
mA
0.5
35
50
ns
2. Mounted with 700 mm2 copper pad size (Approximately 1 in2) 1 oz FR4 Board.
3. Mounted with pad size approximately 20 mm2 copper, 1 oz FR4 Board.
4. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
2
NHP220SF, NRVHP220SF
TYPICAL CHARACTERISTICS
100
iF, INSTANTANEOUS FORWARD
CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100
TA = 125°C
10
TA = 150°C
1
TA = 175°C
0.1
TA = 25°C
0.01
TA = −40°C
0.1
TA = 150°C
1
TA = 125°C
0.1
TA = 25°C
0.3
0.5
0.7
0.9
TA = −40°C
0.001
1.1
1.3
0
1.5
0.2
0.4
0.6
0.8
1.0
1.2
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
IR, INSTANTANEOUS REVERSE CURRENT (A)
IR, INSTANTANEOUS REVERSE CURRENT (A)
TA = 175°C
0.01
0.001
1.4
1E−03
1E−03
1E−04
TA = 175°C
TA = 125°C
1E−06
1E−05
TA = 150°C
1E−07
TA = 125°C
TA = 150°C
1E−06
TA = 25°C
1E−08
TA = 175°C
1E−04
1E−05
TA = 25°C
1E−07
1E−09
TA = −40°C
1E−10
1E−08
1E−11
1E−12
TA = −40°C
1E−09
20
40
60
80
100 120 140 160 180 200
20
60
40
80
100 120 140 160 180 200
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
TJ = 25°C
100
10
0
0
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
20
40
60
80
100 120 140 160 180
200
IF(AV), AVERAGE FORWARD CURRENT (A)
0
1000
C, JUNCTION TEMPERATURE (pF)
10
4.0
3.5
DC
3.0
2.5
Square
Wave
2.0
1.5
1.0
0.5
RqJC = 23°C/W
0
0
20
40
60
80
100
120
140
VR, REVERSE VOLTAGE (V)
TC, CASE TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
www.onsemi.com
3
160 180
NHP220SF, NRVHP220SF
TYPICAL CHARACTERISTICS
3.0
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IPK/IAV = 20
TJ = 175°C
IPK/IAV = 10
2.5
IPK/IAV = 5
2.0
1.5
DC
1.0
Square
Wave
0.5
0
0
0.5
1.0
1.5
2.0
IF(AV), AVERAGE FORWARD CURRENT (A)
Figure 7. Forward Power Dissipation
1000
R(t) (C/W)
100
10
50% (DUTY CYCLE)
25%
10%
5.0%
2.0%
1.0%
1.0
0.1
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
10
100
1000
10
100
1000
PULSE TIME (s)
Figure 8. Thermal Response, Junction−to−Ambient (20 mm2 pad)
100
50% (DUTY CYCLE)
25%
R(t) (C/W)
10
10%
5.0%
2.0%
1.0
1.0%
0.1
SINGLE PULSE
0.01
0.000001
0.00001
0.0001
0.001
0.01
0.1
1.0
PULSE TIME (s)
Figure 9. Thermal Response, Junction−to−Ambient (1 in2 pad)
www.onsemi.com
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
DATE 10 MAY 2013
SCALE 4:1
E
D
q
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
2
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
q
HE
SIDE VIEW
2X
b
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
(Note: Microdot may be in either location)
4.20
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
RECOMMENDED
SOLDERING FOOTPRINT*
1.22
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
XXXMG
G
L
BOTTOM VIEW
2X
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
GENERIC
MARKING DIAGRAM*
c
2X
A1
DIM
A
A1
b
c
D
E
L
HE
q
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2X
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11184D
SOD−123FL
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative