NJT4031N,
NJV4031NT1G,
NJV4031NT3G
Bipolar Power Transistors
NPN Silicon
http://onsemi.com
Features
• Epoxy Meets UL 94, V−0 @ 0.125 in
• NJV Prefix for Automotive and Other Applications Requiring
•
NPN TRANSISTOR
3.0 AMPERES
40 VOLTS, 2.0 WATTS
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
COLLECTOR 2,4
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
BASE
1
Symbol
Value
Unit
VCEO
40
Vdc
Collector−Base Voltage
VCB
40
Vdc
Emitter−Base Voltage
VEB
6.0
Vdc
IB
1.0
Adc
Collector−Emitter Voltage
Base Current − Continuous
Collector Current − Continuous
IC
3.0
Adc
ICM
5.0
Adc
ESD − Human Body Model
HBM
3B
V
ESD − Machine Model
MM
C
V
Collector Current − Peak
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
Total Power Dissipation
Total PD @ TA = 25°C (Note 1)
Total PD @ TA = 25°C (Note 2)
Thermal Resistance, Junction−to−Case
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8” from case for 5 seconds
Operating and Storage Junction
Temperature Range
MARKING
DIAGRAM
4
1
2
3
AYW
4031NG
SOT−223
CASE 318E
STYLE 1
A
Y
W
4031N
G
1
= Assembly Location
Year
= Work Week
= Specific Device Code
= Pb−Free Package
ORDERING INFORMATION
THERMAL CHARACTERISTICS
Characteristic
EMITTER 3
Symbol
PD
Max
Unit
W
2.0
0.80
Device
Package
Shipping†
NJT4031NT1G
SOT−223
(Pb−Free)
1000 / Tape &
Reel
SOT−223
(Pb−Free)
4000 / Tape &
Reel
NJV4031NT1G
NJT4031NT3G
°C/W
RqJA
RqJA
64
155
TL
260
°C
TJ, Tstg
−55 to
+ 150
°C
NJV4031NT3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Mounted on 1” sq. (645 sq. mm) Collector pad on FR−4 bd material.
2. Mounted on 0.012” sq. (7.6 sq. mm) Collector pad on FR−4 bd material.
© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. 4
1
Publication Order Number:
NJT4031N/D
NJT4031N, NJV4031NT1G, NJV4031NT3G
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
40
−
−
6.0
−
−
−
−
100
−
−
100
−
−
−
−
−
−
0.100
0.150
0.300
−
−
1.0
−
−
1.0
220
200
100
−
−
−
500
−
25
−
−
170
−
−
215
−
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage
(IC = 10 mAdc, IB = 0 Adc)
VCEO(sus)
Emitter−Base Voltage
(IE = 50 mAdc, IC = 0 Adc)
VEBO
Collector Cutoff Current
(VCB = 40 Vdc)
ICBO
Emitter Cutoff Current
(VBE = 6.0 Vdc)
IEBO
Vdc
Vdc
nAdc
nAdc
ON CHARACTERISTICS (Note 3)
Collector−Emitter Saturation Voltage
(IC = 0.5 Adc, IB = 5.0 mAdc)
(IC = 1.0 Adc, IB = 10 mAdc)
(IC = 3.0 Adc, IB = 0.3 Adc)
VCE(sat)
Base−Emitter Saturation Voltage
(IC = 1.0 Adc, IB = 0.1 Adc)
VBE(sat)
Base−Emitter On Voltage
(IC = 1.0 Adc, VCE = 2.0 Vdc)
VBE(on)
DC Current Gain
(IC = 0.5 Adc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)
(IC = 3.0 Adc, VCE = 1.0 Vdc)
hFE
Vdc
Vdc
Vdc
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 10 Vdc, f = 1.0 MHz)
Cob
Input Capacitance
(VEB = 5.0 Vdc, f = 1.0 MHz)
Cib
Current−Gain − Bandwidth Product (Note 4)
(IC = 500 mA, VCE = 10 V, Ftest = 1.0 MHz)
fT
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. fT = |hFE| • ftest
PD, POWER DISSIPATION (W)
2.5
2.0
TC
1.5
1.0
TA
0.5
0
25
50
75
100
TJ, TEMPERATURE (°C)
Figure 1. Power Derating
http://onsemi.com
2
125
150
pF
pF
MHz
NJT4031N, NJV4031NT1G, NJV4031NT3G
TYPICAL CHARACTERISTICS
700
VCE = 1 V
150°C
500
400
25°C
300
200
−55°C
100
500
300
−55°C
200
0.01
0.1
1
0
0.001
10
0.1
1
IC, COLLECTOR CURRENT (A)
Figure 2. DC Current Gain
Figure 3. DC Current Gain
10
1
IC/IB = 10
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
150°C
25°C
0.1
−55°C
0.01
0.001
0.01
IC, COLLECTOR CURRENT (A)
1
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
25°C
400
100
0
0.001
0.001
0.01
0.1
1
IC/IB = 50
25°C
−55°C
0.01
10
0.001
VBE(on), EMITTER−BASE VOLTAGE (V)
IC = 3 A
2A
0.1
1A
0.5 A
0.1 A
0.01
0.1
1
10
Figure 5. Collector−Emitter Saturation Voltage
1
0.001
0.01
IC, COLLECTOR CURRENT (A)
Figure 4. Collector−Emitter Saturation Voltage
0.01
0.0001
150°C
0.1
IC, COLLECTOR CURRENT (A)
VCE(sat), COLLECTOR−EMITTER
SATURATION VOLTAGE (V)
VCE = 4 V
150°C
600
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
600
0.1
1.0
1.2
VCE = 2 V
1.0
−55°C
0.8
0.6
25°C
0.4
0.2
0
0.001
IB, BASE CURRENT (A)
150°C
0.01
0.1
1
IC, COLLECTOR CURRENT (A)
Figure 6. Collector Saturation Region
Figure 7. VBE(on) Voltage
http://onsemi.com
3
10
NJT4031N, NJV4031NT1G, NJV4031NT3G
TYPICAL CHARACTERISTICS
1.4
IC/IB = 10
1.2
VBE(sat), EMITTER−BASE
SATURATION VOLTAGE (V)
VBE(sat), EMITTER−BASE
SATURATION VOLTAGE (V)
1.4
1.0
−55°C
0.8
0.6
25°C
0.4
150°C
0.2
0
0.001
0.01
0.1
1
1.0
−55°C
0.8
0.6
25°C
0.4
150°C
0.2
0
10
IC/IB = 50
1.2
0.001
0.01
IC, COLLECTOR CURRENT (A)
Cobo, OUTPUT CAPACITANCE (pF)
Cibo, INPUT CAPACITANCE (pF)
100
TJ = 25°C
ftest = 1 MHz
350
300
250
200
150
100
50
0
1
2
3
4
5
6
7
60
40
20
0
10
20
30
40
50
60
70
VEB, EMITTER BASE VOLTAGE (V)
VCB, COLLECTOR BASE VOLTAGE (V)
Figure 10. Input Capacitance
Figure 11. Output Capacitance
80
90
10
TJ = 25°C
ftest = 1 MHz
VCE = 10 V
IC, COLLECTOR CURRENT (A)
fTau, CURRENT BANDWIDTH
PRODUCT (MHz)
TJ = 25°C
ftest = 1 MHz
80
0
8
240
200
10
Figure 9. Base−Emitter Saturation Voltage
450
0
1
IC, COLLECTOR CURRENT (A)
Figure 8. Base−Emitter Saturation Voltage
400
0.1
160
120
80
40
0
0.001
0.01
0.1
1
10
0.5 ms
1 ms
1
10 ms
100 ms
0.1
0.01
1
IC, COLLECTOR CURRENT (A)
10
VCE, COLLECTOR−EMITTER VOLTAGE (V)
Figure 12. Current−Gain Bandwidth Product
Figure 13. Safe Operating Area
http://onsemi.com
4
100
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE R
DATE 02 OCT 2018
SCALE 1:1
q
q
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42680B
SOT−223 (TO−261)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
SOT−223 (TO−261)
CASE 318E−04
ISSUE R
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
STYLE 2:
PIN 1.
2.
3.
4.
ANODE
CATHODE
NC
CATHODE
STYLE 6:
PIN 1.
2.
3.
4.
RETURN
INPUT
OUTPUT
INPUT
STYLE 7:
PIN 1.
2.
3.
4.
ANODE 1
CATHODE
ANODE 2
CATHODE
STYLE 11:
PIN 1. MT 1
2. MT 2
3. GATE
4. MT 2
STYLE 3:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
STYLE 8:
STYLE 12:
PIN 1. INPUT
2. OUTPUT
3. NC
4. OUTPUT
CANCELLED
DATE 02 OCT 2018
STYLE 4:
PIN 1.
2.
3.
4.
SOURCE
DRAIN
GATE
DRAIN
STYLE 5:
PIN 1.
2.
3.
4.
STYLE 9:
PIN 1.
2.
3.
4.
INPUT
GROUND
LOGIC
GROUND
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
DRAIN
GATE
SOURCE
GATE
STYLE 13:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
GENERIC
MARKING DIAGRAM*
AYW
XXXXXG
G
1
A
= Assembly Location
Y
= Year
W
= Work Week
XXXXX = Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42680B
SOT−223 (TO−261)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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