NL17SG04DFT2G

NL17SG04 Single Inverter The NL17SG04 MiniGatet is an advanced high−speed CMOS Inverter in ultra−small footprint. The NL17SG04 input structures provides protection when voltages up to 4.6 V are applied. www.onsemi.com Features • • • • • • Wide Operating VCC Range: 0.9 V to 3.6 V MARKING DIAGRAMS High Speed: tPD = 2.3 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C 4.6 V Overvoltage Tolerant (OVT) Input Pins SOT−953 CASE 527AE Ultra−Small Packages VM 1 These are Pb−Free and Halide−Free Devices UDFN6 1.0 x 1.0 CASE 517BX IN A 5 1 GND 2 NC 3 4 NC VCC 1 IN A 2 OUT Y GND 3 VCC UDFN6 1.45 x 1.0 CASE 517AQ 4 OUT Y SC−88A DF SUFFIX CASE 419A AP M G G Figure 2. SC−88A (Top View) M G 1 6 VCC IN A 2 5 NC GND 3 4 OUT Y 1 = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. NC PIN ASSIGNMENT Figure 3. UDFN (Top View) IN A 4 M M Figure 1. SOT−953 (Top Thru View) 5 5 M OUT Y SOT−953 SC−88A UDFN6 1 IN A NC NC 2 GND IN A IN A 3 NC GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC NC 6 VCC Figure 4. Logic Symbol FUNCTION TABLE A Input Y Output L H H L ORDERING INFORMATION See detailed ordering and shipping information on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 6 1 Publication Order Number: NL17SG04/D NL17SG04 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current Value Unit −0.5 to +5.5 V −0.5 to +4.6 V −0.5 to VCC +0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND Output at High or Low State Power−Down Mode (VCC = 0 V) IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD ILATCHUP Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage Latchup Performance UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) >2000 >100 V Above VCC and Below GND at 125°C (Note 4) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Characteristics Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range VCC = 3.3 V ± 0.3 V Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NL17SG04 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VIH High-Level Input Voltage VIL VOH VOL Conditions Low−Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL Min VCC (V) Max TA = -555C to +1255C Min 0.9 VCC VCC 1.1 to 1.3 0.7xVCC 0.7xVCC 1.4 to 1.6 0.65xVCC 0.65xVCC 1.65 to 1.95 0.65xVCC 0.65xVCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 Max Unit V 0.9 GND GND 1.1 to 1.3 0.3xVCC 0.3xVCC 1.4 to 1.6 0.35xVCC 0.35xVCC 1.65 to 1.95 0.35xVCC 0.35xVCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 IOH = −20 mA 0.9 0.75 0.75 IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 VCC−0.4 5 IOH = -4.0 mA 2.3 to 2.7 2.0 2.0 IOH = -8.0 mA 3.0 to 3.6 2.48 2.48 IOL = 20 mA 0.9 0.1 0.1 IOL = 0.3 mA 1.1 to 1.3 0.25xVCC 0.25xVCC IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V V V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NL17SG04 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns Symbol tPLH, tPHL Parameter Propagation Delay, A to Y Test Condition CL = 10 pF, RL = 1 MW CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW CIN Input Capacitance CPD Power Dissipation Capacitance (Note 5) Min Typ Max Min Max Unit 0.9 - 10.0 13.3 - 17.0 ns 1.1 to 1.3 - 8.7 11.2 - 14.0 1.4 to 1.6 - 4.9 8.5 - 10.0 1.65 to 1.95 - 3.8 6.2 - 6.7 2.3 to 2.7 - 2.6 3.9 - 4.4 3.0 to 3.6 - 2.1 3.1 - 3.7 0.9 - 11.55 13.7 - 19.7 1.1 to 1.3 - 7.2 10.8 - 15.6 ns 1.4 to 1.6 - 5.4 9.3 - 11.2 1.65 to 1.95 - 4.2 6.9 - 7.1 2.3 to 2.7 - 2.8 4.4 - 5.0 3.0 to 3.6 - 2.3 3.4 - 3.9 0.9 - 16.85 18.9 - 22.3 1.1 to 1.3 - 10.2 13.4 - 17.5 1.4 to 1.6 - 7.4 13.1 - 15.9 1.65 to 1.95 - 5.6 9.2 - 9.6 2.3 to 2.7 - 3.7 5.7 - 6.1 3.0 to 3.6 - 2.9 4.4 - 4.8 3 - - - pF 4 - - - pF 0 to 3.6 f = 10 MHz TA = -555C to +1255C TA = 255 C VCC (V) 0.9 to 3.6 - ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NL17SG04 VCC Input A 50% 50% GND tPLH tPHL VOH Output Y 50% VCC VOL Figure 5. Switching Waveforms OUTPUT INPUT CL * *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 6. Test Circuit ORDERING INFORMATION Package Shipping† NL17SG04P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG04DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG04AMUTCG UDFN6 1.45x1 mm (Pb−Free) 3000 / Tape & Reel NL17SG04CMUTCG UDFN6 1x1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE M SCALE 2:1 DATE 11 APR 2023 GENERIC MARKING DIAGRAM* XXXMG G *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. XXX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) STYLE 1: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 2: PIN 1. ANODE 2. EMITTER 3. BASE 4. COLLECTOR 5. CATHODE STYLE 3: PIN 1. ANODE 1 2. N/C 3. ANODE 2 4. CATHODE 2 5. CATHODE 1 STYLE 4: PIN 1. SOURCE 1 2. DRAIN 1/2 3. SOURCE 1 4. GATE 1 5. GATE 2 STYLE 6: PIN 1. EMITTER 2 2. BASE 2 3. EMITTER 1 4. COLLECTOR 5. COLLECTOR 2/BASE 1 STYLE 7: PIN 1. BASE 2. EMITTER 3. BASE 4. COLLECTOR 5. COLLECTOR STYLE 8: PIN 1. CATHODE 2. COLLECTOR 3. N/C 4. BASE 5. EMITTER STYLE 9: PIN 1. ANODE 2. CATHODE 3. ANODE 4. ANODE 5. ANODE DOCUMENT NUMBER: DESCRIPTION: 98ASB42984B STYLE 5: PIN 1. CATHODE 2. COMMON ANODE 3. CATHODE 2 4. CATHODE 3 5. CATHODE 4 Note: Please refer to datasheet for style callout. If style type is not called out in the datasheet refer to the device datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1.45x1.0, 0.5P CASE 517AQ ISSUE O 1 SCALE 4:1 A B D DATE 15 MAY 2008 L L NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 SIDE VIEW A2 e 6X C SEATING PLANE 6X 0.30 PACKAGE OUTLINE L 1.24 3 1 DETAIL A 6X 0.53 6 4 6X BOTTOM VIEW b 0.10 C A B 0.05 C NOTE 3 1 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM X M = Specific Device Code = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. DOCUMENT NUMBER: DESCRIPTION: 98AON30313E UDFN6, 1.45x1.0, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6, 1x1, 0.35P CASE 517BX ISSUE O SCALE 4:1 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉ ÉÉ ÉÉ DATE 18 MAY 2011 E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 6X BOTTOM VIEW b 0.10 M C A B 0.05 M C NOTE 3 0.53 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. GENERIC MARKING DIAGRAM* XM 1 X = Specific Device Code M = Date Code *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON56787E UDFN6, 1x1, 0.35P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E DATE 02 AUG 2011 SCALE 4:1 X Y D 5 PIN ONE INDICATOR A 4 HE E 1 2 3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 5X L2 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 GENERIC MARKING DIAGRAM* 5X BOTTOM VIEW XM b 1 0.08 X Y X M SOLDERING FOOTPRINT* *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 5X 0.35 5X 0.20 = Specific Device Code = Month Code PACKAGE OUTLINE 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON26457D SOT−953 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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