NL17SG373
Low-Power D-Type
Transparent Latch with
3-State Output
The NL17SG373 MiniGate™ is an advanced high−speed CMOS
D−Type Transparent Latch with 3−State Output in ultra−small
footprint.
The NL17SG373 input structures provide protection when voltages
up to 5.5 V are applied, regardless of the supply voltage.
This device is fully specified for partial power−down applications
using IOFF. The IOFF circuitry disables the output, preventing the
damaging backflow current through the device when it is powered
down.
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MARKING
DIAGRAMS
6
SC−88
DF SUFFIX
CASE 419B
1
AG M G
G
Features
•
•
•
•
•
•
1
Wide Operating VCC Range: 0.9 V to 3.6 V
High Speed: tPD = 2.4 ns (Typ) @ VCC = 3.0 V, CL = 15 pF
Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C
5.5 V Overvoltage Tolerant (OVT) Input Pins
Ultra−Small Packages
These Devices are Pb−Free and are RoHS Compliant
AG
M
G
= Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
PIN ASSIGNMENT
Pin
Figure 1. SC88 (Top View)
Function
1
LE
2
GND
3
D
4
Q
5
VCC
6
OE
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2014
May, 2018 − Rev. 2
1
Publication Order Number:
NL17SG373/D
NL17SG373
FUNCTION TABLE
Input
Output
OE
LE
D
Internal Latch
Q
L
H
L
L
L
Enable and Read Register
L
H
H
H
H
(Transparent Mode)
L
L
X
L
L
Latch and Read Register
L
L
X
H
H
H
X
X
X
Z
Operating Mode
Latch Register and Disable Output
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
−0.5 to +5.5
V
VIN
DC Input Voltage
−0.5 to +5.5
V
−0.5 to VCC + 0.5
V
VOUT
DC Output Voltage
IIK
DC Input Diode Current VIN < GND
−50
mA
IOK
DC Output Diode Current VOUT < GND, VOUT > VCC
±50
mA
IO
DC Output Source/Sink Current
±20
mA
ICC
DC Supply Current Per Supply Pin
±50
mA
IGND
DC Ground Current per Ground Pin
±50
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
FR
VESD
ILATCHUP
Moisture Sensitivity
Level 1
Flammability Rating Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
ESD Withstand Voltage Human Body Mode (Note 2)
Machine Model (Note 3)
Latchup Performance Above VCC and Below GND at 125°C (Note 4)
> 3000
> 200
V
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
0.9
3.6
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
3.6
V
Output Voltage Active Mode
0
VCC
V
−55
+125
°C
0
10
nS/V
VOUT
TA
Dt / DV
Operating Free−Air Temperature
Input Transition Rise or Fail Rate VCC = 3.3 V ± 0.3 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NL17SG373
DC ELECTRICAL CHARACTERISTICS
TA =
−555C to +1255C
TA = 255C
Symbol
Parameter
VIH
High−Level
Input Voltage
VIL
VOH
VOL
Conditions
Low−Level
Input Voltage
High−Level
Output
Voltage
Low−Level
Output
Voltage
VIN =
VIH or
VIL
VCC (V)
Min
Typ
Max
Min
0.9
VCC
VCC
1.1 to 1.3
0.7 x
VCC
0.7 x
VCC
1.4 to 1.6
0.65 x
VCC
0.65 x
VCC
1.65 to
1.95
0.65 x
VCC
0.65 x
VCC
2.3 to 2.7
1.7
1.7
3.0 to 3.6
2.0
2.0
Max
V
0.9
GND
GND
1.1 to 1.3
0.3 x
VCC
0.3 x
VCC
1.4 to 1.6
0.35 x
VCC
0.35 x
VCC
1.65 to
1.95
0.35 x
VCC
0.35 x
VCC
2.3 to 2.7
0.7
0.7
3.0 to 3.6
0.8
0.8
IOH = −20 mA
0.9
0.75
0.75
IOH = −0.3 mA
1.1 to 1.3
0.75 x
VCC
0.75 x
VCC
IOH = −1.7 mA
1.4 to 1.6
0.75 x
VCC
0.75 x
VCC
IOH = −3.0 mA
1.65 to
1.95
VCC −
0.45
VCC −
0.45
IOH = −4.0 mA
2.3 to 2.7
2.0
2.0
IOH = −8.0 mA
3.0 to 3.6
2.48
2.48
Unit
V
V
IOL = 20 mA
0.9
0.1
0.1
IOL = 0.3 mA
1.1 to 1.3
0.25 x
VCC
0.25 x
VCC
IOL = 1.7 mA
1.4 to 1.6
0.25 x
VCC
0.25 x
VCC
IOL = 3.0 mA
1.65 to
1.95
0.45
0.45
IOL = 4.0 mA
2.3 to 2.7
0.4
0.4
IOL = 8.0 mA
3.0 to 3.6
0.4
0.4
0 ≤ VIN ≤ 3.6 V
0 to 3.6
±0.1
±0.5
mA
VIN =
VIH or
VIL
V
IIN
Input
Leakage
Current
ICC
Quiescent
Supply
Current
VIN = VCC or GND
3.6
0.5
10
mA
IOZ
3−State
Output
Leakage
Current
VIN = VIH or VIL;
VOUT = 0 to 3.6 V
0.9 to 3.6
0.1
1
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SG373
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA =
−555C to +1255C
TA = 25 5C
Symbol
Parameter
Test Condition
VCC (V)
Min
Typ
Max
Min
Max
Unit
tPLH,
tPHL
Propagation Delay,
D to Q
CL = 10 pF,
RL = 1 MW
0.9
−
15.3
−
−
−
ns
1.1 to 1.3
−
6.3
12.3
1.0
14.4
1.4 to 1.6
−
4.4
8.1
1.0
9.4
1.65 to
1.95
−
3.6
6.2
0.5
6.7
2.3 to 2.7
−
2.6
3.9
0.5
4.4
3.0 to 3.6
−
2.1
3.1
0.5
3.7
0.9
−
17.7
−
−
−
1.1 to 1.3
−
7.1
13.6
1.0
15.6
1.4 to 1.6
−
5.0
9.2
1.0
10.4
1.65 to
1.95
−
4.1
6.9
1.0
7.1
2.3 to 2.7
−
2.9
4.4
0.5
5.0
3.0 to 3.6
−
2.4
3.4
0.5
3.9
0.9
−
29
−
−
−
1.1 to 1.3
−
9.3
17.3
1.0
21.2
1.4 to 1.6
−
6.4
11.6
1.0
12.6
1.65 to
1.95
−
5.3
9.1
1.0
9.6
2.3 to 2.7
−
4
5.7
1.0
6.1
3.0 to 3.6
−
3.3
4.4
1.0
4.8
0.9
−
15.3
−
−
−
1.1 to 1.3
−
6.3
12.3
1.0
14.4
1.4 to 1.6
−
4.4
8.1
1.0
9.4
1.65 to
1.95
−
3.6
6.2
0.5
6.7
2.3 to 2.7
−
2.6
3.9
0.5
4.4
3.0 to 3.6
−
2.1
3.1
0.5
3.7
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
tPLH,
tPHL
Propagation Delay,
LE to Q
CL = 10 pF,
RL = 1 MW
CL = 15 pF,
RL = 1 MW
CL = 30 pF,
RL = 1 MW
0.9
−
17.7
−
−
−
1.1 to 1.3
−
7.1
13.6
1.0
15.6
1.4 to 1.6
−
5.0
9.2
1.0
10.4
1.65 to
1.95
−
4.1
6.9
1.0
7.1
2.3 to 2.7
−
2.9
4.4
0.5
5.0
3.0 to 3.6
−
2.4
3.4
0.5
3.9
0.9
−
29
−
−
−
1.1 to 1.3
−
9.3
17.3
1.0
21.2
1.4 to 1.6
−
6.4
11.6
1.0
12.6
1.65 to
1.95
−
5.3
9.1
1.0
9.6
2.3 to 2.7
−
4
5.7
1.0
6.1
3.0 to 3.6
−
3.3
4.4
1.0
4.8
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4
ns
ns
ns
ns
ns
NL17SG373
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA =
−555C to +1255C
TA = 25 5C
Symbol
Parameter
Test Condition
CL = 10 pF,
RL = 5 kW
tPZH,
tPZL
Output Enable
Time, OE to Q
CL = 15 pF,
RL = 5 kW
CL = 30 pF,
RL = 5 kW
CL = 10 pF,
RL = 5 kW
tPHZ,
tPLZ
Output Disable
Time, OE to Q
CL = 15 pF,
RL = 5 kW
CL = 30 pF,
RL = 5 kW
VCC (V)
Min
Typ
Max
Min
Max
0.9
−
18.9
−
−
−
1.1 to 1.3
−
6.0
10.2
1
10.6
1.4 to 1.6
−
4.5
6.5
1
7.0
1.65 to
1.95
−
3.9
5.4
1
5.8
2.3 to 2.7
−
2.5
3.5
1
3.8
3.0 to 3.6
−
2.1
2.7
1
3
0.9
−
22
−
−
−
1.1 to 1.3
−
6.8
11.6
1
12.1
1.4 to 1.6
−
5.1
7.2
1
7.9
1.65 to
1.95
−
4.4
6.1
1
6.5
2.3 to 2.7
−
2.9
3.9
1
4.2
3.0 to 3.6
−
2.3
3
1
3.3
0.9
−
31.8
−
−
−
1.1 to 1.3
−
9.1
15.7
1
16.2
1.4 to 1.6
−
6.7
9.5
1
10.5
1.65 to
1.95
−
5.7
7.9
1
8.6
2.3 to 2.7
−
3.8
5
1
5.5
3.0 to 3.6
−
2.9
3.8
1
4.2
0.9
−
11.3
−
−
−
1.1 to 1.3
−
5.3
8.3
1
8.4
1.4 to 1.6
−
4.1
5.8
1
6.1
1.65 to
1.95
−
4.2
5.7
1
5.9
2.3 to 2.7
−
3.0
4
1
4.2
3.0 to 3.6
−
3.4
4.7
1
5
0.9
−
11
−
−
−
1.1 to 1.3
−
5.8
8.2
1
11
1.4 to 1.6
−
3.9
5.9
1
8
1.65 to
1.95
−
4.5
6.6
1
7.4
2.3 to 2.7
−
3.2
4.3
1
5.1
3.0 to 3.6
−
4.8
6.2
1
6.7
0.9
−
17.7
−
−
−
1.1 to 1.3
−
9.9
15.7
1
16
1.4 to 1.6
−
7.7
10.8
1
11.6
1.65 to
1.95
−
6
12.9
1
12.9
2.3 to 2.7
−
5
9.1
1
9.5
3.0 to 3.6
−
4
12.5
1
13
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5
Unit
ns
ns
ns
ns
ns
ns
NL17SG373
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA =
−555C to +1255C
TA = 25 5C
Symbol
Parameter
CIN
Input Capacitance
CO
Output Capacitance
CPD
Power dissipation
Capacitance
(Note 5)
Min
Typ
Max
Min
Max
Unit
0 to 3.6
1.5
−
−
−
pF
0
3
−
−
−
pF
VCC (V)
Test Condition
VO = GND
f =10 MHz;
VI = GND to
VCC
0.9
−
1.6
−
−
1.1 to 1.3
−
1.7
−
−
1.4 to 1.6
−
1.8
−
−
1.65 to
1.95
−
1.9
−
−
2.3 to 2.7
−
2.2
−
−
3.0 to 3.6
−
2.7
−
−
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
TIMING REQUIREMENTS (Input tr = tf = 3.0 ns; CL = 5 pF, 10 pF, 15 pF and 20 pF)
TA =
−555C to +1255C
TA = 25 5C
Symbol
tW
tSU
tH
Parameter
Pulse Width, LE
Set−Up Time, D to LE
Hold Time D to LE
Test Condition
High
High or Low
High or Low
VCC (V)
Min
Typ
Max
Min
Max
0.9
−
4.0
−
−
−
1.1 to 1.3
−
0.7
−
2.1
−
1.4 to 1.6
−
0.5
−
1.3
−
1.65 to
1.95
−
0.4
−
1.0
−
2.3 to 2.7
−
0.3
−
0.8
−
3.0 to 3.6
−
0.2
−
0.8
−
0.9
−
2.1
−
−
−
1.1 to 1.3
−
0.5
−
2.7
−
1.4 to 1.6
−
0.3
−
1.5
−
1.65 to
1.95
−
0.3
−
1.2
−
2.3 to 2.7
−
0.2
−
0.9
−
3.0 to 3.6
−
0.2
−
0.7
−
0.9
−
−2.8
−
−
−
1.1 to 1.3
−
−0.7
−
−0.1
−
1.4 to 1.6
−
−0.4
−
−0.1
−
1.65 to
1.95
−
−0.4
−
0
−
2.3 to 2.7
−
−0.3
−
0.2
−
3.0 to 3.6
−
−0.4
−
0.3
−
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6
Unit
ns
ns
ns
NL17SG373
Figure 3. Test Circuit
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Figure 4. tPLH, tPHL Waveforms (D to Q)
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Figure 5. tPLH, tPHL, tW Waveforms (LE to Q)
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7
NL17SG373
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Figure 6. tSU, tH Waveforms (D to LE)
MEASUREMENT POINTS FOR FIGURES 4, 5 AND 6
Supply Voltage
Input
Output
VCC
VM
VI
tr = tf
VM
0.9 V to 3.6 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Figure 7. tPLZ, tPHZ, tPZH, tPZL Waveforms (OE to Q)
MEASUREMENT POINTS FOR FIGURE 7
Supply Voltage
Input
Output
VCC
VM
VI
tr = tf
VM
VX
VY
0.9 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.1 V
VOH − 0.1 V
1.1 V to 1.3 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.1 V
VOH − 0.1 V
1.4 V to 1.6 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.1 V
VOH − 0.1 V
1.65 V to 1.95 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.15 V
VOH − 0.15
V
2.3 V to 2.7 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.15 V
VOH − 0.15
V
3.0 V to 3.6 V
0.5 x VCC
VCC
≤ 3.0 ns
0.5 x VCC
VOL + 0.3 V
VOH − 0.3 V
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8
NL17SG373
ORDERING INFORMATION
Device
NL17SG373DFT2G
Package
Shipping†
SC−88 / SOT−363 / SC−70−6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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9
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
1
SCALE 2:1
DATE 11 DEC 2012
2X
aaa H D
D
H
A
D
6
5
GAGE
PLANE
4
1
2
L
L2
E1
E
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
b
ddd
TOP VIEW
C A-B D
M
A2
DETAIL A
A
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
ccc C
A1
SIDE VIEW
C
SEATING
PLANE
END VIEW
c
RECOMMENDED
SOLDERING FOOTPRINT*
6X
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
GENERIC
MARKING DIAGRAM*
6
XXXMG
G
6X
0.30
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
0.66
1
2.50
0.65
PITCH
XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLES ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
DATE 11 DEC 2012
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 2:
CANCELLED
STYLE 3:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42985B
SC−88/SC70−6/SOT−363
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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