NL17SZ00XV5T2

NL17SZ00 Single 2−Input NAND Gate The NL17SZ00 is a single 2−input NAND Gate in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. Features • • • • • • • • Tiny SOT−353 and SOT−553 Packages 2.7 ns TPD at 5 V (typ) Source/Sink 24 mA at 3.0 V Over−V oltage Tolerant Inputs Pin For Pin with NC7SZ00P5X, TC7SZ00FU and TC7SZ00AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available http://onsemi.com MARKING DIAGRAMS 5 L1 MG G 1 5 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A L1 = Specific Device Marking M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 5 5 L1 M 1 A 1 5 VCC B 2 1 SOT−553 XV5 SUFFIX CASE 463B L1 M = Specific Device Marking = Date Code GND 3 4 Y PIN ASSIGNMENT Pin Function A B GND Y VCC Figure 1. Pinout (Top View) 1 2 A B 3 & Y 4 5 Figure 2. Logic Symbol FUNCTION TABLE Output Input A L L H H B L H L H Y = AB Y H H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 1 November, 2006 − Rev. 5 Publication Order Number: NL17SZ00/D NL17SZ00 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR ESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Classification Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) SOT−353 (Note 1) SOT−553 SOT−353 SOT−553 Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to to VCC + 0.5 *50 *50 $50 $100 *65 to )150 260 )150 350 496 186 135 Level 1 UL 94 V−0 @ 0.125 in Class Z Class A N/A Unit V V V mA mA mA mA °C °C °C °C/W mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Min 1.65 0 0 *40 0 0 Max 5.5 5.5 VCC + 0.5 )85 100 20 Unit V V V °C ns/V http://onsemi.com 2 NL17SZ00 DC ELECTRICAL CHARACTERISTICS VCC Symbol VIH VIL VOH Parameter High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA Condition (V) 1.65 to 1.95 2.3 to 5.5 1.65 to 1.95 2.3 to 5.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 IIN ICC Input Leakage Current Quiescent Supply Current VIN = VCC or GND VIN = VCC or GND 0 to 5.5 5.5 0.08 0.20 0.22 0.28 0.38 0.42 VCC − 0.1 1.55 1.9 2.2 2.4 2.3 3.8 VCC 1.65 2.1 2.4 2.7 2.5 4.0 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $0.1 1 Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.55 1.9 2.2 2.4 2.3 3.8 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $1.0 10 mA mA V TA = 255C Typ Max *405C v TA v 855C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Max Unit V V V AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 $ 0.5 (V) 1.65 1.8 2.5 to 0.2 3.3 $ 0.3 Min 2.0 2.0 0.8 0.5 1.5 0.5 0.8 TA = 255C Typ 5.4 4.5 3.0 2.4 2.4 2.0 2.4 Max 11.4 9.5 6.5 4.5 5.0 3.9 4.3 *405C v TA v 855C Min 2.0 2.0 0.8 0.5 1.5 0.5 0.8 Max 12 10.0 7.0 4.7 5.2 4.1 4.5 Unit ns CAPACITIVE CHARACTERISTICS Symbol CIN CPD Input Capacitance Power Dissipation Capacitance (Note 5) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical u4 25 30 Unit pF pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 NL17SZ00 tf = 3 ns 90% 90% 50% 10% tf = 3 ns VCC VCC INPUT A and B 50% 10% GND INPUT RL CL OUTPUT tPHL tPLH VOH OUTPUT Y 50% 50% VOL A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL17SZ00DFT2 NL17SZ00DFT2G NL17SZ00XV5T2 NL17SZ00XV5T2G Logic Circuit Indicator NL NL NL NL No. of Gates per Package 1 1 1 1 Temp Range Identifier 7 7 7 7 Device Function 00 00 00 00 Package Suffix DF DF XV5 XV5 Tape and Reel Suffix T2 T2 T2 T2 Package Type SOT−353 SOT−353 (Pb−Free) SOT−553* SOT−553* Tape and Reel Size† 178 mm, 3000 Units 178 mm, 3000 Units 178 mm 4000 units 178 mm 4000 units Technology SZ SZ SZ SZ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ00 PACKAGE DIMENSIONS SOT−353 (SC−88A, SC−70) DF SUFFIX CASE 419A−02 ISSUE J A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A B C D G H J K N S INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 5 4 S 1 2 3 −B− D 5 PL 0.2 (0.008) M B M N J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NL17SZ00 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX CASE 463B−01 ISSUE B D −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E e L HE MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 A L 4 5 1 2 3 E −Y− HE b e 5 PL M c XY 0.08 (0.003) SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.0 0.0394 1.35 0.0531 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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