Single Inverter with Open
Drain Output
NL17SZ06
The NL17SZ06 is a single inverter with open drain output in tiny
footprint packages.
Features
•
•
•
•
•
•
•
•
•
www.onsemi.com
Designed for 1.65 V to 5.5 V VCC Operation
2.1 ns tPD at VCC = 5 V (typ)
Input/Output Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.0 V
Available in SC−88A, SC−74A, SOT−553, SOT−953 and UDFN6
Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A
1
MARKING
DIAGRAMS
SC−88A
CASE 419A
XX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XXX MG
G
SOT−553
XV5 SUFFIX
CASE 463B
XX MG
G
Y
SOT−953
P5 SUFFIX
CASE 527AE
Figure 1. Logic Symbol
XM
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
UDFN6
1.0 x 1.0
CASE 517BX
XX
M
G
XM
XM
1
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
September, 2020 − Rev. 11
1
Publication Order Number:
NL17SZ06/D
NL17SZ06
VCC
NC
1
5
OVT
A
VCC
A
5
1
Y
4
3
6
VCC
OVT
2
GND
1
OVT
GND
2
NC
A
2
5
NC
GND
3
4
Y
Y
NC
4
3
SOT−953
(SC−88A/SOT−553/SC−74A)
UDFN6
Figure 2. Pinout (Top View)
PIN ASSIGNMENT
(SC−88A/SOT−553/SC−74A)
PIN ASSIGNMENT (SOT−953)
PIN ASSIGNMENT (UDFN)
Pin
Function
Pin
Function
Pin
Function
1
NC
1
A
1
NC
2
A
2
GND
2
A
3
GND
3
NC
3
GND
4
Y
4
Y
4
Y
5
VCC
5
VCC
5
NC
6
VCC
FUNCTION TABLE
A Input
Y Output
L
Z
H
L
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2
NL17SZ06
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
SC−88A (NLV)
SC−74A, SC−88A, SOT−553, SOT−953, UDFN6
−0.5 to +7.0
−0.5 to +6.5
V
VIN
DC Input Voltage
SC−88A (NLV)
SC−74A, SC−88A, SOT−553, SOT−953, UDFN6
−0.5 to +7.0
−0.5 to +6.5
V
VOUT
Characteristics
DC Output Voltage
SC−88A (NLV)
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +7.0
−0.5 to +7.0
V
DC Output Voltage
SC−74A, SC−88A,
SOT−553, SOT−953, UDFN6
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±100
mA
−65 to +150
°C
ICC or IGND
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 secs
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
377
320
324
254
154
°C/W
PD
Power Dissipation in Still Air
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
332
390
386
491
812
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
$100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
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3
NL17SZ06
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
DC Output Voltage
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
0
0
VCC
5.5
5.5
−55
+125
°C
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
100
20
ns/V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Rise and Fall Time
SC−88A (NLV)
Input Rise and Fall Time
SC−74A, SC−88A,
SOT−553, SOT−953, UDFN6
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
High−Level Input
Voltage
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.3 to 5.5
0.70 VCC
−
−
0.70 VCC
−
VIL
Low−Level Input
Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.3 to 5.5
−
−
0.30 VCC
−
0.30 VCC
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
IIN
Input Leakage Current
VIN = 5.5 V or GND
1.65 to 5.5
−
−
±0.1
−
±1.0
mA
IOZ
3−State Output
Leakage Current
VOUT = 0 V to 5.5 V
1.65 to 5.5
−
−
±0.5
−
±5.0
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0
−
−
1.0
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or GND
5.5
−
−
1.0
−
10
mA
Symbol
VIH
Parameter
Condition
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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4
NL17SZ06
AC ELECTRICAL CHARACTERISTICS
Symbol
tPZL
tPLZ
Parameter
Condition
Propagation Delay,
A to Y
(Figures 3 and 4)
Propagation Delay,
A to Y
(Figures 3 and 4)
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
1.65 to 1.95
−
6.0
9.0
−
9.5
ns
2.3 to 2.7
−
3.6
6.1
−
6.5
3.0 to 3.6
−
2.7
5.6
−
6.0
4.5 to 5.5
−
2.1
4.4
−
4.8
1.65 to 1.95
−
4.0
9.0
−
9.5
2.3 to 2.7
−
2.8
6.1
−
6.5
3.0 to 3.6
−
2.5
5.6
−
6.0
4.5 to 5.5
−
2.2
4.4
−
4.8
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 3.3 V, VIN = 0 V or VCC
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
9
11
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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5
NL17SZ06
OPEN
2 x VCC
Test
Switch
Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
50
500
500
tPHZ / tPZH
GND
50
500
500
GND
R1
OUTPUT
DUT
RL
RT
CL, pF
RL, W
R1 , W
See AC Characteristics Table
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
~VCC
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
tPZH
VOH
Vmo
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
1.65 to 1.95
VCC/2
VCC/2
VCC/2
0.15
2.3 to 2.7
VCC/2
VCC/2
VCC/2
0.15
3.0 to 3.6
VCC/2
VCC/2
VCC/2
0.3
4.5 to 5.5
VCC/2
VCC/2
VCC/2
0.3
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6
tPZL, tPLZ, tPZH, tPHZ
VY, V
NL17SZ06
DEVICE ORDERING INFORMATION
Packages
Specific Device Code
Pin 1 Orientation
(See below)
Shipping†
NL17SZ06DFT2G
SC−88A
LF
Q4
3000 / Tape & Reel
NLV17SZ06DFT2G*
SC−88A
LF
Q4
3000 / Tape & Reel
NL17SZ06DBVT1G
SC−74A
AF
Q4
3000 / Tape & Reel
NL17SZ06XV5T2G
SOT−553
LF
Q4
4000 / Tape & Reel
NL17SZ06P5T5G
(In Development)
SOT−953
TBD
Q2
8000 / Tape & Reel
NL17SZ06MU1TCG
(In Development)
UDFN6, 1.45 x 1.0 x 0.5P
TBD
Q4
3000 / Tape & Reel
NL17SZ06MU3TCG
(In Development)
UDFN6, 1.0 x 1.0 x 0.35P
TBD
Q4
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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7
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5
1
SCALE 2:1
5X
DATE 18 JAN 2018
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
e
D
A
L
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM
A
A1
b
c
D
E
E1
e
L
M
TOP VIEW
A
SIDE VIEW
DETAIL A
C
c
SEATING
PLANE
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
GENERIC
MARKING DIAGRAM*
0.95
PITCH
XXX MG
G
XXX
M
G
2.40
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
5X
1.00
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON66279G
SC−74A
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
SCALE 2:1
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DATE 17 JAN 2013
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
B
M
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
J
GENERIC MARKING
DIAGRAM*
C
K
H
XXXMG
G
SOLDER FOOTPRINT
0.50
0.0197
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
mm Ǔ
ǒinches
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42984B
STYLE 5:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
SC−88A (SC−70−5/SOT−353)
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
SCALE 4:1
D
−X−
5
A
4
1
2
3
b
e
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
E
−Y−
DATE 20 MAR 2013
HE
DIM
A
b
c
D
E
e
L
HE
c
5 PL
0.08 (0.003)
M
X Y
RECOMMENDED
SOLDERING FOOTPRINT*
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.061
0.063
MIN
0.020
0.007
0.003
0.061
0.045
MAX
0.024
0.011
0.007
0.065
0.049
0.012
0.065
GENERIC
MARKING DIAGRAM*
0.3
0.0118
XXMG
G
0.45
0.0177
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
1.0
0.0394
1.35
0.0531
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.65
1.20
1.25
0.50 BSC
0.10
0.20
0.30
1.55
1.60
1.65
MIN
0.50
0.17
0.08
1.55
1.15
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLE 1:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 2:
PIN 1. CATHODE
2. COMMON ANODE
3. CATHODE 2
4. CATHODE 3
5. CATHODE 4
STYLE 3:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. CATHODE 1
STYLE 4:
PIN 1. SOURCE 1
2. DRAIN 1/2
3. SOURCE 1
4. GATE 1
5. GATE 2
STYLE 6:
PIN 1. EMITTER 2
2. BASE 2
3. EMITTER 1
4. COLLECTOR 1
5. COLLECTOR 2/BASE 1
STYLE 7:
PIN 1. BASE
2. EMITTER
3. BASE
4. COLLECTOR
5. COLLECTOR
STYLE 8:
PIN 1. CATHODE
2. COLLECTOR
3. N/C
4. BASE
5. EMITTER
STYLE 9:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. ANODE
5. ANODE
DOCUMENT NUMBER:
STATUS:
98AON11127D
ON SEMICONDUCTOR STANDARD
1
© Semiconductor Components Industries, LLC, 2002
January, 2002 − Rev. 01O
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOT−553, 5 LEAD
http://onsemi.com
1
STYLE 5:
PIN 1. ANODE
2. EMITTER
3. BASE
4. COLLECTOR
5. CATHODE
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Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11127D
PAGE 2 OF 2
ISSUE
REVISION
DATE
A
ADDED STYLES 3−9. REQ. BY D. BARLOW
11 NOV 2003
B
ADDED NOMINAL VALUES AND UPDATED GENERIC MARKING DIAGRAM. REQ.
BY HONG XIAO
27 MAY 2005
C
UPDATED DIMENSIONS D, E, AND HE. REQ. BY J. LETTERMAN.
20 MAR 2013
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© Semiconductor Components Industries, LLC, 2013
March, 2013 − Rev. C
Case Outline Number:
463B
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