NL17SZ125

NL17SZ125 Non−Inverting 3−State Buffer The NL17SZ125 is a high performance non−inverting buffer operating from a 1.65 V to 5.5 V supply. • • • • • • • • • • • Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Overvoltage Tolerant Inputs and Outputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements 3−State OE Input is Active−Low Replacement for NC7SZ125 Chip Complexity = 36 FETs Pb−Free Package is Available http://onsemi.com MARKING DIAGRAM 5 5 1 SC−88A (SOT−353) DF SUFFIX CASE 419A d = Date Code 1 M0d PIN ASSIGNMENT 1 2 OE 1 5 VCC 3 4 5 IN A 2 OE IN A GND OUT Y VCC GND 3 4 OUT Y OE Input L L H X = Don’t Care FUNCTION TABLE A Input L H X Y Output L H Z Figure 1. Pinout (Top View) OE IN A EN OUT Y Figure 2. Logic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.  Semiconductor Components Industries, LLC, 2005 January, 2005 − Rev. 4 1 Publication Order Number: NL17SZ125/D NL17SZ125 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Parameter Value −0.5 to )7.0 −0.5 to )7.0 −0.5 to )7.0 −50 −50 $50 $100 −65 to )150 260 )150 350 150 Level 1 UL 94 V−0 @ 0.125 in u2000 u200 N/A V Unit V V V mA mA mA mA °C °C °C °C/W mW Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Min 1.65 0 0 −40 0 0 0 0 Max 5.5 5.5 5.5 +125 20 20 10 5.0 Unit V V V °C ns/V NORMALIZED FAILURE RATE DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130°C TJ = 120°C TJ = 100°C TJ = 110°C TJ = 90°C TJ = 80°C 100 TIME, YEARS 1 1 10 1000 Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com 2 NL17SZ125 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL VOH Parameter High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VIN = VIH VCC (V) 1.65 to 1.95 2.3 to 5.5 1.65 to 1.95 2.3 to 5.5 1.65 1.8 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 VOL Low−Level Output Voltage VIN = VIL 1.65 1.8 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 IIN IOZ IOFF ICC Input Leakage Current 3−State Output Leakage Power Off Leakage Current Quiescent Supply Current 0 to 5.5 1.65 to 5.5 0.0 1.65 to 5.5 1.55 1.7 2.2 2.9 4.4 1.29 1.9 2.4 2.3 3.8 1.65 1.8 2.3 3.0 4.5 1.52 2.15 2.80 2.68 4.20 0.0 0.0 0.0 0.0 0.0 0.08 0.10 0.15 0.22 0.22 0.1 0.1 0.1 0.1 0.1 0.24 0.30 0.40 0.55 0.55 $1.0 $0.5 1.0 1.0 TA = 255C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC 1.55 1.7 2.2 2.9 4.4 1.29 1.9 2.4 2.3 3.8 0.1 0.1 0.1 0.1 0.1 0.24 0.30 0.40 0.55 0.55 $1.0 $5.0 10 10 Typ Max −405C v TA v 1255C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Max Unit V V V IOH = −100 mA Condition V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA IOL = 100 mA V V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 0 V v VIN v 5.5 V VIN = VIH or VIL 0 V v VOUT v 5.5 V VIN or VOUT = 5.5 V VIN = 5.5 V, GND mA mA mA mA http://onsemi.com 3 NL17SZ125 AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns) Symbol tPLH tPHL Parameter Propagation Delay pg y AN t YN to (Figures (Figures 4 and 5, Table 1) 5, Table 1) Condition RL = 1 MW RL = 1 MW RL = 1 MW RL = 500 W RL = 1 MW RL = 500 W tPZH tPZL Output Enable Time p (Figures 6, 7and 8 Table 1) (Fi 6 7a d 8, Tabl RL = 250 W CL = 15 pF CL = 15 pF CL = 15 pF CL = 50 pF CL = 15 pF p CL = 50 pF F CL = 50 pF p VCC (V) 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 tPHZ tPLZ Output Disable Time p (Figures 6, 7and 8 Table 1) (Fi 6 7a d 8, Tabl RL and R1= 500 W CL = 50 pF p 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 5.0 $ 0.5 TA = 255C Min 2.0 1.0 0.8 1.2 0.5 0.8 2.0 1.8 1.2 0.8 2.0 1.5 0.8 0.3 8.0 7.6 Typ 9.0 Max 10 7.5 5.2 5.7 4.5 5.0 9.5 8.5 6.2 5.5 10 8.0 5.7 4.7 −405C v TA v 1255C Min 2.0 1.0 0.8 1.2 0.5 0.8 2.0 1.8 1.2 0.8 2.0 1.5 0.8 0.3 Max 10.5 8.0 5.5 6.0 4.8 5.3 10 9.0 6.5 5.8 10.5 8.5 6.0 5.0 ns ns Unit ns CAPACITIVE CHARACTERISTICS Symbol CIN COUT CPD Input Capacitance Output Capacitance Power Dissipation Capacitance (Note 5) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, 10 MHz, VCC = 5.5 V, VI = 0 V or VCC VI = 0 V or VCC Typical 2.5 2.5 9 11 Unit pF pF pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 4 NL17SZ125 tf = 3 ns 90% Vmi 10% 90% Vmi 10% tf = 3 ns VCC INPUT GND OE = GND OUTPUT CL* RL INPUT A and B tPHL tPLH VOH Vmo Vmo OUTPUT Y VOL *Includes all probe and jig capacitance. A 1 MHz square input wave is recommended for propagation delay tests. Figure 4. Switching Waveform 2 INPUT VCC INPUT Figure 5. TPLH or TPHL R1 = 500 W OUTPUT CL = 50 pF RL = 500 W VCC OUTPUT CL = 50 pF RL = 250 W A 1 MHz square input wave is recommended for propagation delay tests. A 1 MHz square input wave is recommended for propagation delay tests. Figure 6. TPZL or TPL Figure 7. TPZH or TPHZ 2.7 V OE tPZH On Vmi tPHZ Vmo Vmi 0V VCC VOH − 0.3 V ≈0V tPZL On Vmo tPLZ ≈ 3.0 V VOL + 0.3 V GND Figure 8. AC Output Enable and Disable Waveform Table 1. Output Enable and Disable Times tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns VCC Symbol Vmi Vmo 3.3 V $ 0.3 V 1.5 V 1.5 V 2.7 V 1.5 V 1.5 V 2.5 V $ 0.2 V VCC/2 VCC/2 http://onsemi.com 5 NL17SZ125 DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator NL NL No. of Gates per Package 1 1 Temp Range Identifier 7 7 Device Function 125 125 Package Suffix DF DF Tape and Reel Suffix T2 T2G Device NL17SZ125DFT2 NL17SZ125DFT2G Technology SZ SZ Package SC−88A (SOT−353) SC−88A (SOT−353) (Pb−Free) Shipping† 3000 / Tape & Reel 178 mm (7”) 3000 / Tape & Reel 178 mm (7”) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 NL17SZ125 PACKAGE DIMENSIONS SC−88A (SOT−353) DF SUFFIX CASE 419A−02 ISSUE G A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 5 4 S 1 2 3 −B− D 5 PL 0.2 (0.008) M B M N J C DIM A B C D G H J K N S H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NL17SZ125 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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