NL17SZ32DFT2G

NL17SZ32 Single 2−Input OR Gate The NL17SZ32 is a single 2−input OR Gate in two tiny footprint packages. The device performs much as LCX multi−gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed. Features http://onsemi.com MARKING DIAGRAMS 5 1 SOT−353/SC70−5/SC−88A DF SUFFIX CASE 419A 5 1 SOT−553 XV5 SUFFIX CASE 463B 1 1 5 L4 M G G 5 L4 M G G • • • • • • • • Tiny SOT−353 and SOT−553 Packages 2.4 ns TPD at 5.0 V (typ) Source/Sink 24 mA at 3.0 V Over−V oltage Tolerant Inputs Pin For Pin with NC7SZ32P5X, TC7SZ32FU and TC7SZ32AFE Chip Complexity: FETs = 20 Designed for 1.65 V to 5.5 V VCC Operation Pb−Free Packages are Available B 1 5 VCC A 2 GND 3 4 Y L4 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT Figure 1. Pinout (Top View) Pin 1 2 A B 3 w1 Y 4 5 Function A B GND Y VCC Figure 2. Logic Symbol FUNCTION TABLE Output Input A L L H H B L H L H Y=A)B Y L H H H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. © Semiconductor Components Industries, LLC, 2006 March, 2006 − Rev. 6 1 Publication Order Number: NL17SZ32/D NL17SZ32 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR ESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Classification Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) SOT−353 (Note 1) SOT−553 SOT−353 SOT−553 Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to VCC )0.5 *50 *50 $50 $100 *65 to )150 260 )150 350 496 186 135 Level 1 UL 94 V−0 @ 0.125 in Class Z Class A N/A V Unit V V V mA mA mA mA °C °C °C °C/W mW Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Min 1.65 0 0 *40 0 0 Max 5.5 5.5 VCC + 0.5 )85 100 20 Unit V V V °C ns/V http://onsemi.com 2 NL17SZ32 DC ELECTRICAL CHARACTERISTICS VCC Symbol VIH VIL VOH Parameter High−Level Input Voltage Low−Level Input Voltage High−Level Output Voltage VIN = VIL or VIH IOH = 100 mA IOH = −3 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOL Low−Level Output Voltage VIN = VIH or VOH IOL = 100 mA IOL = 3 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA IIN ICC Input Leakage Current Quiescent Supply Current VIN = VCC or GND VIN = VCC or GND Condition (V) 1.65 to 1.95 2.3 to 5.5 1.65 to 1.95 2.3 to 5.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 0 to 5.5 5.5 0.08 0.20 0.22 0.28 0.38 0.42 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.52 2.1 2.4 2.7 2.5 4.0 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $0.1 1 Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 0.24 0.3 0.4 0.4 0.55 0.55 $1.0 10 mA mA V TA = 255C Typ Max *405C v TA v 855C Min 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Max Unit V V V AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) (Fi d) Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 $ 0.5 (V) 1.65 1.8 2.5 $ 0.2 3.3 $ 0.3 Min 2.0 2.0 0.8 0.5 1.5 0.5 0.8 TA = 255C Typ 5.5 4.6 3.0 2.6 3.0 2.2 2.4 Max 12.0 10 7 4.7 5.2 4.1 4.5 *405C v TA v 855C Min 2.0 2.0 0.8 0.5 1.5 0.5 0.8 Max 12.7 10.5 7.5 5.0 5.5 4.4 4.8 Unit ns CAPACITIVE CHARACTERISTICS Symbol CIN CPD Input Capacitance Power Dissipation Capacitance (Note 5) (N ) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical u4 25 30 Unit pF pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 NL17SZ32 tf = 3 ns 90% 50% 10% 90% 50% 10% tf = 3 ns VCC INPUT RL VOH CL INPUT A and B GND OUTPUT tPHL tPLH OUTPUT Y 50% 50% VOL A 1 MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit ORDERING INFORMATION Device Order Number NL17SZ32DFT2 NL17SZ32DFT2G NL17SZ32XV5T2 NL17SZ32XV5T2G Package Type SC70−5/SC−88A/SOT−353 SC70−5/SC−88A/SOT−353 (Pb−Free) SOT−553* SOT−553* Tape and Reel Size† 3000 / Tape & Reel 3000 / Tape & Reel 4000 / Tape & Reel 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *All Devices in Package SOT553 are Inherently Pb−Free. http://onsemi.com 4 NL17SZ32 PACKAGE DIMENSIONS SC−88A, SOT−353, SC−70 CASE 419A−02 ISSUE J A G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A B C D G H J K N S INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 5 4 S 1 2 3 − B− D 5 PL 0.2 (0.008) M B M N J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 NL17SZ32 PACKAGE DIMENSIONS SOT−553 XV5 SUFFIX 5−LEAD PACKAGE CASE 463B−01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. DIM A b c D E e L HE MIN 0.50 0.17 0.08 1.50 1.10 MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 STYLE 1: PIN 1. 2. 3. 4. 5. BASE 1 EMITTER 1/2 BASE 2 COLLECTOR 2 COLLECTOR 1 MIN 0.020 0.007 0.003 0.059 0.043 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 STYLE 2: PIN 1. 2. 3. 4. 5. CATHODE ANODE CATHODE CATHODE CATHODE MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 D − X− 5 4 A L 1 2 3 E −Y− b HE e 5 PL M c XY 0.08 (0.003) SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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