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NL27WZ06DFT2

NL27WZ06DFT2

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TSSOP6

  • 描述:

    IC INVERTER OD 2CH 1-INP SC88

  • 数据手册
  • 价格&库存
NL27WZ06DFT2 数据手册
NL27WZ06 Dual Inverter with Open Drain Outputs The NL27WZ06 is a high performance dual inverter with open drain outputs operating from a 1.65 V to 5.5 V supply. The internal circuit is composed of multiple stages, including an open drain output. The open drain output provides the capability to set the output switching level to a user selectable value with an external resistor and power supply. The logic high output value is set by the external power supply and can be less than, equal or greater than the VCC power supply, provided the voltage supply is less than 5.5 V. http://onsemi.com MARKING DIAGRAMS 6 • • • • • • • • • Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Output Sink Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 Pb−Free Packages are Available 1 M SC−88 DF SUFFIX CASE 419B Features MF M G G 1 6 TSOP−6 DT SUFFIX CASE 318G 1 MF M G G 1 MF = Device Code M = Date Code* G = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT IN A1 GND IN A2 1 6 2 5 3 4 OUT Y1 VCC 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 OUT Y2 FUNCTION TABLE A Input Figure 1. Pinout (Top View) IN A1 1 OUT Y1 IN A2 1 OUT Y2 L H Y Output Z L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Figure 2. Logic Symbol © Semiconductor Components Industries, LLC, 2010 August, 2010 − Rev. 7 1 Publication Order Number: NL27WZ06/D NL27WZ06 MAXIMUM RATINGS Symbol VCC Characteristics Value Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ 7.0 V VI < GND −50 mA VO < GND −50 mA DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Output in Z or LOW State (Note 1) IO DC Output Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C PD Power Dissipation in Still Air SC−88, TSOP−6 200 mW qJA Thermal Resistance SC−88, TSOP−6 333 °C/W TL Lead temperature, 1 mm from case for 10 s 260 °C TJ Junction temperature under bias +150 °C > 2000 > 200 N/A V ±500 mA VESD ILatchup ESD Withstand Voltage Latchup Performance Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 85°C (Note 5) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A 3. Tested to EIA/JESD22−A115−A 4. Tested to JESD22−C101−A 5. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol VCC Parameter Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate Operating Data Retention Only (Z or LOW State) VCC = 2.5 V ±0.2 V VCC =3.0 V ±0.3 V VCC =5.0 V ±0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V −55 +125 °C 0 0 0 20 10 5 ns/V NL27WZ06 DC ELECTRICAL CHARACTERISTICS TA = 25°C VCC −40°C ≤ TA ≤ 85°C (V) Min High−Level Input Voltage 1.65 2.3 to 5.5 0.75 VCC 0.70 VCC VIL Low−Level Input Voltage 1.65 2.3 to 5.5 0.25 VCC 0.30 VCC 0.25 VCC 0.30 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 1.65 to 5.5 ±5.0 ±10.0 mA VOL Low−Level Output Voltage VIN = VIH IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 Symbol Parameter VIH IIN Input Leakage Current IOFF Power Off−Output Leakage Current ICC Quiescent Supply Current Condition Typ Max Min Max 0.75 VCC 0.70 VCC Unit V IOL = 8 mA 2.3 0.22 0.3 0.3 IOL = 12 mA 2.7 0.22 0.4 0.4 IOL = 16 mA 3.0 0.28 0.4 0.4 IOL = 24 mA 3.0 0.38 0.55 0.55 IOL = 32 mA 4.5 0.42 0.55 0.55 VIN or VOUT = VCC or GND 0 to 5.5 ±0.1 ±1.0 mA VOUT = 5.5 V 0 1 10 mA VIN = VCC or GND 5.5 1 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 5000 W, CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns RL = R1= 500 W, CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 W, CL = 50 pF 3.3 ± 0.30 0.8 2.4 3.2 0.8 3.7 RL = R1= 500 W, CL = 50 pF 5.0 ± 0.50 0.5 2.4 3.0 0.5 3.5 RL = R1= 5000 W, CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 RL = R1= 500 W, CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 W, CL = 50 pF 3.3 ± 0.30 0.8 2.1 3.2 0.8 3.7 RL = R1= 500 W, CL = 50 pF 5.0 ± 0.50 0.5 1.2 3.0 0.5 3.5 Parameter Propagation Delay (Figure 3 and 4) Propagation Delay (Figure 3 and 4) −40°C ≤ TA ≤ 85°C ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance (Note 6) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 2.5 pF VCC = 5.5 V, VI = 0 V or VCC 4 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 NL27WZ06 DC ELECTRICAL CHARACTERISTICS TA = 25°C VCC Symbol Parameter Condition (V) Min 0.75 VCC 0.70 VCC −55°C ≤ TA ≤ 125°C Typ Max Min Max High−Level Input Voltage 1.65 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 2.3 to 5.5 0.25 VCC 0.30 VCC 0.25 VCC 0.30 VCC V ILKG Z−State Output Leakage Current VIN = VIL VOUT = VCC or GND 1.65 to 5.5 ±5.0 ±10.0 mA VOL Low−Level Output Voltage VIN = VIH IOL = 100 mA 1.65 to 5.5 0.0 0.1 0.1 V IOL = 3 mA 1.65 0.08 0.24 IIN Input Leakage Current IOFF Power Off−Output Leakage Current ICC Quiescent Supply Current 0.75 VCC 0.70 VCC Unit VIH V IOL = 8 mA 2.3 0.22 0.3 0.35 IOL = 12 mA 2.7 0.22 0.4 0.45 IOL = 16 mA 3.0 0.28 0.4 0.5 IOL = 24 mA 3.0 0.38 0.55 0.65 IOL = 32 mA 4.5 0.42 0.55 0.65 VIN or VOUT = VCC or GND 0 to 5.5 ±0.1 ±1.0 mA VOUT = 5.5 V 0 1 10 mA VIN = VCC or GND 5.5 1 10 mA ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 W TA = 25°C Symbol tPZL tPLZ Condition VCC (V) Min Typ Max Min Max Unit RL = R1= 5000 W, CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 ns RL = R1= 500 W, CL = 50 pF 2.5 ± 0.20 0.8 3.0 3.6 0.8 4.1 RL = R1= 500 W, CL = 50 pF 3.3 ± 0.30 0.8 2.4 3.2 0.8 3.7 RL = R1= 500 W, CL = 50 pF 5.0 ± 0.50 0.5 2.4 3.0 0.5 3.5 RL = R1= 5000 W, CL = 15 pF 1.8 ± 0.15 2.0 5.7 10.5 2.0 11.0 RL = R1= 500 W, CL = 50 pF 2.5 ± 0.20 0.8 3.8 4.5 0.8 5.0 RL = R1= 500 W, CL = 50 pF 3.3 ± 0.30 0.8 2.9 3.2 0.8 3.7 RL = R1= 500 W, CL = 50 pF 5.0 ± 0.50 0.5 1.2 3.0 0.5 3.5 Parameter Propagation Delay (Figure 3 and 4) Propagation Delay (Figure 3 and 4) −55°C ≤ TA ≤ 125°C ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Input Capacitance COUT Output Capacitance CPD Power Dissipation Capacitance (Note 6) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 2.5 pF VCC = 5.5 V, VI = 0 V or VCC 4 pF 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 4 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 4 NL27WZ06 A VCC 50% tPZL GND tPLZ HIGH IMPEDANCE 50% VCC Y VOL +0.3 V Figure 3. Switching Waveforms VCC R1 PULSE GENERATOR DUT RT CL VCC x 2 RL RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit ORDERING INFORMATION Device Package NL27WZ06DFT2 NL27WZ06DFT2G SC−88 SC−88 (Pb−Free) NL27WZ06DTT1 NL27WZ06DTT1G Shipping† TSOP−6 3000 / Tape & Reel TSOP−6 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 NL27WZ06 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE W NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. D e 6 5 4 1 2 3 HE DIM A A1 A3 b C D E e L HE −E− b 6 PL 0.2 (0.008) M E M MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000 NL27WZ06 PACKAGE DIMENSIONS TSOP−6 CASE 318G−02 ISSUE T NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. D 6 HE 1 5 4 2 3 E b e c A 0.05 (0.002) q L A1 DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° − MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 − MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10° SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NL27WZ06/D
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