NL27WZ32US

NL27WZ32 Dual 2−Input OR Gate The NL27WZ32 is a high performance dual 2−input OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ32 Chip Complexity: FET = 120 Pb−Free Package is Available http://onsemi.com MARKING DIAGRAM 8 1 US8 US SUFFIX CASE 493 1 LR M G = Device Code = Date Code* = Pb−Free Package L4 M G G 8 (Note: Microdot may be in either location) 8 *Date Code orientation may vary depending upon manufacturing location. A1 1 VCC B1 2 7 Y1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Y2 3 6 B2 IEEE/IEC A1 B1 A2 B2 w1 Y1 Y2 GND 4 5 A2 Figure 1. Pinout PIN ASSIGNMENT Pin 1 2 3 4 5 6 7 8 Function A1 B1 Y2 GND A2 B2 Y1 VCC A L L H H Figure 2. Logic Symbol FUNCTION TABLE Input Output Y=A+B B L H L H Y L H H H © Semiconductor Components Industries, LLC, 2006 1 April, 2006 − Rev. 6 Publication Order Number: NL27WZ32/D NL27WZ32 MAXIMUM RATINGS Symbol VCC VI VO IIK IOK IO ICC IGND TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 85°C (Note 5) (Note 1) VI < GND VO < GND Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to )7.0 *50 *50 $50 $100 $100 *65 to )150 260 )150 250 250 Level 1 UL 94 V−0 @ 0.125 in > 2000 > 200 N/A $500 V Unit V V V mA mA mA mA mA °C °C °C °C/W mW ILatch−Up Latch−Up Performance mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VI VO TA Dt/DV Supply Voltage Input Voltage Output Voltage Operating Free−Air Temperature Input Transition Rise or Fall Rate VCC = 1.8 V $0.15 V VCC = 2.5 V $0.2 V VCC = 3.0 V $0.3 V VCC = 5.0 V $0.5 V Parameter Operating Data Retention Only (Note 6) (HIGH or LOW State) Min 1.65 1.5 0 0 *40 0 0 0 0 Max 5.5 5.5 5.5 VCC )85 20 20 10 5 Unit V V V °C ns/V 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NL27WZ32 DC ELECTRICAL CHARACTERISTICS VCC Symbol VIH VIL VOH Parameter HIGH Level Input Voltage LOW Level Input Voltage HIGH Level Output Voltage VIN = VIH IOH = −100 mA Condition (V) 1.65 to 1.95 1.65 to 1.95 2.3 to 5.5 1.65 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 1.65 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 0 to 5.5 0.0 5.5 1.55 2.2 2.9 4.4 1.29 1.9 2.4 2.3 3.8 1.65 2.3 3.0 4.5 1.52 2.15 2.8 2.68 4.2 0 0 0 0 0.08 0.1 0.15 0.22 0.22 0.1 0.1 0.1 0.1 0.24 0.3 0.4 0.55 0.55 $0.1 1.0 1.0 $1.0 10 10 mA mA Min 0.75 VCC 0.7 VCC 0.3 VCC 1.55 2.2 2.9 4.4 1.20 1.9 2.4 2.3 3.8 V TA = +255C Typ Max TA = −405C to +855C Min 0.75 VCC 0.7 VCC 0.3 VCC Max Unit V V V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VOL Low−Level Output Voltage VIN = VIL IOL = 100 mA IOH = 4 mA IOH = 8 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA IIN IOFF ICC Input Leakage Current Power OFF Leakage Current Quiescent Supply Current VIN = VCC or GND VIN or VOUT = 5.5 V VIN = VCC or GND AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH tPHL Parameter Propagation Delay (Figure 3 and 4) Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 5.0 $ 0.5 (V) 1.8 $ 0.15 2.5 $ 0.2 3.3 $ 0.3 Min 2.0 1.0 0.8 1.2 0.5 0.8 TA = 255C Typ 8.0 3.5 2.6 3.2 1.9 2.5 Max 9.5 5.8 3.9 4.8 3.1 3.7 *405C v TA v 855C Min 2.0 1.0 0.8 1.2 0.5 0.8 Max 10.5 6.2 4.3 5.2 3.3 4.0 Unit ns CAPACITIVE CHARACTERISTICS Symbol CIN CPD Input Capacitance Power Dissipation Capacitance (Note 7) Parameter Condition VCC = 5.5 V, VI = 0 V or VCC 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC Typical 2.5 9 11 Unit pF pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. http://onsemi.com 3 NL27WZ32 tf = 3 ns 90% 90% 50% 10% tf = 3 ns VCC INPUT GND RL VOH CL OUTPUT INPUT A and B 50% 10% tPHL tPLH OUTPUT Y 50% 50% VOL A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Order Number NL27WZ32US NL27WZ32USG Package Type US8 US8 (Pb−Free) Tape and Reel Size† 178 mm, 3000 Units / Tape & Reel 178 mm, 3000 Units / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZ32 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−02 ISSUE B J −X− A 8 5 −Y− DETAIL E B L 1 4 R S U C H N TXY V P G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC −T− SEATING PLANE D 0.10 (0.004) K M 0.10 (0.004) T R 0.10 TYP M F DETAIL E SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 5 NL27WZ32/D