NL27WZ86US

DATA SHEET www.onsemi.com Dual 2-Input Exclusive-OR Gate NL27WZ86 MARKING DIAGRAMS US8 US SUFFIX CASE 493 The NL27WZ86 is a high performance dual 2−input Exclusive−OR Gate operating from a 1.65 V to 5.5 V supply. Features • • • • • • • • • XXXX ALYW Commercial Designed for 1.65 V to 5.5 V VCC Operation 2.9 ns tPD at VCC = 5 V (typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.0 V Available in US8, UDFN8 and UQFN8 Packages Chip Complexity < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant XX M G NLV Prefix UDFN8, 1.45x1.0 MU3 SUFFIX CASE 517BZ XM 1 UDFN8, 1.95x1.0 MU1 SUFFIX CASE 517CA 1 A1 B1 =1 Y1 A2 B2 =1 Y2 UQFN8, 1.4x1.2 MQ2 SUFFIX CASE 523AS Figure 1. Logic Symbol 1 8 UQFN8, 1.6x1.6 MQ1 SUFFIX CASE 523AN X, XX, XXXX A L Y W M G XM XM 1 1 XX MG = Specific Device Code = Assembly Location = Lot Code = Year Code = Week Code = Date Code = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2011 September, 2022 − Rev. 10 1 Publication Order Number: NL27WZ86/D NL27WZ86 A1 1 8 VCC B1 2 7 Y1 Y2 3 6 B2 GND 4 5 A1 1 8 VCC B1 2 7 Y1 Y2 3 6 B2 A1 7 GND 4 8 A2 US8 4 5 Y2 5 VCC 1 Y1 GND B1 6 A2 2 B2 3 A2 UQFN8 UDFN8 Figure 2. Pinout PIN ASSIGNMENT (US8 / UDFN8) PIN ASSIGNMENT (UQFN8) FUNCTION TABLE Inputs Output Pin Function Pin Function 1 A1 1 Y1 A B Y 2 B1 2 B2 L L L 3 Y2 3 A2 L H H 4 GND 4 GND H L H 5 A2 5 Y2 H H L 6 B2 6 B1 7 Y1 7 A1 8 VCC 8 VCC www.onsemi.com 2 H = HIGH Logic Level L = LOW Logic Level NL27WZ86 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VOUT Characteristics DC Output Voltage (NLV) Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 V DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±100 mA −65 to +150 °C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) US8 UQFN8 UDFN8 250 210 231 °C/W PD Power Dissipation in Still Air US8 UQFN8 UDFN8 500 595 541 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 NL27WZ86 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL Parameter TA = 255C VCC (V) Condition Min Typ −555C 3 TA 3 1255C Max Min Max High−Level Input Voltage (NLV) 1.65 to 1.95 0.75 x VCC 0.70 x VCC 0.70 x VCC High−Level Input Voltage 1.65 to 1.95 0.65 x VCC 0.65 x VCC Low−Level Input Voltage (NLV) 1.65 to 1.95 0.25 x VCC 0.25 x VCC 2.3 to 5.5 0.30 x VCC 0.30 x VCC Low−Level Input Voltage 1.65 to 1.95 0.35 x VCC 0.35 x VCC 2.3 to 5.5 0.30 x VCC 0.30 x VCC 2.3 to 5.5 2.3 to 5.5 0.75 x VCC 0.70 x VCC Units V V 0.70 x VCC V V VOH High−Level Output Voltage VIN = VIH or VIL IOH = −100 mA IOH = −4 mA IOH = −8 mA IOH = −12 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC 1.4 2.1 2.4 2.7 2.5 4.0 − − − − − − − VCC − 0.1 1.29 1.9 2.2 2.4 2.3 3.8 − − − − − − − VOL Low−Level Output Voltage VIN = VIH or VIL IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 − − − − − − − − 0.08 0.2 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 − − − − − − − 0.1 0.24 0.3 0.4 0.4 0.55 0.55 1.65 to 5.5 − − ±0.1 − ±1.0 mA 0 − − 1.0 − 10 mA 5.5 − − 1.0 − 10 mA Input Leakage Current VIN = 5.5 V or GND IOFF IIN Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V ICC Quiescent Supply Current VIN = VCC or GND V V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS TA = 25°C Symbol tPLH, tPHL Parameter Propagation Delay, (A or B) to Y VCC (V) 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 Test Conditions CL = 15 pF RL = 1 MW R1 = Open 4.5 to 5.5 3.0 to 3.6 4.5 to 5.5 CL = 50 pF, RL = 500 W, R1 = Open TA = −55 to 125°C Min Typ Max Min Max Units − 7.9 9.0 − 10.5 ns − 4.1 7.0 − 7.5 − 3.0 4.8 − 5.2 − 2.2 3.5 − 3.8 − 3.8 5.4 − 5.9 − 2.9 4.2 − 4.6 CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VIN = 0 V or VCC 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 9 11 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NL27WZ86 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don’t Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL 1.65 to 1.95 VCC/2 VCC/2 VCC/2 0.15 2.3 to 2.7 VCC/2 VCC/2 VCC/2 0.15 3.0 to 3.6 VCC/2 VCC/2 VCC/2 0.3 4.5 to 5.5 VCC/2 VCC/2 VCC/2 0.3 www.onsemi.com 5 tPZL, tPLZ, tPZH, tPHZ VY, V NL27WZ86 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping† NL27WZ86USG US8 L8 Q4 3000 / Tape & Reel NLV27WZ86USG* US8 L8 Q4 3000 / Tape & Reel Device NL27WZ86MQ1TCG UQFN8, 1.6 x 1.6, 0.5P AC Q1 3000 / Tape & Reel NL27WZ86MU1TCG (In Development) UDFN8, 1.95 x 1.0, 0.5P TBD TBD 3000 / Tape & Reel NL27WZ86MU3TCG (In Development) UDFN8, 1.45 x 1.0, 0.35P TBD TBD 3000 / Tape & Reel NL27WZ86MQT2CG (In Development) UQFN8, 1.4 x 1.2, 0.4P TBD TBD 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 6 NL27WZ86 PACKAGE DIMENSIONS UDFN8, 1.45x1, 0.35P CASE 517BZ ISSUE O ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X 0.48 e/2 e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X 0.53 b 0.10 M C A B 0.05 M C NOTE 3 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 NL27WZ86 PACKAGE DIMENSIONS UDFN8, 1.95x1, 0.5P CASE 517CA ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 7X e/2 e 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 0.49 L 8X 0.30 4 1 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 1 PKG OUTLINE NL27WZ86 PACKAGE DIMENSIONS UQFN8, 1.4x1.2, 0.4P CASE 523AS ISSUE A PIN ONE REFERENCE 2X 2X 0.10 C L1 ÉÉ ÉÉ 0.10 C DETAIL A E ALTERNATE CONSTRUCTIONS EXPOSED Cu (A3) A MOLD CMPD DETAIL B 0.05 C ALTERNATE CONSTRUCTION 0.05 C A1 SIDE VIEW L2 DETAIL A DIM A A1 A3 b D E e L L1 L2 ÉÉ ÇÇ TOP VIEW DETAIL B 8X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. L L A B D 2 C SOLDERING FOOTPRINT* SEATING PLANE 1.61 0.55 L 4 1 e 8 1.40 6 BOTTOM VIEW MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.40 BSC 1.20 BSC 0.40 BSC 0.20 0.40 −−− 0.15 0.30 0.50 6X 1 7X 0.45 b 0.10 M C A B 0.05 M C NOTE 3 8X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS US8 CASE 493 ISSUE F DATE 01 SEP 2021 SCALE 4 :1 GENERIC MARKING DIAGRAM* 8 XX MG G 1 XX M G = Specific Device Code = Date Code = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON04475D US8 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2021 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN−01 ISSUE O 8 1 SCALE 4:1 A B D PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ ÇÇÇ ÇÇÇ ÉÉÉ EXPOSED Cu E A1 DATE 26 NOV 2008 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. MOLD CMPD A3 DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE (0.15) DETAIL A OPTIONAL CONSTRUCTION GENERIC MARKING DIAGRAM* 1 8X 8X L3 L XX MG e 5 3 1 XX = Specific Device Code M = Date Code G = Pb−Free Package 7 8 DETAIL A MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 8X b *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 0.10 C A B BOTTOM VIEW 0.05 C NOTE 3 SOLDERING FOOTPRINT* 1.70 0.50 PITCH 1 0.35 7X 0.25 1.70 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON36348E 8 PIN UQFN, 1.6X1.6, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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