NL3S22UHMUTAG

NL3S22AH, NL3S22UH USB 2.0 + Audio Switch The NL3S22AH/NL3S22UH is a double−pole/double−throw (DPDT) analog switch for routing high speed differential data and audio. The differential channels are compliant with High Speed USB 2.0, Full Speed USB 1.1, Low Speed USB 1.0 and any generic UART protocol. The multi−purpose audio path is capable of passing signals with negative voltages as low as 3 V below ground and features shunt resistors to reduce Pop and Click noise in the audio system. For the NL3S22AH, the audio path (AUDP/AUDN) will be selected with SEL=0 with the device enabled (EN = 1). For the NL3S22UH, the high speed data path (HDP/HDN) will be selected with SEL=0 with the device enabled (EN = 1). Features • • • • • • UQFN10 CASE 488AT Input Signal Range: 0 V to 4.5 V RDS(on): 5.4 W (Typ) CON: 8.7 pF (Typ) Data Rate: USB 2.0–Compliant – up to 480 Mbps Bandwidth: >811 MHz XX MG G XX = AY for NL3S22AHMUTAG = DW for NL3S22UHMUTAG M = Date Code G = Pb−Free Device (Note: Microdot may be in either location) ORDERING INFORMATION Package Shipping† NL3S22AHMUTAG UQFN10 (Pb−Free) 3000 / Tape & Reel NL3S22UHMUTAG UQFN10 (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Audio Path • • • • MARKING DIAGRAM 1 VCC Range: 2.7 V to 3.7 V Control Pins Compatible with 1.8 V Interfaces ICC: 60 mA (Typ) ESD Performance: 2 kV HBM Available in 1.4 mm x 1.8 mm UQFN10 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant High Speed Data Path • • • • • www.onsemi.com Input Signal Range: −3.0 V to 3.0 V RDSON: 0.56 W (Typ) RON(FLAT): 0.004 W (Typ) THD+N: − 113 dB (RL = 32 W / VIS = 1.0 VRMS) − 109 dB (RL = 16 W / VIS = 0.4 VRMS) Applications • • • • • Smartphones Tablets USB 2.0 Hosts/Peripherals Audio / High−Speeds Data Switching USB Type−C Switching © Semiconductor Components Industries, LLC, 2017 July, 2018 − Rev. 3 1 Publication Order Number: NL3S22AH/D NL3S22AH, NL3S22UH VCC HDP D+ AUDP Shunt HDN D− AUDN Shunt EN SEL Control Logic GND Figure 1. Block Diagram FUNCTION TABLE SEL EN NL3S22AH NL3S22UH Shunt Status D+/D− Function 0 X X ON No Connect (Power Down) 1 0 1 OFF AUDP/AUDN 1 1 0 ON HDP/HDN Figure 2. UQFN10 – Top Through View PIN DESCRIPTION Pin Name Pin Description HDP 1 High Speed Differential Data (+) HDN 2 High Speed Differential Data (−) GND 3 Ground AUDN 4 Audio Signal (−) SEL 5 Function Select D− 6 Audio/Data Common I/O (−) D+ 7 Audio/Data Common I/O (+) EN 8 Chip Enable AUDP 9 Audio Signal (+) VCC 10 Power Supply www.onsemi.com 2 NL3S22AH, NL3S22UH MAXIMUM RATINGS Rating Symbol VCC Positive DC Supply Voltage VIS Analog Input/Output Voltage VIN Digital Control Pin Voltage on EN, SEL Value Unit −0.5 to +4.2 V HDP, HDN −0.5 to +5.5 V AUDP, AUDN −3.5 to +4.2 D+, D− −3.5 to +5.5 −0.5 to VCC + 0.5 V Ts Storage Temperature −55 to +150 °C TL Lead Temperature, 1 mm from Case for 10 seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL Moisture Sensitivity (Note 1) ILU Latchup Current (Note 2) ESD ESD Protection (Note 3) Level 1 Human Body Model Charged Device Model ±100 mA 2000 2000 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. 2. Latch up Current Maximum Rating: ±100 mA per JEDEC standard: JESD78. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22−A114 for all pins. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Positive DC Supply Voltage VIS Switch Input / Output Voltage (Note 4) HDP, HDN AUDP, AUDN D+, D− Min Max Unit 2.7 3.7 V 0 4.5 V −3.0 3.0 −3.0 4.5 VIN Digital Control Input Voltage GND VCC V TA Operating Temperature Range −40 +85 °C 4. If the audio channel is not in use, it is recommended that no signals are applied on the audio inputs AUDN and AUDP. www.onsemi.com 3 NL3S22AH, NL3S22UH DC ELECTRICAL CHARACTERISTICS (Typical values are at VCC = +3.6 V and TA = +25°C, unless otherwise specified) −40 ⁰C to 85 ⁰C Parameter Symbol Test Conditions VCC (V) Min Typ Max Unit 3.6 − 60 100 mA − − 1.0 3.6 1.4 − − 2.7 1.3 − − 3.6 − − 0.4 2.7 − − 0.4 POWER SUPPLY ICC Supply Current EN = 1, IIS = 0 mA EN = 0 (Power Down) Control Logic (EN, SEL) VIH VIL Input High Voltage Input Low Voltage V V VIHYS Input Hysteresis 2.7 – 3.6 − 250 − mV IIN Leakage Current 2.7 – 3.6 − − ±100 nA AUDIO SWITCH (AUDP/AUDN e D+/D−) ON−Resistance VIS = −3.0 V to 3.0 V, IIS = 50 mA 3.0 − 0.56 0.73 W DRON ON−Resistance Matching Between Channels VIS = −3.0 V to 3.0 V, IIS = 50 mA 3.0 − 0.07 − W RFLAT(ON) ON Resistance Flatness VIS = −3.0 V to 3.0 V, IIS = 50 mA 3.0 − 0.004 − W 3.6 − 110 200 W RON RSH Shunt Resistance ISW(OFF) OFF−State Leakage EN = 0, VIS = 3.0 V at D+/D− 3.6 − − ±200 nA ISW(ON) ON−State Leakage VIS = 0 V to 3.0 at D+/D−, AUDP = AUDP = open 3.6 − ±2.2 ±3.0 mA ON−Resistance VIS = 0 V to 1.7 V, IIS = 15 mA 3.0 − 5.4 6.63 W DRON ON−Resistance Matching Between Channels VIS = 0 V to 1.7 V, IIS = 15 mA 3.0 − 0.2 − W RFLAT(ON) ON Resistance Flatness VIS = 0 V to 1.7 V, IIS = 15 mA 3.0 − 0.002 − W ISW(OFF) OFF−State Leakage EN = 0, VIS = 0 V to 3.6 V 3.6 − − ±200 nA ISW(ON) ON−State Leakage VIS = 0 V to 3.6 V 3.6 − − ±200 nA DATA SWITCH (HDP/HDN e D+/D−) RON www.onsemi.com 4 NL3S22AH, NL3S22UH AC ELECTRICAL CHARACTERISTICS (Typical values are at VCC = +3.6 V and TA = +25°C) −40 ⁰C to 85 ⁰C Parameter Symbol VCC (V) Min f = 20 Hz to 20 kHz, VIS = 1.0 VRMS, DC Bias = 0 V, RL = 32 W VIS = 0.4 VRMS, DC Bias = 0 V, RL = 16 W 2.7 – 3.6 − From VCC unto AUDP/AUDN, f = 217 Hz, RL = 16 W 2.7 – 3.6 − Test Conditions Typ Max Unit − dB 106 − dB AUDIO SWITCH (AUDP/AUDN e D+/D−) THD PSRR Audio THD Power Supply Ripple Rejection −113 −109 DATA SWITCH (HDP/HDN e D+/D−) CON Equivalent ON−Capacitance Switch ON, f = 1 MHz 3.6 − 8.7 10 pF COFF Equivalent OFF−Capacitance Switch OFF, f = 1 MHz 3.6 − 1.8 − pF Differential Insertion Loss f = 10 MHz 2.7 – 3.6 − −0.5 − dB f = 800 MHz 2.7 – 3.6 − −2.8 − Differential Off−Isolation f = 10 MHz 2.7 – 3.6 − −54 − f = 800 MHz 2.7 – 3.6 − −25 − f = 10 MHz 2.7 – 3.6 − −62 − f = 800 MHz 2.7 – 3.6 − −28 − From VCC unto D+/D−, f = 217 Hz, RL = 50 W 2.7 – 3.6 − 111 − dB − 0.25 − ns − − 2.1 5.1 − − − − 157 53 − − − − 0.3 3.4 − − − − 157 44 − − DIL DISO DCTK PSRR Differential Crosstalk Power Supply Ripple Rejection dB dB DYNAMIC TIMING tPD Propagation Delay (Notes 5 and 6) VNOn or VNCn = 0V, RL = 50 W 2.7 – 3.6 tEN Enable Time, EN to HDx EN to AUDx VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) 2.7 – 3.6 Disable Time, EN to HDx EN to AUDx VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) 2.7 – 3.6 Turn−On Time, SEL to HDx SEL to AUDx VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) 2.7 – 3.6 Turn−Off Time, SEL to HDx SEL to AUDx VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) 2.7 – 3.6 Initialization Time (Notes 5 and 7), VCC to D+/D− VIS = 1 V, RL = 50 W, CL = 7 pF (fixture only) 2.7 – 3.6 150 − − ms Bit to bit skew Within the same differential channel 2.7 – 3.6 − 5 − ps Channel to channel skew Maximum skew between all channels 2.7 – 3.6 − 5 − ps tDIS tON tOFF tINIT tsk(b−b) tsk(ch−ch) ms ns ms ns 5. Guaranteed by design. 6. No other delays than the RC network formed by the load resistance and the load capacitance of the switch are added on the bus. For a 10 pF load, this delay is 5 ns which is much smaller than rise and fall time of typical driving systems. Propagation delays on the bus are determined by the driving circuit on the driving side and its interactions with the load of the driven side. 7. Wait time required after VCC power−up to operating level before data access is valid. www.onsemi.com 5 NL3S22AH, NL3S22UH PARAMETER MEASUREMENT INFORMATION Figure 3. Differential Insertion Loss (SDD21) Figure 4. Differential Off Isolation (SDD21) Figure 5. Differential Crosstalk (SDD21) Figure 6. Bit−to−Bit and Channel−to−Channel Skew tskew = |tPLH1-tPLH2| or |tPHL1-tPHL2| Figure 7. tON and tOFF Figure 9. On State Leakage Figure 8. Off State Leakage www.onsemi.com 6 NL3S22AH, NL3S22UH Operating Level VCC tINIT Transactions Not Valid Transactions Valid Figure 10. tINIT, Initialization Time www.onsemi.com 7 NL3S22AH, NL3S22UH TYPICAL OPERATING CHARACTERISTICS Figure 11. USB 2.0 High Speed Eye Diagram Figure 12. USB 2.0 High Speed Pattern Figure 13. USB 1.1 Full Speed Eye Diagram Figure 14. USB 1.0 Low Speed Eye Diagram Figure 16. Data Switch Differential Insertion Loss Figure 15. Data Path On Resistance www.onsemi.com 8 NL3S22AH, NL3S22UH Figure 17. Data Switch Differential Off−Isolation Figure 18. Data Switch Differential Crosstalk Figure 19. Audio Path On Resistance Figure 20. Audio THD+N (RL = 32 W, VIS = 1.0 VRMS) Figure 21. Audio THD+N (RL = 16 W, VIS = 0.4 VRMS) www.onsemi.com 9 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UQFN10 1.4x1.8, 0.4P CASE 488AT−01 ISSUE A DATE 01 AUG 2007 1 SCALE 5:1 EDGE OF PACKAGE D ÉÉÉ ÉÉÉ ÉÉÉ PIN 1 REFERENCE 2X 2X A 0.10 C L1 E 0.10 C B TOP VIEW A1 0.05 C A1 C SIDE VIEW 3 9X EXPOSED Cu A 0.05 C 10X DETAIL A Bottom View (Optional) 5 ÉÉÉ ÉÉÉ SEATING PLANE DETAIL B Side View (Optional) 6 e 1 10 10 X L3 b A3 DIM A A1 A3 b D E e L L1 L3 MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.127 REF 0.15 0.25 1.40 BSC 1.80 BSC 0.40 BSC 0.30 0.50 0.00 0.15 0.40 0.60 GENERIC MARKING DIAGRAM* XXMG G e/2 L MOLD CMPD NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. XX = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) 0.10 C A B 0.05 C *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. NOTE 3 BOTTOM VIEW MOUNTING FOOTPRINT 1.700 0.0669 0.663 0.0261 0.200 0.0079 9X 0.563 0.0221 1 2.100 0.0827 0.400 0.0157 PITCH DOCUMENT NUMBER: DESCRIPTION: 10 X 0.225 0.0089 SCALE 20:1 98AON22493D mm Ǔ ǒinches Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 10 PIN UQFN, 1.4 X 1.8, 0.4P PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 www.onsemi.com 1 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative