NL7SZ18DFT2

NL7SZ18 1−to−2 Demultiplexer with 3−State Deselected Output The NL7SZ18 is a high−performance non−inverting 1−to−2 demultiplexer. With the Select input [S] at Low, data at A is passed to Y0 and Y1 is set to high impedance. With the Select input [S] at High, data at A is passed to Y1 and Y0 is set to high impedance. The device operates over the voltage range from 1.65 V to 5.5 V. This device has been optimized for on−board buffering applications and offers mixed (1.65 V, 2.3 V, 3.0 V and 5.5 V) voltage capability by providing over voltage tolerance (OVT*) circuitry on I/O pins. Features http://onsemi.com MARKING DIAGRAMS • High−Speed Propagation Delay • • • • • • • • • • tPD 2.5 nS (Typ), Load 50 pF @ 5.0 V Power Down Impedance Outputs in High−Z Output Drive Capability 32 mA @ 5.0 V Broad VCC Operating Range 1.65 V to 5.5 V Surface Mount Technology SC−70, 6−Lead and UDFN6 Packaging OVT* on Inputs/Outputs Pb−Free Package is Available 1 SOT−363/SC70−6/SC−88 DF SUFFIX CASE 419B LD M G G M 1 1 UDFN6 MU SUFFIX CASE 517AA LD, T M G TM G = Device Marking = Date Code* = Pb−Free Package Typical Applications (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. Cell Phones PDAs Digital Cameras Video Cameras PIN ASSIGNMENT S 1 6 Y0 Important Information • ESD Protection: MM >200 V, Human Body Model >2000 V • Latch−Up Max Rating: 300 mA • Pin−to−Pin Compatible with NC7SZ18 *Over Voltage Tolerance (OVT) enables input and output pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. GND 2 5 VCC A 3 (TOP VIEW) 4 Y1 PIN/FUNCTION TABLE Pin A S Y0 Y1 Function Data Input Demultiplexer Select Output 1 Output 2 S L L H H TRUTH TABLE Input A L H L H Y0 L H Z Z Output Y1 Z Z L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2007 February, 2007 − Rev. 7 1 Publication Order Number: NL7SZ18/D NL7SZ18 MAXIMUM RATINGS Rating DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current @ V1 t −0.5 V DC Output Diode Current @ V1 t −0.5 V DC Output Sink Current DC Supply Current per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance (Note 1) Power Dissipation in Still Air at 85°C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Symbol VCC VIN VOUT IIK IOK IOUT ICC IGND TSTG TL TJ qJA PD MSL FR VESD Value −0.5 to +7.0 −0.5 to +7.0 −0.5 to +7.0 −50 −50 "50 "100 "100 −65 to +150 260 +150 250 180 Level 1 UL 94 V−0 @ 0125 in > 2000 > 200 n/a Unit V V V mA mA mA mA mA °C °C °C °C/W mW − − V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Rating DC Supply Voltage DC Supply Voltage, Data Retention Input Voltage Output Voltage Operating Temperature Input Rise and Fall Times VCC @ 1.8 " 0.15 V VCC @ 2.5 " 0.2 V VCC @ 3.3 " 0.3 V VCC @ 5.0 " 0.5 V Symbol VCC VCC VIN VOUT TA tr, tf Value 1.65 to 5.5 1.5 to 5.5 0 to 5.5 0 to 5.5 −40 to 85 0 to 20 0 to 20 0 to 10 0 to 5 350 Unit V V V V °C nS/V Thermal Resistance qJA °C/W ORDERING INFORMATION Device Order Number NL7SZ18DFT2 NL7SZ18DFT2G NL7SZ18MUR2G Package SC70−6 SC70−6 (Pb−Free) UDFN6 (Pb−Free) Shipping † 3000 / Tape & Reel 3000 / Tape & Reel 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 2 NL7SZ18 DC ELECTRICAL CHARACTERISTICS Parameter High−Level Input Voltage Low−Level Output Voltage High−Level Output Voltage VIN = VIH IOH = −100 ma Condition Symbol VIH VIL VOH VCC (V) 1.65−1.95 2.3−5.5 1.65−1.95 2.3−5.5 1.65 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 VOL 1.65 2.3 3.0 4.5 1.65 2.3 3.0 3.0 4.5 IIN IOZ IOFF 0.0 to 5.5 1.65 to 5.5 0.0 1.55 2.20 2.90 4.40 1.29 1.90 2.40 2.30 3.80 1.65 2.30 3.00 4.50 1.52 2.15 2.80 2.68 4.20 0.0 0.0 0.0 0.0 0.08 0.10 0.15 0.22 0.22 0.10 0.10 0.10 0.10 0.24 0.30 0.40 0.55 0.55 "0.1 "0.5 1.0 TA = 255C Min 0.75 VCC 0.70 VCC 0.25 VCC 0.30 VCC 1.55 2.20 2.90 4.40 1.29 1.90 2.40 2.30 3.80 0.10 0.10 0.10 0.10 0.24 0.30 0.40 0.55 0.55 "1.0 "5.0 10 mA mA mA V Typ Max TA = −405C to 855C Min 0.75 VCC 0.70 VCC 0.25 VCC 0.30 VCC Max Unit V V V IOH = −4.0 mA IOH = −8.0 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA Low−Level Output Voltage VIN = VIL IOL = 100 ma IOL = 4.0 mA IOL = 8.0 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA Input Leakage Current Output High−Z Current Power−Off Leakage Current Quiescent Supply Current VIN = 5.5 V, GND VIN = VIH or VIL 0 t Vout v 5.5 V VIN or VCC = 5.5 V VIN = 5.5 V, GND ICC 1.8 to 5.5 1.0 10 mA http://onsemi.com 3 NL7SZ18 AC ELECTRICAL CHARACTERISTICS TA = 255C Parameter Propagation Delay A to Y0 or Y1 Condition CL = 15 pF RD = 1.0 MW S = OPEN CL = 50 pF RD = 500 W S = OPEN Output Enable Time CL = 50 pF RD, RU = 500 W S = GND for tPZH S = VIN for tPZL VI = 2 x VCC CL = 50 pF RD, RD = 500 W S = GND for tPHZ S = VIN for tPLZ VI = 2 x VCC Input Capacitance Output Capacitance Power Dissipation Capacitance Note 5 Figure 2 Figure Figures 1&3 Figures 1&3 Figures 1&3 tPZL tPZH Symbol tPLH tPHL VCC 1.8 " 0.15 2.5 " 0.2 3.3 " 0.3 5.0 " 0.5 3.3 " 0.3 5.0 " 0.5 1.8 " 0.15 2.5 " 0.2 3.3 " 0.3 5.0 " 0.5 Min 2.0 1.0 0.8 0.5 1.2 0.8 3.0 1.8 1.2 0.8 Typ 6.3 3.6 2.7 2.0 3.4 2.5 6.9 4.2 3.2 2.5 Max 10.1 5.7 4.0 3.1 4.9 3.9 12 6.8 5.0 4.0 TA = −405C to 855C Min 2.0 1.0 0.8 0.5 1.2 0.8 3.0 1.8 1.2 0.8 Max 10.5 6.0 4.3 3.3 5.4 4.2 12.5 7.3 5.5 4.3 Unit nS nS nS Figures 1&3 tPLZ tPHZ 1.8 " 0.15 2.5 " 0.2 3.3 " 0.3 5.0 " 0.5 2.5 1.5 0.8 0.3 6.0 4.0 2.9 1.8 10 6.8 4.9 3.5 2.5 1.5 0.8 0.3 10.5 7.1 5.3 3.7 nS CIN COUT CPD OPEN 3.3 3.3 5.0 2.5 4.0 16 19.5 pF pF 5. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at no output loading and operating at 50% duty cycle (see Figure 2). CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCDstatic). VI OPEN GND RU A S CL OUTPUT INPUT RD A VCC A OUTPUT Figure 1. AC Test Circuit CL Includes Load and Stray Capacitance Input PRR = 1.0 MHz; tW = 500 nS Figure 2. ICCD Test Circuit Input = AC Waveform; tr = tf = 1.8 nS PRR = 10 MHz; Duty Cycle = 50% S Input = GND or x http://onsemi.com 4 NL7SZ18 tr = 3 nS 90% 50% 90% 50% 10% tPHL VOH tf = 3 nS VCC A Input 10% tPLH GND 50% Output 50% VOL IR = tF = 3 nS 90% S Input 50% 50% 90% VCC 10% tPZL 10% tPLZ GND Output 50% VOL + 0.3 V tPZH tPHZ VOH − 0.3 V 50% VOL VOH Output Figure 3. AC Waveforms http://onsemi.com 5 NL7SZ18 PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE W D e NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. DIM A A1 A3 b C D E e L HE MILLIMETERS MIN NOM MAX 0.80 0.95 1.10 0.00 0.05 0.10 0.20 REF 0.10 0.21 0.30 0.10 0.14 0.25 1.80 2.00 2.20 1.15 1.25 1.35 0.65 BSC 0.10 0.20 0.30 2.00 2.10 2.20 INCHES NOM MAX 0.037 0.043 0.002 0.004 0.008 REF 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 0.045 0.049 0.053 0.026 BSC 0.004 0.008 0.012 0.078 0.082 0.086 MIN 0.031 0.000 6 5 4 HE 1 2 3 −E− b 6 PL 0.2 (0.008) M E M A3 C A A1 L SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NL7SZ18 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA−01 ISSUE A D A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D E e L L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.00 BSC 1.20 BSC 0.40 BSC 0.30 0.40 0.40 0.50 PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C 0.10 C 10X 0.08 C L2 6X b 0.10 C A B 0.05 C NOTE 3 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ÉÉ ÉÉ ÉÉ 1 6 E TOP VIEW (A3) A SIDE VIEW A1 5X 3 SEATING PLANE MOUNTING FOOTPRINT* 0.42 6X C L 0.22 6X 4 0.40 PITCH e 1.07 DIMENSIONS: MILLIMETERS BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NL7SZ18/D