NLAST44599
Low Voltage Single Supply
Dual DPDT Analog Switch
The NLAST44599 is an advanced CMOS dual−independent
DPDT (double pole−double throw) analog switch, fabricated with
silicon gate CMOS technology. It achieves high−speed propagation
delays and low ON resistances while maintaining CMOS low−power
dissipation. This DPDT controls analog and digital voltages that may
vary across the full power−supply range (from VCC to GND).
The device has been designed so the ON resistance (RON) is much
lower and more linear over input voltage than RON of typical CMOS
analog switches.
The channel−select input structure provides protection when
voltages between 0 V and 5.5 V are applied, regardless of the supply
voltage. This input structure helps prevent device destruction caused
by supply voltage − input/output voltage mismatch, battery backup,
hot insertion, etc.
The NLAST44599 can also be used as a quad 2−to−1 multiplexer−
demultiplexer analog switch with two Select pins that each controls
two multiplexer−demultiplexers.
•
•
•
•
•
•
•
•
•
http://onsemi.com
MARKING
DIAGRAMS
16
QFN−16
MN SUFFIX
CASE 485G
T
ALYWG
G
16
NLAT
4459
ALYWG
G
TSSOP−16
DT SUFFIX
CASE 948F
16
1
Select Pins Compatible with TTL Levels
1
1
Channel Select Input Overvoltage Tolerant to 5.5 V
Fast Switching and Propagation Speeds
A
L
Y
W
G
Break−Before−Make Circuitry
Low Power Dissipation: ICC = 2 A (Max) at TA = 25°C
Diode Protection Provided on Channel Select Input
Improved Linearity and Lower ON Resistance over Input Voltage
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
Latch−up Performance Exceeds 300 mA
ESD Performance: Human Body Model > 2000 V;
Machine Model > 100 V
Chip Complexity: 158 FETs
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
•
• Pb−Free Packages are Available
© Semiconductor Components Industries, LLC, 2010
November, 2010 − Rev. 9
1
Publication Order Number:
NLAST44599/D
NLAST44599
QFN−16 PACKAGE
COM A
NO A0
VCC
NC D1
1
2
3
NC B1
GND
NO C0
COM C
4
COM A
2
16
VCC
COM B
SELECT CD
COM C
14
3
COM D
13
NO D0
5
12
SELECT CD
COM B
6
11
NC C1
NC B1
7
10
COM C
GND
8
9
NO C0
ELECT AB
4
NO B0
NC A1
2
NO B0
2/3
3
NC B1
X1
0
NO C0
1
NC C1
2
NO D0
3
NC D1
0/1
COM D
U
NC A1
1
0/1
NC D1
U
15
NO A0
U
1
0
U
NO A0
U
COM A
U
TSSOP−16 PACKAGE
X1
U
5
6
7
8
SELECT AB
U
NC C1
NC to COM
NO to COM
U
SCD
L
H
U
NO D0
ON Channel
U
See TSSOP−16
Switch Configuration
COM D
Select AB or CD
U
13
9
COM B
14
10
NO B0
15
11
SAB
16
12
NC A1
FUNCTION TABLE
2/3
Figure 2. IEC Logic Symbol
Figure 1. Logic Diagram
http://onsemi.com
2
NLAST44599
MAXIMUM RATINGS
Symbol
Parameter
VCC
Positive DC Supply Voltage
VIS
Analog Input Voltage (VNO or VCOM)
VIN
Digital Select Input Voltage
IIK
DC Current, Into or Out of Any Pin
PD
Power Dissipation in Still Air
TSTG
Storage Temperature Range
TL
Value
Unit
*0.5 to )7.0
V
*0.5 ≤ VIS ≤ VCC )0.5
V
*0.5 ≤ VI ≤ )7.0
V
$50
mA
800
450
mW
*65 to )150
°C
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
Human Body Model (Note 1)
Machine Model (Note 2)
Charged Device Model (Note 3)
2000
100
1000
ILATCH−UP
Latch−Up Performance
Above VCC and Below GND at 125°C (Note 4)
$300
mA
JA
Thermal Resistance
80
164
°C/W
QFN−16
TSSOP−16
Level 1
Oxygen Index: 30% − 35%
UL−94−VO (0.125 in)
QFN−16
TSSOP−16
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
4. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
2.0
5.5
V
VCC
DC Supply Voltage
VIN
Digital Select Input Voltage
GND
5.5
V
VIS
Analog Input Voltage (NC, NO, COM)
GND
VCC
V
TA
Operating Temperature Range
*55
)125
°C
tr, tf
Input Rise or Fall Time, SELECT
0
0
100
20
ns/V
VCC = 3.3 V $ 0.3 V
VCC = 5.0 V $ 0.5 V
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80°C
117.8
TJ = 90°C
1,032,200
TJ = 100°C
80
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110°C
Time, Years
TJ = 120°C
Time, Hours
TJ = 130°C
Junction
Temperature °C
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
http://onsemi.com
3
NLAST44599
DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Condition
VCC
*555C to 255C
t855C
t1255C
Unit
VIH
Minimum High−Level Input
Voltage, Select Inputs
3.0
4.5
5.5
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
V
VIL
Maximum Low−Level Input
Voltage, Select Inputs
3.0
4.5
5.5
0.5
0.8
0.8
0.5
0.8
0.8
0.5
0.8
0.8
V
IIN
Maximum Input Leakage
Current
VIN = 5.5 V or GND
5.5
$0.2
$2.0
$2.0
A
IOFF
Power Off Leakage Current,
Select Inputs
VIN = 5.5 V or GND
0
$10
$10
$10
A
ICC
Maximum Quiescent Supply
Current
Select and VIS = VCC or GND
5.5
4.0
4.0
8.0
A
DC ELECTRICAL CHARACTERISTICS − Analog Section
Guaranteed Limit
Symbol
Parameter
Condition
VCC
*555C to 255C
t855C
t1255C
Unit
RON
Maximum “ON” Resistance
(Figures 17 − 23)
VIN = VIL or VIH
VIS = GND to VCC
IINI v 10.0 mA
2.5
3.0
4.5
5.5
85
45
30
25
95
50
35
30
105
55
40
35
RFLAT
(ON)
ON Resistance Flatness
(Figures 17 − 23)
VIN = VIL or VIH
IINI v10.0 mA
VIS = 1 V, 2 V, 3.5 V
4.5
4
4
5
INC(OFF)
INO(OFF)
NO or NC Off Leakage
Current (Figure 9)
VIN = VIL or VIH
VNO or VNC = 1.0 VCOM 4.5 V
5.5
1
10
100
nA
ICOM(ON)
COM ON Leakage Current
(Figure 9)
VIN = VIL or VIH
VNO 1.0 V or 4.5 V with VNC floating or
VNO 1.0 V or 4.5 V with VNO floating
VCOM = 1.0 V or 4.5 V
5.5
1
10
100
nA
http://onsemi.com
4
NLAST44599
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Maximum Limit
Symbol
Parameter
VCC
VIS
*555C to 255C
t855C
t1255C
Test Conditions
(V)
(V)
Min
Typ*
Max
Min
Max
Min
Max
Unit
tON
Turn−On Time
(Figures 12 and 13)
RL = 300 CL = 35 pF
(Figures 5 and 6)
2.5
3.0
4.5
5.5
2.0
2.0
3.0
3.0
5
5
2
2
23
16
11
9
35
24
16
14
5
5
2
2
38
27
19
17
5
5
2
2
41
30
22
20
ns
tOFF
Turn−Off Time
(Figures 12 and 13)
RL = 300 CL = 35 pF
(Figures 5 and 6)
2.5
3.0
4.5
5.5
2.0
2.0
3.0
3.0
1
1
1
1
7
5
4
3
12
10
6
5
1
1
1
1
15
13
9
8
1
1
1
1
18
16
12
11
ns
tBBM
Minimum Break−Before−Make
Time
VIS = 3.0 V (Figure 4)
RL = 300 CL = 35 pF
2.5
3.0
4.5
5.5
2.0
2.0
3.0
3.0
1
1
1
1
12
11
6
5
1
1
1
1
1
1
1
1
ns
*Typical Characteristics are at 25°C.
Typical @ 25, VCC = 5.0 V
CIN
CNO or CNC
CCOM
C(ON)
Maximum Input Capacitance, Select Input
Analog I/O (Switch Off)
Common I/O (Switch Off)
Feedthrough (Switch On)
8
10
10
20
pF
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
Symbol
Parameter
Condition
VCC
Typical
V
255C
Unit
BW
Maximum On−Channel *3 dB Bandwidth or
Minimum Frequency Response
(Figure 11)
VIN = 0 dBm
VIN centered between VCC and GND
(Figure 7)
3.0
4.5
5.5
145
170
175
MHz
VONL
Maximum Feedthrough On Loss
VIN = 0 dBm @ 100 kHz to 50 MHz
VIN centered between VCC and GND
(Figure 7)
3.0
4.5
5.5
−3
−3
−3
dB
VISO
Off−Channel Isolation
(Figure 10)
f = 100 kHz; VIS = 1 V RMS
VIN centered between VCC and GND
(Figure 7)
3.0
4.5
5.5
−93
−93
−93
dB
Q
Charge Injection Select Input to Common I/O
(Figure 15)
VIN = VCC to GND, FIS = 20 kHz
tr = tf = 3 ns
RIS = 0 , CL = 1000 pF
Q = CL * VOUT (Figure 8)
3.0
5.5
1.5
3.0
pC
THD
Total Harmonic Distortion
THD ) Noise
(Figure 14)
FIS = 20 Hz to 100 kHz, RL = Rgen = 600 ,
CL = 50 pF
VIS = 5.0 VPP sine wave
5.5
0.1
Channel to Channel Crosstalk
f = 100 kHz; VIS = 1 V RMS
VIN centered between VCC and GND
(Figure 7)
5.5
3.0
−90
−90
VCT
http://onsemi.com
5
%
dB
NLAST44599
VCC
DUT
VCC
Input
Output
GND
VOUT
0.1 F
300
tBMM
35 pF
90%
90% of VOH
Output
Switch Select Pin
GND
Figure 4. tBBM (Time Break−Before−Make)
VCC
DUT
VCC
0.1 F
Input
Output
50%
VOUT
Open
50%
0V
300
VOH
35 pF
90%
90%
Output
VOL
Input
tON
tOFF
Figure 5. tON/tOFF
VCC
VCC
Input
DUT
Output
50%
300
VOUT
Open
50%
0V
VOH
35 pF
Output
10%
VOL
Input
tOFF
Figure 6. tON/tOFF
http://onsemi.com
6
10%
tON
NLAST44599
50
DUT
Reference
Transmitted
Input
Output
50 Generator
50
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is
the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction.
ǒVVOUT
Ǔ for VIN at 100 kHz
IN
VOUT
Ǔ for VIN at 100 kHz to 50 MHz
VONL = On Channel Loss = 20 Log ǒ
VIN
VISO = Off Channel Isolation = 20 Log
Bandwidth (BW) = the frequency 3 dB below VONL
VCT = Use VISO setup and test to all other switch analog input/outputs terminated with 50
Figure 7. Off Channel Isolation/On Channel Loss (BW)/Crosstalk
(On Channel to Off Channel)/VONL
DUT
VCC
VIN
Output
Open
GND
CL
Output
Off
On
VIN
Figure 8. Charge Injection: (Q)
100
LEAKAGE (nA)
10
1
0.1
ICOM(ON)
ICOM(OFF)
0.01
0.001
−55
VCC = 5.0 V
INO(OFF)
−20
25
70
85
TEMPERATURE (°C)
Figure 9. Switch Leakage vs. Temperature
http://onsemi.com
7
125
Off
VOUT
NLAST44599
+15
0
1.0
2.0
−20
+10
Bandwidth
(ON−RESPONSE)
+5
3.0
−40
4.0
(dB)
(dB)
Off Isolation
−60
VCC = 5.0 V
TA = 25°C
−80
−100
0.01
0.1
−10
6.0
−15
7.0
−20
8.0
9.0
10.0
0.01
100 200
1
10
FREQUENCY (MHz)
25
20
20
TIME (ns)
TIME (ns)
25
15
tON (ns)
tOFF (ns)
0
2.5
3
3.5
4
−30
0.1
1
−35
100 300
10
Figure 11. Typical Bandwidth and Phase Shift
30
5
−25
VCC = 5.0 V
TA = 25°C
FREQUENCY (MHz)
30
10
−5
5.0
Figure 10. Off−Channel Isolation
4.5
VCC = 4.5 V
15
10
tON
5
tOFF
0
−55
5
−40
25
85
125
VCC (VOLTS)
Temperature (°C)
Figure 12. tON and tOFF vs. VCC at 255C
Figure 13. tON and tOFF vs. Temp
1
3.0
VINpp = 3.0 V
VCC = 3.6 V
2.5
2.0
Q (pC)
THD + NOISE (%)
0
PHASE SHIFT
PHASE (°)
0
0.1
VINpp = 5.0 V
VCC = 5.5 V
VCC = 5 V
1.5
1.0
0.5
VCC = 3 V
0
0.01
1
10
−0.5
0
100
1
2
3
4
FREQUENCY (kHz)
VCOM (V)
Figure 14. Total Harmonic Distortion
Plus Noise vs. Frequency
Figure 15. Charge Injection vs. COM Voltage
http://onsemi.com
8
5
NLAST44599
100
100
VCC = 2.0 V
10
80
RON ()
1
ICC (nA)
0.1
0.01
60
VCC = 2.5 V
40
VCC = 3.0 V
0.001
VCC = 3.0 V
VCC = 4.0 V
20
0.0001
VCC = 5.0 V
0.00001
−40
−20
0
20
60
VCC = 5.5 V
80
100
0
0.0
120
80
70
70
60
60
RON ()
80
50
40
125°C
30
20
10
85°C
0.5
40
25°C
20
−55°C
1.0
1.5
2.0
0
0.0
2.5
−55°C
85°C
125°C
0.5
1.0
1.5
VIS (VDC)
2.0
2.5
3.0
VIS (VDC)
Figure 18. RON vs Temp, VCC = 2.0 V
Figure 19. RON vs. Temp, VCC = 2.5 V
30
50
45
25
40
35
20
30
RON ()
RON ()
6.0
50
30
25°C
25
20
125°C
15
15
10
85°C
10
0
0.0
5.0
Figure 17. RON vs. VCC, Temp = 255C
90
5
4.0
Figure 16. ICC vs. Temp, VCC = 3 V and 5 V
100
RON ()
3.0
VIS (VDC)
90
0
0.0
2.0
Temperature (°C)
100
10
1.0
−55°C
0.5
5
25°C
1.0
1.5
2.0
2.5
3.0
3.5
0
0.0
25°C
85°C
125°C
−55°C
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VIS (VDC)
VIS (VDC)
Figure 21. RON vs. Temp, VCC = 4.5 V
Figure 20. RON vs. Temp, VCC = 3.0 V
http://onsemi.com
9
4.5
NLAST44599
25
25
125°C
20
20
RON ()
RON ()
125°C
15
25°C
10
−55°C
85°C
5
0
0.0
15
25°C
10
85°C
−55°C
5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
5.0
VIS (VDC)
VIS (VDC)
Figure 22. RON vs. Temp, VCC = 5.0 V
Figure 23. RON vs. Temp, VCC = 5.5 V
DEVICE ORDERING INFORMATION
Device Nomenclature
Circuit
Indicator
Technology
Device
Function
Package
Suffix
NLAST44599DT
NL
AS
44599
DT
NLAST44599DTR2
NL
AS
44599
DT
NLAST44599MN
NL
AS
44599
NLAST44599MNG
NL
AS
NLAST44599MNR2
NL
NLAST44599MNR2G
NL
Device Order
Number
Tape and Reel
Suffix
Package Type
Shipping†
TSSOP−16*
96 Unit / Rail
TSSOP−16*
2500 / Tape & Reel
MN
QFN−16
124 Unit Rail
44599
MN
QFN−16
(Pb−Free)
124 Unit Rail
AS
44599
MN
R2
QFN−16
2500 / Tape & Reel
AS
44599
MN
R2
QFN−16
(Pb−Free)
2500 / Tape & Reel
R2
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485G
ISSUE G
1
SCALE 2:1
DATE 08 OCT 2021
GENERIC
MARKING DIAGRAM*
XXXXX
XXXXX
ALYWG
G
XXXXX
A
L
Y
W
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
DOCUMENT NUMBER:
DESCRIPTION:
98AON04795D
QFN16 3X3, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSSOP−16
CASE 948F−01
ISSUE B
16
DATE 19 OCT 2006
1
SCALE 2:1
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
K
S
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
N
8
1
0.25 (0.010)
M
0.15 (0.006) T U
S
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
7.06
16
XXXX
XXXX
ALYW
1
1
0.65
PITCH
16X
0.36
DOCUMENT NUMBER:
DESCRIPTION:
16X
1.26
98ASH70247A
TSSOP−16
DIMENSIONS: MILLIMETERS
XXXX
A
L
Y
W
G or G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
工商网监
湘ICP备2023018690号
