DATA SHEET
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1-Bit 100 Mb/s Configurable
Dual-Supply Level
Translator
MARKING
DIAGRAMS
P
M
D
UDFN6, 1.2 x 1.0
MU SUFFIX
CASE 517AA
M
1
NLSX5011
The NLSX5011 is a 1-bit configurable dual-supply autosensing
bidirectional level translator that does not require a direction control
pin. The I/O VCC- and I/O VL-ports are designed to track two
different power supply rails, VCC and VL respectively. Both the VCC
and the VL supply rails are configurable from 0.9 V to 4.5 V. This
allows a logic signal on the VL side to be translated to either a higher
or a lower logic signal voltage on the VCC side, and vice-versa.
The NLSX5011 offers the feature that the values of the VCC and VL
supplies are independent. Design flexibility is maximized because
VL can be set to a value either greater than or less than the VCC
supply. In contrast, the majority of competitive auto sense translators
have a restriction that the value of the VL supply must be equal to less
than (VCC - 0.4) V.
The NLSX5011 has high output current capability, which allows
the translator to drive high capacitive loads such as most high
frequency EMI filters. Another feature of the NLSX5011 is that each
I/O_VLn and I/O_VCCn channel can function as either an input or an
output.
An Output Enable (EN) input is available to reduce the power
consumption. The EN pin can be used to disable both I/O ports by
putting them in 3-state which significantly reduces the supply current
from both VCC and VL. The EN signal is referenced to the VL supply.
UDFN6, 1.45 x 1.0
AMU SUFFIX
CASE 517AQ
1
2, P, D = Specific Device Code
M = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information in the ordering
information section on page 2 of this data sheet.
Features
• Wide VCC, VL Operating Range: 0.9 V to 4.5 V
• VL and VCC are independent
− VL may be greater than, equal to, or less than VCC
• High 100 pF Capacitive Drive Capability
• High−Speed with 140 Mb/s Guaranteed Date Rate
•
•
•
•
•
•
for VCC, VL > 1.8 V
Low Bit−to−Bit Skew
Overvoltage Tolerant Enable and I/O Pins
Non−preferential Power−Up Sequencing
Power−Off Protection
Small UDFN6 Packaging
These are Pb−Free Devices
Typical Applications
• Mobile Phones, PDAs, Other Portable Devices
Important Information
• ESD Protection for All Pins:
♦
HBM (Human Body Model) > 8000 V
© Semiconductor Components Industries, LLC, 2015
April, 2022 − Rev. 7
1
Publication Order Number:
NLSX5011/D
NLSX5011
P
One−Shot
VL
+1.8V
R1
+3.6V
VL
+1.8 V System
I/O1
I/On
GND OE
NLSX5011
I/O VL1
VCC
N
One−Shot
VCC
+3.6 V System
I/O VCC1
I/O1
I/O VLn I/O VCCn
EN
GND
I/On
I/O VL
I/O VCC
P
One−Shot
R2
GND
N
One−Shot
Figure 1. Typical Application Circuit
2.5 V
mC
GPIO
ANO
VL
NLSX5011
I/O VL1
VCC
I/O VCC1
Figure 2. Simplified Functional Diagram (1 I/O Line)
3.0 V
2.5 V
Peripheral
mC
GPIO
EN
GND
EN
ANO
Figure 3. Application Example for VL < VCC
1.8 V
VL
NLSX5011
I/O VL1
EN
VCC
I/O VCC1
Peripheral
EN
GND
Figure 4. Application Example for VL > VCC
ORDERING INFORMATION
Device
NLSX5011AMUTAG
NLSX5011AMUTBG
NLSX5011AMUTCG
NLSX5011MUTCG
Package
UDFN6,
1.45x1.0, 0.5P
(Pb−Free)
UDFN6,
1.2x1.0, 0.4P
(Pb−Free)
Marking
Pin 1 Orientation
D with 90 degree clockwise rotation
Pin 1 Toward Upper Left
2 with 270 degree clockwise rotation
Pin 1 Toward Upper Right
D with 90 degree clockwise rotation
Pin 1 Toward Lower Left
P with 90 degree clockwise rotation
Pin 1 Toward Lower Left
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2
Shipping†
3000 / Tape & Reel
NLSX5011
VL
EN
VCC GND
I/O VL
VL
1
6
VCC
GND
2
5
EN
I/O VL
3
4
I/O VCC
I/O VCC
UDFN6
(Top View)
Figure 5. Logic Diagram
Figure 6. Pin Assignments
PIN ASSIGNMENT
Pins
FUNCTION TABLE
Description
EN
Operating Mode
VCC
VCC Input Voltage
L
Hi−Z
VL
VL Input Voltage
H
I/O Buses Connected
GND
Ground
EN
Output Enable
I/O VCCn
I/O Port, Referenced to VCC
I/O VLn
I/O Port, Referenced to VL
MAXIMUM RATINGS
Symbol
Parameter
Value
Condition
Unit
VCC
High−side DC Supply Voltage
−0.5 to +5.5
V
VL
Low−side DC Supply Voltage
−0.5 to +5.5
V
I/O VCC
VCC−Referenced DC Input/Output Voltage
−0.5 to +5.5
V
I/O VL
VL−Referenced DC Input/Output Voltage
−0.5 to +5.5
V
VI
Enable Control Pin DC Input Voltage
−0.5 to +5.5
IIK
DC Input Diode Current
−50
VI < GND
mA
IOK
DC Output Diode Current
−50
VO < GND
mA
ICC
DC Supply Current Through VCC
$100
mA
IL
DC Supply Current Through VL
$100
mA
IGND
DC Ground Current Through Ground Pin
$100
mA
TSTG
Storage Temperature
−65 to +150
°C
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
VCC
High−side Positive DC Supply Voltage
0.9
4.5
V
VL
Low−side Positive DC Supply Voltage
0.9
4.5
V
VI
Enable Control Pin Voltage
GND
4.5
V
VIO
Bus Input/Output Voltage
GND
GND
4.5
4.5
V
TA
Operating Temperature Range
−55
+125
°C
0
10
ns
Dt/DV
Parameter
I/O VCC
I/O VL
Input Transition Rise or Rate
VI, VIO from 30% to 70% of VCC; VCC = 3.3 V $ 0.3 V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
Recommended Operating Ranges limits may affect device reliability.
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3
NLSX5011
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Max
Min
Max
Unit
VCC (V)
(Note 2)
VL (V)
(Note 3)
I/O VCC Input HIGH Voltage
0.9 – 4.5
0.9 – 4.5
2/3 *
VCC
−
−
2/3 *
VCC
−
V
VILC
I/O VCC Input LOW Voltage
0.9 – 4.5
0.9 – 4.5
−
−
1/3 *
VCC
−
1/3 *
VCC
V
VIHL
I/O VL Input HIGH Voltage
0.9 – 4.5
0.9 – 4.5
2/3 *
VL
−
−
2/3 * VL
−
V
VILL
I/O VL Input LOW Voltage
0.9 – 4.5
0.9 – 4.5
−
−
1/3 *
VL
−
1/3 * VL
V
VIH
Control Pin Input HIGH Voltage
TA = +25°C
0.9 – 4.5
0.9 – 4.5
2/3 *
VL
−
−
2/3 * VL
−
V
VIL
Control Pin Input LOW Voltage
TA = +25°C
0.9 – 4.5
0.9 – 4.5
−
−
1/3 *
VL
−
1/3 * VL
V
VOHC
I/O VCC Output HIGH Voltage
I/O VCC source
current = 20 mA
0.9 – 4.5
0.9 – 4.5
0.9 *
VCC
−
−
0.9 *
VCC
−
V
VOLC
I/O VCC Output LOW Voltage
I/O VCC sink
current = 20 mA
0.9 – 4.5
0.9 – 4.5
−
−
0.2
−
0.2
V
VOHL
I/O VL Output HIGH Voltage
I/O VL source
current = 20 mA
0.9 – 4.5
0.9 – 4.5
0.9 *
VL
−
−
0.9 * VL
−
V
VOLL
I/O VL Output LOW Voltage
I/O VL sink current
= 20 mA
0.9 – 4.5
0.9 – 4.5
−
−
0.2
−
0.2
V
IQVCC
VCC Supply Current
EN = VL, IO = 0 A,
(I/O VCC = 0 V or
VCC, I/O VL = float)
or
(I/O VCC = float, I/O
VL = 0 V or VL)
0.9 – 4.5
0.9 – 4.5
−
−
1
−
2.5
mA
0.9 – 4.5
0.9 – 4.5
−
−
1
−
2.5
mA
TA = +25°C,
EN = 0 V
(I/O VCC = 0 V or
VCC, I/O VL = float)
or
(I/O VCC = float, I/O
VL = 0 V or VL)
0.9 – 4.5
0.9 – 4.5
−
−
0.5
−
1.5
mA
0.9 – 4.5
0.9 – 4.5
−
−
0.5
−
1.5
mA
TA = +25°C,
EN = 0V
0.9 – 4.5
0.9 – 4.5
−
−
±1
−
±1.5
mA
Symbol
Parameter
VIHC
IQVL
ITS−VCC
VL Supply Current
VCC Tristate Output Mode
Supply Current
ITS−VL
VL Tristate Output Mode
Supply Current
IOZ
I/O Tristate Output Mode
Leakage Current
II
Control Pin Input Current
IOFF
Power Off Leakage Current
Test Conditions
(Note 1)
−555C to +1255C
Typ
(Note 4)
Min
TA = +25°C
0.9 – 4.5
0.9 – 4.5
−
−
±1
−
±1
mA
I/O VCC = 0 to 4.5V,
0
0
−
−
1
−
1.5
mA
I/O VL = 0 to 4.5 V
0.9 – 4.5
0
−
−
1
−
1.5
0
0.9 – 4.5
−
−
1
−
1.5
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Normal test conditions are VI = 0 V, CIOVCC ≤ 15 pF and CIOVL ≤ 15 pF, unless otherwise specified.
2. VCC is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
3. VL is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
4. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25°C. All units are production tested at TA = +25°C. Limits over the operating
temperature range are guaranteed by design.
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4
NLSX5011
TIMING CHARACTERISTICS
−555C to +1255C
Symbol
Parameter
Test Conditions
(Note 5)
VCC (V)
(Note 6)
VL (V)
(Note 7)
Min
Typ
(Note 8)
Max
Unit
0.9 – 4.5
0.9 – 4.5
−
−
8.5
nS
1.8 – 4.5
1.8 – 4.5
−
−
3.5
0.9 – 4.5
0.9 – 4.5
−
−
8.5
1.8 – 4.5
1.8 – 4.5
−
−
3.5
0.9 – 4.5
0.9 – 4.5
−
−
8.5
1.8 – 4.5
1.8 – 4.5
−
−
3.5
0.9 – 4.5
0.9 – 4.5
−
−
8.5
1.8 – 4.5
1.8 – 4.5
−
−
3.5
tR−VCC
I/O VCC Rise Time
CIOVCC = 15 pF
tF−VCC
I/O VCC Fall Time
CIOVCC = 15 pF
tR−VL
tF−VL
ZOVCC
ZOVL
I/O VL Rise Time
I/O VL Fall Time
CIOVL = 15 pF
CIOVL = 15 pF
nS
nS
nS
I/O VCC One−Shot
Output Impedance
(Note 9)
0.9
1.8
4.5
0.9 – 4.5
−
−
−
37
20
6.0
−
−
−
W
I/O VL One−Shot Output Impedance
(Note 9)
0.9
1.8
4.5
0.9 – 4.5
−
−
−
37
20
6.0
−
−
−
W
CIOVCC = 15 pF
0.9 – 4.5
0.9 – 4.5
−
−
35
nS
1.8 – 4.5
1.8 – 4.5
−
−
10
0.9 – 4.5
0.9 – 4.5
−
−
35
1.8 – 4.5
1.8 – 4.5
−
−
10
1.0 – 4.5
1.0 – 4.5
−
−
37
1.8 – 4.5
1.8 – 4.5
−
−
11
1.2 – 4.5
1.2 – 4.5
−
−
40
1.8 – 4.5
1.8 – 4.5
−
−
13
0.9 – 4.5
0.9 – 4.5
−
−
35
1.8 – 4.5
1.8 – 4.5
−
−
10
0.9 – 4.5
0.9 – 4.5
−
−
35
1.8 – 4.5
1.8 – 4.5
−
−
10
1.0 – 4.5
1.0 – 4.5
−
−
37
1.8 – 4.5
1.8 – 4.5
−
−
11
1.2 – 4.5
1.2 – 4.5
−
−
40
1.8 – 4.5
1.8 – 4.5
−
−
13
tPD_VL−VCC Propagation Delay
(Driving I/O VCC)
CIOVCC = 30 pF
CIOVCC = 50 pF
CIOVCC = 100 pF
tPD_VCC−VL Propagation Delay
(Driving I/O VL)
CIOVL = 15 pF
CIOVL = 30 pF
CIOVL = 50 pF
CIOVL = 100 pF
nS
tSK
Channel−to−Channel
Skew
CIOVCC = 15 pF, CIOVL = 15 pF
(Note 9)
0.9 – 4.5
0.9 – 4.5
−
−
0.15
nS
IIN_PEAK
Input Driver Maximum
Peak Current
EN = VL;
I/O_VCC = 1 MHz Square Wave,
Amplitude = VCC, or
I/O_VL = 1 MHz Square Wave,
Amplitude = VL (Note 9)
0.9 – 4.5
0.9 – 4.5
−
−
5.0
mA
5.
6.
7.
8.
Normal test conditions are VI = 0 V, CIOVCC ≤ 15 pF and CIOVL ≤ 15 pF, unless otherwise specified.
VCC is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
VL is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25°C. All units are production tested at TA = +25°C. Limits over the operating
temperature range are guaranteed by design.
9. Guaranteed by design.
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5
NLSX5011
TIMING CHARACTERISTICS (continued)
−555C to +1255C
Symbol
tEN−VCC
tEN−VL
I/O_VCC Output Enable Time
I/O_VL Output Enable Time
tDIS−VCC I/O_VCC Output Disable Time
tDIS−VL
MDR
Test Conditions
(Note 10)
VCC (V)
(Note 11)
VL (V)
(Note 12)
Min
Typ
(Note 13)
Max
Unit
tPZH
CIOVCC = 15 pF,
I/O_VL = VL
0.9 – 4.5
0.9 – 4.5
−
−
160
nS
tPZL
CIOVCC = 15 pF,
I/O_VL = 0 V
0.9 – 4.5
0.9 – 4.5
−
−
130
tPZH
CIOVL = 15 pF,
I/O_VCC = VCC
0.9 – 4.5
0.9 – 4.5
−
−
160
tPZL
CIOVL = 15 pF,
I/O_VCC = 0 V
0.9 – 4.5
0.9 – 4.5
−
−
130
tPHZ
CIOVCC = 15 pF,
I/O_VL = VL
0.9 – 4.5
0.9 – 4.5
−
−
210
tPLZ
CIOVCC = 15 pF,
I/O_VL = 0 V
0.9 – 4.5
0.9 – 4.5
−
−
175
tPHZ
CIOVL = 15 pF,
I/O_VCC = VCC
0.9 – 4.5
0.9 – 4.5
−
−
210
tPLZ
CIOVL = 15 pF,
I/O_VCC = 0 V
0.9 – 4.5
0.9 – 4.5
−
−
175
CIO = 15 pF
0.9 – 4.5
0.9 – 4.5
50
−
−
1.8 – 4.5
1.8 – 4.5
140
−
−
0.9 – 4.5
0.9 – 4.5
40
−
−
1.8 – 4.5
1.8 – 4.5
120
−
−
1.0 – 4.5
1.0 – 4.5
30
−
−
1.8 – 4.5
1.8 – 4.5
100
−
−
1.2 – 4.5
1.2 – 4.5
20
−
−
1.8 – 4.5
1.8 – 4.5
60
−
−
Parameter
I/O_VL Output Disable Time
Maximum Data Rate
CIO = 30 pF
CIO = 50 pF
CIO = 100 pF
nS
nS
nS
mbps
10. Normal test conditions are VI = 0 V, CIOVCC ≤ 15 pF and CIOVL ≤ 15 pF, unless otherwise specified.
11. VCC is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
12. VL is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
13. Typical values are for VCC = +2.8 V, VL = +1.8 V and TA = +25°C. All units are production tested at TA = +25°C. Limits over the operating
temperature range are guaranteed by design.
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6
NLSX5011
DYNAMIC POWER CONSUMPTION (TA = +25°C)
Symbol
Parameter
CPD_VL
VL = Input port,
VCC = Output Port
VCC = Input port,
VL = Output Port
CPD_VCC
VL = Input port,
VCC = Output Port
VCC = Input port,
VL = Output Port
Test Conditions
CLoad = 0, f = 1 MHz,
EN = VL (outputs enabled)
CLoad = 0, f = 1 MHz,
EN = VL (outputs enabled)
CLoad = 0, f = 1 MHz,
EN = VL (outputs enabled)
CLoad = 0, f = 1 MHz,
EN = VL (outputs enabled)
VCC (V)
(Note 14)
VL (V)
(Note 15)
Typ
(Note 16)
Unit
0.9
4.5
39
pF
1.5
1.8
20
1.8
1.5
17
1.8
1.8
14
1.8
2.8
13
2.5
2.5
14
2.8
1.8
13
4.5
0.9
19
0.9
4.5
37
1.5
1.8
30
1.8
1.5
29
1.8
1.8
29
1.8
2.8
29
2.5
2.5
30
2.8
1.8
29
4.5
0.9
19
0.9
4.5
29
1.5
1.8
29
1.8
1.5
29
1.8
1.8
29
1.8
2.8
29
2.5
2.5
30
2.8
1.8
29
4.5
0.9
35
0.9
4.5
21
1.5
1.8
18
1.8
1.5
18
1.8
1.8
14
1.8
2.8
13
2.5
2.5
14
2.8
1.8
13
4.5
0.9
30
pF
pF
pF
14. VCC is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
15. VL is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
16. Typical values are at TA = +25°C.
17. CPD VL and CPD VCC are defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated for the
VL and VCC power supplies, respectively. ICC = ICC (dynamic) + ICC (static) ≈ ICC(operating) ≈ CPD x VCC x fIN x NSW where ICC = ICC_VCC
+ ICC VL and NSW = total number of outputs switching.
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7
NLSX5011
STATIC POWER CONSUMPTION (TA = +25°C)
Symbol
Parameter
CPD_VL
VL = Input port,
VCC = Output Port
VCC = Input port,
VL = Output Port
CPD_VCC
VL = Input port,
VCC = Output Port
VCC = Input port,
VL = Output Port
Test Conditions
CLoad = 0, f = 1 MHz,
EN = GND (outputs disabled)
CLoad = 0, f = 1 MHz,
EN = GND (outputs disabled)
CLoad = 0, f = 1 MHz,
EN = GND (outputs disabled)
CLoad = 0, f = 1 MHz,
EN = GND (outputs disabled)
VCC (V)
(Note 18)
VL (V)
(Note 19)
Typ
(Note 20)
Unit
0.9
4.5
0.01
pF
1.5
1.8
0.01
1.8
1.5
0.01
1.8
1.8
0.01
1.8
2.8
0.01
2.5
2.5
0.01
2.8
1.8
0.01
4.5
0.9
0.01
0.9
4.5
0.01
1.5
1.8
0.01
1.8
1.5
0.01
1.8
1.8
0.01
1.8
2.8
0.01
2.5
2.5
0.01
2.8
1.8
0.01
4.5
0.9
0.01
0.9
4.5
0.01
1.5
1.8
0.01
1.8
1.5
0.01
1.8
1.8
0.01
1.8
2.8
0.01
2.5
2.5
0.01
2.8
1.8
0.01
4.5
0.9
0.01
0.9
4.5
0.01
1.5
1.8
0.01
1.8
1.5
0.01
1.8
1.8
0.01
1.8
2.8
0.01
2.5
2.5
0.01
2.8
1.8
0.01
4.5
0.9
0.01
18. VCC is the supply voltage associated with the I/O VCC port, and VCC ranges from +0.9 V to 4.5 V under normal operating conditions.
19. VL is the supply voltage associated with the I/O VL port, and VL ranges from +0.9 V to 4.5 V under normal operating conditions.
20. Typical values are at TA = +25°C
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8
pF
pF
pF
NLSX5011
NLSX5011
VL
VCC
NLSX5011
VL
EN
I/O VL
Source
VCC
EN
I/O VL
I/O VCC
I/O VCC
CIOVL
CIOVCC
Source
tRISE/FALL v
3 ns
I/O VL
90%
50%
10%
I/O VCC
tRISE/FALL v 3 ns
90%
50%
10%
tPD_VL−VCC
I/O VCC
tPD_VCC−VL
I/O VL
tPD_VL−VCC
90%
50%
10%
tPD_VCC−VL
90%
50%
10%
tF−VCC
tR−VCC
tF−VL
Figure 7. Driving I/O VL Test Circuit and Timing
tR−VL
Figure 8. Driving I/O VCC Test Circuit and Timing
VCC
PULSE
GENERATOR
2xVCC
OPEN
R1
DUT
RT
CL
Test
RL
Switch
tPZH, tPHZ
Open
tPZL, tPLZ
2 x VCC
CL = 15 pF or equivalent (Includes jig and probe capacitance)
RL = R1 = 50 kW or equivalent
RT = ZOUT of pulse generator (typically 50 W)
Figure 9. Test Circuit for Enable/Disable Time Measurement
tR
tF
Input
tPLH
Output
90%
50%
10%
tR
EN
VCC
90%
50%
10%
tPHL
GND
VL
50%
tPZL
Output
50%
tPZH
tF
Output
50%
GND
tPLZ
tPHZ
HIGH
IMPEDANCE
10%
VOL
90%
VOH
Figure 10. Timing Definitions for Propagation Delays and Enable/Disable Measurement
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9
HIGH
IMPEDANCE
NLSX5011
IMPORTANT APPLICATIONS INFORMATION
Level Translator Architecture
VL pins to a high impedance state. Normal translation
operation occurs when the EN pin is equal to a logic high
signal. The EN pin is referenced to the VL supply and has
Over−Voltage Tolerant (OVT) protection.
The NLSX5011 auto−sense translator provides
bi−directional logic voltage level shifting to transfer data
in multiple supply voltage systems. These level translators
have two supply voltages, VL and VCC, which set the logic
levels on the input and output sides of the translator. When
used to transfer data from the I/O VL to the I/O VCC ports,
input signals referenced to the VL supply are translated to
output signals with a logic level matched to VCC. In a
similar manner, the I/O VCC to I/O VL translation shifts
input signals with a logic level compatible to VCC to an
output signal matched to VL.
The NLSX5011 translator consists of bi−directional
channels that independently determine the direction of the
data flow without requiring a directional pin. One−shot
circuits are used to detect the rising or falling input signals.
In addition, the one−shots decrease the rise and fall times
of the output signal for high−to−low and low−to−high
transitions.
Uni−Directional versus Bi−Directional Translation
The NLSX5011 translator can function as a
non−inverting uni−directional translator. One advantage of
using the translator as a uni−directional device is that each
I/O pin can be configured as either an input or output. The
configurable input or output feature is especially useful in
applications such as SPI that use multiple uni−directional
I/O lines to send data to and from a device. The flexible I/O
port of the auto sense translator simplifies the trace
connections on the PCB.
Power Supply Guidelines
The values of the VL and VCC supplies can be set to
anywhere between 0.9 and 4.5 V. Design flexibility is
maximized because VL may be either greater than or less
than the VCC supply. In contrast, the majority of the
competitive auto sense translators has a restriction that the
value of the VL supply must be equal to less than (VCC −
0.4) V.
The sequencing of the power supplies will not damage
the device during power−up operation. In addition, the I/O
VCC and I/O VL pins are in the high impedance state if
either supply voltage is equal to 0 V. For optimal
performance, 0.01 to 0.1 mF decoupling capacitors should
be used on the VL and VCC power supply pins. Ceramic
capacitors are a good design choice to filter and bypass any
noise signals on the voltage lines to the ground plane of the
PCB. The noise immunity will be maximized by placing
the capacitors as close as possible to the supply and ground
pins, along with minimizing the PCB connection traces.
The NLSX5011 translators have a power down feature
that provides design flexibility. The output ports are
disabled when either power supply is off (VL or VCC = 0 V).
This feature causes all of the I/O pins to be in the power
saving high impedance state.
Input Driver Requirements
Auto−sense translators such as the NLSX5011 have a
wide bandwidth, but a relatively small DC output current
rating. The high bandwidth of the bi−directional I/O circuit
is used to quickly transform from an input to an output
driver and vice versa. The I/O ports have a modest DC
current output specification so that the output driver can be
over driven when data is sent in the opposite direction. For
proper operation, the input driver to the auto−sense
translator should be capable of driving 2 mA of peak output
current. The bi−directional configuration of the translator
results in both input stages being active for a very short time
period. Although the peak current from the input signal
circuit is relatively large, the average current is small and
consistent with a standard CMOS input stage.
Enable Input (EN)
The NLSX5011 translator has an Enable pin (EN) that
provides tri−state operation at the I/O pins. Driving the
Enable pin to a low logic level minimizes the power
consumption of the device and drives the I/O VCC and I/O
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10
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA−01
ISSUE D
1
SCALE 8:1
EDGE OF PACKAGE
2X
0.10 C
ÉÉ
ÉÉ
ÉÉ
L1
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
A3
DETAIL B
Side View
(Optional)
5X
XM
L
3
X
M
L2
b
0.10 C A B
0.05 C
6
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
4
e
NOTE 3
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
GENERIC
MARKING DIAGRAM*
C
A1
6X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MOLD CMPD
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
PIN ONE
REFERENCE
DATE 03 SEP 2010
MOUNTING FOOTPRINT*
BOTTOM VIEW
6X
6X
0.42
0.40
PITCH
0.22
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON22068D
6 PIN UDFN, 1.2X1.0, 0.4P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
1
SCALE 4:1
A
B
D
DATE 15 MAY 2008
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
SIDE VIEW
A2
e
6X
C
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
L
1.24
3
1
DETAIL A
6X
0.53
6
4
6X
BOTTOM VIEW
b
0.10 C A B
0.05 C
NOTE 3
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XM
X
M
= Specific Device Code
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DOCUMENT NUMBER:
DESCRIPTION:
98AON30313E
UDFN6, 1.45x1.0, 0.5P
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
onsemi and
are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.
© Semiconductor Components Industries, LLC, 2018
www.onsemi.com
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A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
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