DATA SHEET
www.onsemi.com
Single D Flip Flop
MARKING
DIAGRAMS
NL17SZ74
The NL17SZ74 is a high performance, full function Edge
triggered D Flip Flop, with all the features of a standard logic device
such as the 74LCX74.
XXXX
ALYW
Features
•
•
•
•
•
•
•
•
•
US8
US SUFFIX
CASE 493
Designed for 1.65 V to 5.5 V VCC Operation
2.6 ns tPD at VCC = 5 V (typ)
Inputs/Outputs Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.0 V
Available in US8, UDFN8 and UQFN8 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Commercial
XX M
G
NLV Prefix
UDFN8, 1.45x1.0
MU3 SUFFIX
CASE 517BZ
XM
1
UDFN8, 1.95x1.0
MU1 SUFFIX
CASE 517CA
1
PR
XM
7
D
CP
2
5
3
1
UQFN8, 1.4x1.2
MQ2 SUFFIX
CASE 523AS
Q
Q
6
VCC = 8, GND = 4
CLR
1
Pin numbers indicated are for US8 and UDFN8 packages.
8
UQFN8, 1.6x1.6
MQ1 SUFFIX
CASE 523AN
X, XX, XXXX
A
L
Y
W
M
G
Figure 1. Logic Symbol
XM
1
1
XX MG
= Specific Device Code
= Assembly Location
= Lot Code
= Year Code
= Week Code
= Date Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
April, 2022 − Rev. 16
1
Publication Order Number:
NL17SZ74/D
NL17SZ74
CP
1
8
VCC
D
2
7
PR
Q
3
6
CLR
GND
4
5
Q
CP
1
8
VCC
D
2
7
PR
Q
3
6
CLR
GND
4
5
Q
US8
UDFN8
CP
7
VCC
CP
2
D
3
Q
4
1
5
8
PR
7
CLR
6
Q
D
6
Q
5
VCC
GND
4
8
1
PR
GND
2
CLR
3
Q
UQFN8, 1.6 x 1.6
UQFN8, 1.4 x 1.2
Figure 2. Pinout (Top View)
PIN ASSIGNMENT
FUNCTION TABLE
Pin
US8
UDFN8
UQFN8,
1.4x1.2
UQFN8,
1.6x1.6
1
CP
CP
VCC
PR
2
D
D
CP
CLR
3
Q
Q
D
Q
4
GND
GND
Q
5
Q
Q
6
CLR
Inputs
Outputs
PR
CLR
CP
D
Q
Q
Operating Mode
L
H
L
H
L
L
X
X
X
X
X
X
H
L
H
L
H
H
Asynchronous Set
Asynchronous Clear
Undertermined
GND
H
H
H
H
↑
↑
h
l
H
L
L
H
Load and Read
Register
GND
Q
H
H
↑
X
NC
NC
Hold
CLR
Q
D
7
PR
PR
CLR
CP
8
VCC
VCC
PR
VCC
H
h
= High Voltage Level
= High Voltage Level One Setup Time Prior to Low−to−High
Clock Transition
L = Low Voltage Level
l
= Low Voltage Level One Setup Time Prior to Low−to−High
Clock Transition
NC = No Change
X = High or Low Voltage Level and Transitions are
Acceptable
↑ = Low−to−High Transition
↑ = Not a Low−to−High Transition
For ICC reasons, DO NOT FLOAT Inputs
www.onsemi.com
2
NL17SZ74
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
NLV
−0.5 to +7.0
−0.5 to +6.5
V
VIN
DC Input Voltage
NLV
−0.5 to +7.0
−0.5 to +6.5
V
VOUT
Characteristics
DC Output Voltage (NLV)
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +7.0
−0.5 to +7.0
V
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±100
mA
−65 to +150
°C
ICC or IGND
TSTG
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 secs
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
US8
UQFN8
UDFN8
250
210
231
°C/W
PD
Power Dissipation in Still Air
US8
UQFN8
UDFN8
500
595
541
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
±100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tR, tF
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Rise and Fall Rate
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
0
0
VCC
5.5
5.5
−55
+125
°C
0
0
0
0
20
20
10
5
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
3
NL17SZ74
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
Parameter
Condition
VCC
(V)
TA = 255C
Min
Typ
−555C 3 TA 3 1255C
Max
Min
Max
High−Level Input
Voltage (NLV)
1.65 to 1.95 0.75 x VCC
0.70 x VCC
0.70 x VCC
High−Level Input
Voltage
1.65 to 1.95 0.65 x VCC
0.65 x VCC
Low−Level Input
Voltage (NLV)
1.65 to 1.95
0.25 x VCC
0.25 x VCC
2.3 to 5.5
0.30 x VCC
0.30 x VCC
Low−Level Input
Voltage
1.65 to 1.95
0.35 x VCC
0.35 x VCC
2.3 to 5.5
0.30 x VCC
0.30 x VCC
2.3 to 5.5
2.3 to 5.5
0.75 x VCC
0.70 x VCC
Units
V
V
0.70 x VCC
V
V
VOH
High−Level Output
Voltage
VIN = VIH or VIL
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
−
−
−
−
−
−
−
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
VOL
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
1.65 to 5.5
−
−
±0.1
−
±1.0
mA
0
−
−
1.0
−
10
mA
5.5
−
−
1.0
−
10
mA
Input Leakage Current
VIN = 5.5 V or GND
IOFF
IIN
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
ICC
Quiescent Supply
Current
VIN = VCC or GND
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
4
NL17SZ74
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
Î
ÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎ
Î
ÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎÎ
ÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
TA = 25°C
Symbol
fMAX
Parameter
Maximum Clock
Frequency
(50% Duty Cycle)
(Figures 3 and 5)
VCC (V)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
Test Conditions
CL = 15 pF
RL = 1 MW
S1 = Open
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
tPLH,
tPHL
Propagation Delay,
CP to Q or Q
(Figures 3 and 4)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
CL = 50 pF,
RL = 500 W, S1 = Open
CL = 15 pF
RL = 1 MW
S1 = Open
4.5 to 5.5
3.0 to 3.6
4.5 to 5.5
tPLH,
tPHL
Propagation Delay,
PR or CLR to Q or Q
(Figures 3 and 4)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
tS
Setup Time, D to CP
(Figures 3 and 5)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
tH
Hold Time, D to CP
(Figures 3 and 5)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
tW
Pulse Width,
CP, CLR, PR
(Figures 3 and 5)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
tREC
Recover Time
PR; CLR to CP
(Figures 3 and 5)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
−
75
−
150
−
−
150
−
200
−
−
200
−
250
−
−
250
−
175
−
−
175
−
200
−
−
200
−
−
6.5
12.5
−
13
−
3.8
7.5
−
8.0
−
2.8
6.5
−
7.0
4.5
−
5.0
3.4
7.0
−
7.5
−
2.6
5.0
−
5.5
CL = 15 pF
RL = 1 MW
S1 = Open
−
6.5
14
−
14.5
−
3.8
9.0
−
9.5
−
2.8
6.5
−
7.0
−
2.2
5.0
−
5.5
−
3.4
7.0
−
7.5
CL = 50 pF,
RL = 500 W, S1 = Open
−
2.6
5.0
−
5.5
6.5
−
−
6.5
−
3.5
−
−
3.5
−
2.0
−
−
2.0
−
1.5
−
−
1.5
−
CL = 50 pF,
RL = 500 W, S1 = Open
2.0
−
−
2.0
−
1.5
−
−
1.5
−
CL = 15 pF
RL = 1 MW
S1 = Open
0.5
−
−
0.5
−
0.5
−
−
0.5
−
0.5
−
−
0.5
−
0.5
−
−
0.5
−
CL = 50 pF,
RL = 500 W, S1 = Open
0.5
−
−
0.5
−
0.5
−
−
0.5
−
CL = 15 pF
RL = 1 MW
S1 = Open
6.0
−
−
6.0
−
4.0
−
−
4.0
−
3.0
−
−
3.0
−
2.0
−
−
2.0
−
CL = 50 pF,
RL = 500 W, S1 = Open
3.0
−
−
3.0
−
2.0
−
−
2.0
−
CL = 15 pF
RD = 1 MW
S1 = Open
8.0
−
−
8.0
−
4.5
−
−
4.5
−
3.0
−
−
3.0
−
3.0
−
−
3.0
−
3.0
−
−
3.0
−
3.0
−
−
3.0
−
CL = 15 pF
RL = 1 MW
S1 = Open
4.5 to 5.5
3.0 to 3.6
Max
−
2.2
4.5 to 5.5
3.0 to 3.6
Min
75
−
4.5 to 5.5
3.0 to 3.6
Max
−
4.5 to 5.5
3.0 to 3.6
Typ
CL = 50 pF,
RD = 500 W, S1 = Open
4.5 to 5.5
3.0 to 3.6
TA = −55 to 125°C
Min
CL = 50 pF,
RL = 500 W, S1 = Open
Units
MHz
ns
ns
ns
ns
ns
ns
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 2 (per flip−flop). CPD is used to determine the
no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
www.onsemi.com
5
NL17SZ74
CAPACITIVE CHARACTERISTICS
Symbol
Typical
Units
Input Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VIN = 0 V or VCC
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
9
11
pF
CIN
Parameter
Condition
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
OPEN
2 x VCC
R1
OUTPUT
DUT
RL
RT
Test
Switch
Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
50
500
500
tPHZ / tPZH
GND
50
500
500
GND
CL, pF
RL, W
R1 , W
See AC Characteristics Table
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tR = 3 ns
tF = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
tPZH
VOH
Vmo
~VCC
OUTPUT
VOL
tPHZ
VOH
VOH − VY
Vmo
~0 V
Figure 4. Switching Waveforms
www.onsemi.com
6
NL17SZ74
tR = 3 ns
tF = 3 ns
90%
PR/PR
CLR/CLR
VC C
90%
Vmi
Vmi
10%
10%
tW
GND
tREC
tW
VC C
CP
Vmi
Vmi
GND
tSU
1/fMAX
tH
VC C
D
Vmi
Vmi
GND
Figure 5. Setup, Hold and Recovery Time Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
tPZL, tPLZ, tPZH, tPHZ
VY, V
1.65 to 1.95
VCC/2
VCC/2
VCC/2
0.15
2.3 to 2.7
VCC/2
VCC/2
VCC/2
0.15
3.0 to 3.6
VCC/2
VCC/2
VCC/2
0.3
4.5 to 5.5
VCC/2
VCC/2
VCC/2
0.3
www.onsemi.com
7
NL17SZ74
DEVICE ORDERING INFORMATION
Packages
Marking
Pin 1 Orientation
(See below)
Shipping†
NL17SZ74USG
US8
MH
Q4
3000 / Tape & Reel
NLV17SZ74USG*
US8
MH
Q4
3000 / Tape & Reel
Device
NL17SZ74USG−L22190**
US8
MH
Q4
3000 / Tape & Reel
NL17SZ74MQ1TCG
UQFN8, 1.6 x 1.6, 0.5P
AA
Q1
3000 / Tape & Reel
NLV17SZ74MQ1TCG*
(In Development)
UQFN8, 1.6 x 1.6, 0.5P
AA
Q1
3000 / Tape & Reel
NL17SZ74MU1TCG
(In Development)
UDFN8, 1.95 x 1.0, 0.5P
TBD
Q4
3000 / Tape & Reel
NL17SZ74MU3TCG
(In Development)
UDFN8, 1.45 x 1.0,
0.35P
TBD
Q4
3000 / Tape & Reel
NL17SZ74MQ2TCG
(In Development)
UQFN8, 1.4 x 1.2, 0.4P
TBD
TBD
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
** Please refer to NLV specifications for this device.
Pin 1 Orientation in Tape and Reel
www.onsemi.com
8
NL17SZ74
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
A
8
J
−Y−
5
B
DETAIL E
L
1
4
R
G
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
S
U
C
−T−
SEATING
PLANE
0.10 (0.004)
M
H
0.10 (0.004) T
K
D
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
SOLDERING FOOTPRINT*
3.8
0.015
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
mm Ǔ
ǒinches
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
NL17SZ74
PACKAGE DIMENSIONS
UDFN8, 1.45x1, 0.35P
CASE 517BZ
ISSUE O
ÉÉ
ÉÉ
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.48
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
L
8X
0.22
4
L1
1.18
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
NOTE 3
1
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
NL17SZ74
PACKAGE DIMENSIONS
UDFN8, 1.95x1.0, 0.5P
CASE 517CA
ISSUE A
www.onsemi.com
11
NL17SZ74
PACKAGE DIMENSIONS
UQFN8, 1.4x1.2, 0.4P
CASE 523AS
ISSUE A
PIN ONE
REFERENCE
2X
2X
0.10 C
L1
ÉÉ
ÉÉ
0.10 C
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
EXPOSED Cu
(A3)
A
MOLD CMPD
DETAIL B
0.05 C
ALTERNATE
CONSTRUCTION
0.05 C
A1
SIDE VIEW
L2
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ÉÉ
ÇÇ
TOP VIEW
DETAIL B
8X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
L
L
A
B
D
2
C
SOLDERING FOOTPRINT*
SEATING
PLANE
1.61
0.55
L
4
1
e
8
1.40
6
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.40 BSC
1.20 BSC
0.40 BSC
0.20
0.40
−−−
0.15
0.30
0.50
6X
1
7X
0.45
b
0.10
M
C A B
0.05
M
C
NOTE 3
8X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
NL17SZ74
PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN
ISSUE O
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
EXPOSED Cu
E
A1
ÇÇ
ÉÉ
ÉÉ
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DETAIL B
DIM
A
A1
A3
b
D
E
e
L
L1
L3
OPTIONAL
CONSTRUCTION
2X
0.10 C
TOP VIEW
L1
(A3)
DETAIL B
L3
A
0.05 C
b
0.05 C
SIDE VIEW
(0.10)
C
A1
SEATING
PLANE
(0.15)
8X
L
1.70
OPTIONAL
CONSTRUCTION
1
DETAIL A
0.50
PITCH
1
e
5
3
SOLDERING FOOTPRINT*
DETAIL A
8X
L3
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.60 BSC
0.50 BSC
0.35
0.45
−−−
0.15
0.25
0.35
0.35
1.70
7
8
8X
b
7X
0.10 C A B
BOTTOM VIEW
0.05 C
0.25
8X
0.53
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
13
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
