Single Unbuffered Inverter
NL17SZU04
The NL17SZU04 is a single unbuffered inverter in tiny footprint
packages.
Features
•
•
•
•
•
•
•
•
•
Designed for 1.65 V to 5.5 V VCC Operation
2.1 ns tPD at VCC = 5 V (typ)
Input Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.0 V
Available in SC−88A, SC−74A, SOT−553, SOT−953 and UDFN6
Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A
1
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MARKING
DIAGRAMS
Y
SC−88A (SOT−353)
DF SUFFIX
CASE 419A
XX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XXX MG
G
SOT−553
XV5 SUFFIX
CASE 463B
XX MG
G
Figure 1. Logic Symbol
SOT−953
P5 SUFFIX
CASE 527AE
1
XM
1
UDFN6
1.45 x 1.0
CASE 517AQ
UDFN6
1.0 x 1.0
CASE 517BX
XM
XM
1
X, XX, XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
January, 2021 − Rev. 10
1
Publication Order Number:
NL17SZU04/D
NL17SZU04
VCC
NC
1
5
A
VCC
A
2
GND
Y
4
3
1
6
VCC
A
2
5
NC
GND
3
4
Y
5
1
GND
2
NC
Y
NC
4
3
(SC−88A / SOT−553 / SC−74A)
SOT−953
UDFN6
Figure 2. Pinout (Top View)
PIN ASSIGNMENT
(SC−88A/SOT−553/ TSOP−5/SC−74A)
PIN ASSIGNMENT (SOT−953)
PIN ASSIGNMENT (UDFN)
Pin
Function
Pin
Function
Pin
Function
1
NC
1
A
1
NC
2
A
2
GND
2
A
3
GND
3
NC
3
GND
4
Y
4
Y
4
Y
5
VCC
5
VCC
5
NC
6
VCC
FUNCTION TABLE
Output
Y=A
Input
A
Y
L
H
H
L
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2
NL17SZU04
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
SC−88A (NLV)
SC−74A, SC−88A, SOT−953, SOT−553, UDFN6
−0.5 to +7.0
−0.5 to +6.5
V
VIN
DC Input Voltage
SC−88A (NLV)
SC−74A, SC−88A, SOT−953, SOT−553, UDFN6
−0.5 to +7.0
−0.5 to +6.5
V
−0.5 to VCC + 0.5
V
VOUT
Characteristics
DC Output Voltage
IIK
DC Input Diode Current
−50
mA
IOK
DC Output Diode Current
±50
mA
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±100
mA
−65 to +150
°C
ICC or IGND
TSTG
VIN < GND
Storage Temperature Range
TL
Lead Temperature, 1 mm from Case for 10 secs
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
377
320
324
254
154
°C/W
PD
Power Dissipation in Still Air
SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
332
390
386
491
812
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
$100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Characteristics
Symbol
Min
Max
Unit
VCC
Positive DC Supply Voltage
1.65
5.5
V
VIN
DC Input Voltage
0
5.5
V
DC Output Voltage
0
VCC
−55
+125
°C
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
100
20
ns/V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
VOUT
TA
tr , tf
Operating Temperature Range
Input Rise and Fall Time
(SC−88A (NLV))
Input Rise and Fall Time
(SC−74A, SC−88A, SOT−953, SOT−553, UDFN6)
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
NL17SZU04
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
High−Level Input
Voltage
1.65 to 1.95
0.85 VCC
−
−
0.85 VCC
−
V
2.3 to 5.5
0.80 VCC
−
−
0.80 VCC
−
Low−Level Input
Voltage
1.65 to 1.95
−
−
0.15 VCC
−
0.15 VCC
2.3 to 5.5
−
−
0.20 VCC
−
0.20 VCC
Parameter
Condition
V
VOH
High−Level Output
Voltage
VIN = GND
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
−
−
−
−
−
−
−
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
VOL
Low−Level Output
Voltage
VIN = VCC
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
Input Leakage Current
VIN = 5.5 V or GND
1.65 to 5.5
−
−
±0.1
−
±1.0
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V
0
−
−
1.0
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or GND
5.5
−
−
1.0
−
10
mA
IIN
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS
Symbol
tPLH,
tPHL
−555C 3 TA 3 1255C
Min
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 15 pF
1.65 to 1.95
−
3.0
11.7
−
12.1
ns
RL = 1 MW, CL = 15 pF
2.3 to 2.7
−
2.2
6.2
−
6.5
RL = 1 MW, CL = 15 pF
3.0 to 3.6
−
2.0
4.5
−
4.8
−
2.5
6.0
−
6.6
−
1.8
3.9
−
4.1
−
2.1
5.0
−
5.5
Parameter
Propagation Delay, A to Y
(Figures 3 and 4)
TA = 255C
VCC
(V)
Condition
RL = 500 W, CL = 50 pF
4.5 to 5.5
RL = 1 MW, CL = 15 pF
RL = 500 W, CL = 50 pF
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 3.3 V, VIN = 0 V or VCC
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
9
11
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL17SZU04
OPEN
2 x VCC
Test
Switch
Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
50
500
500
tPHZ / tPZH
GND
50
500
500
GND
R1
OUTPUT
DUT
RL
RT
CL, pF
RL, W
R1 , W
See AC Characteristics Table
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
~VCC
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
tPZH
VOH
Vmo
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
1.65 to 1.95
VCC / 2
VCC / 2
VCC / 2
0.15
2.3 to 2.7
VCC / 2
VCC / 2
VCC / 2
0.15
3.0 to 3.6
VCC / 2
VCC / 2
VCC / 2
0.3
4.5 to 5.5
VCC / 2
VCC / 2
VCC / 2
0.3
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5
tPZL, tPLZ, tPZH, tPHZ
VY, V
NL17SZU04
DEVICE ORDERING INFORMATION
Packages
Marking
Pin 1 Orientation
(See below)
Shipping†
NL17SZU04DFT2G
SC−88A
L6
Q4
3000 / Tape & Reel
NLV17SZU04DFT2G*
SC−88A
L6
Q4
3000 / Tape & Reel
NL17SZU04DBVT1G
SC−74A
AR
Q4
3000 / Tape & Reel
NL17SZU04XV5T2G
SOT−553
L6
Q4
4000 / Tape & Reel
NL17SZU04P5T5G
SOT−953
6
(Rotated 90° CW)
Q2
8000 / Tape & Reel
NL17SZU04MU1TCG
(In Development)
UDFN6, 1.45 x 1.0, 0.5P
TBD
Q4
3000 / Tape & Reel
NL17SZU04MU3TCG
(In Development)
UDFN6, 1.0 x 1.0, 0.35P
TBD
Q4
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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6
NL17SZU04
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
7
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZU04
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5X
b
0.20 C A B
E1
5
M
4
1
2
E
3
B
0.05
A1
L
DETAIL A
e
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
TOP VIEW
A
SIDE VIEW
C
DETAIL A
c
SEATING
PLANE
END VIEW
DIM
A
A1
b
c
D
E
E1
e
L
M
MILLIMETERS
MIN
MAX
0.90
1.10
0.01
0.10
0.25
0.50
0.10
0.26
2.85
3.15
2.50
3.00
1.35
1.65
0.95 BSC
0.20
0.60
0_
10 _
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
NL17SZU04
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
D
−X−
5
A
4
1
e
2
L
E
−Y−
3
b
HE
DIM
A
b
c
D
E
e
L
HE
c
5 PL
0.08 (0.003)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.65
1.20
1.25
0.50 BSC
0.10
0.20
0.30
1.55
1.60
1.65
MIN
0.50
0.17
0.08
1.55
1.15
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.061
0.063
MIN
0.020
0.007
0.003
0.061
0.045
MAX
0.024
0.011
0.007
0.065
0.049
0.012
0.065
NL17SZU04
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
NL17SZU04
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
ÉÉÉ
ÉÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
DETAIL B
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
OPTIONAL
CONSTRUCTIONS
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
0.05 C
A1
SIDE VIEW
A2
e
6X
C
6X
SEATING
PLANE
L
1.24
3
1
DETAIL A
6X
0.53
6
0.30
PACKAGE
OUTLINE
4
BOTTOM VIEW
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
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11
NL17SZU04
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
0.08 C
2X
ÉÉÉ
ÉÉÉ
0.08 C
0.05 C
L1
A B
D
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
L3
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
ÉÉ
ÉÉ
ÇÇ
TOP VIEW
EXPOSED Cu
DETAIL B
A3
A1
MOLD CMPD
DETAIL B
A
ALTERNATE
CONSTRUCTION
0.05 C
SIDE VIEW
C
SEATING
PLANE
3
1
6X
MILLIMETERS
MIN
MAX
0.50
0.65
0.00
0.05
0.13 REF
0.17
0.23
1.00 BSC
1.00 BSC
0.35
0.20
0.40
−−−
0.15
0.26
0.33
RECOMMENDED
SOLDERING FOOTPRINT*
e
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L3
L
6X
6X
0.25
0.52
1.20
6
4
BOTTOM VIEW
6X
PACKAGE
OUTLINE
b
0.07
M
C A B
0.05
M
C
1
0.35
PITCH
NOTE 3
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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