DATA SHEET
www.onsemi.com
Dual Inverter with Open
Drain Outputs
MARKING
DIAGRAMS
6
NL27WZ06
1
The NL27WZ06 is a high performance dual inverter with open drain
outputs operating from a 1.65 to 5.5 V supply.
Features
Designed for 1.65 V to 5.5 V VCC Operation
2.1 ns tPD at VCC = 5 V (Typ)
Inputs/Outputs Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Sink 24 mA at 3.0 V
Available in SC−88, SC−74 and UDFN6 Packages
Chip Complexity < 100 FETs
−Q Suffix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q100 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
SC−88
DF SUFFIX
CASE 419B
XXXM G
G
1
SC−74
CASE318F−05
6
XXX MG
G
1
1
UDFN6
1.45 x 1.0
CASE 517AQ
UDFN6
1.0 x 1.0
CASE 517BX
XM
XM
1
X, XXX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
A1
1
Y1
A2
1
Y2
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 7 of this data sheet.
Figure 1. Logic Symbol
Semiconductor Components Industries, LLC, 2013
May, 2023 − Rev. 12
1
Publication Order Number:
NL27WZ06/D
NL27WZ06
A1
A1
1
6
Y1
GND
2
5
VCC
A2
3
4
Y2
Y1
1
6
GND
2
5
VCC
A2
3
4
Y2
(SC−88/SC−74)
UDFN6
Figure 2. Pinout (Top View)
PIN ASSIGNMENT
FUNCTION TABLE
Pin
Function
A Input
Y Output
1
A1
L
Z
2
GND
H
L
3
A2
4
Y2
5
VCC
6
Y1
www.onsemi.com
2
NL27WZ06
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +6.5
V
VIN
DC Input Voltage
−0.5 to +6.5
V
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
50
mA
VOUT
Characteristics
DC Output Voltage
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
ICC or IGND
TSTG
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
100
mA
−65 to +150
C
TL
Lead Temperature, 1 mm from Case for 10 secs
260
C
TJ
Junction Temperature Under Bias
+150
C
qJA
Thermal Resistance (Note 2)
SC−88
SC−74
UDFN6
377
320
154
C/W
PD
Power Dissipation in Still Air
SC−88
SC−74
UDFN6
332
390
812
mW
MSL
Moisture Sensitivity
Level 1
−
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
$100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
www.onsemi.com
3
NL27WZ06
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Rise and Fall Time
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
0
0
VCC
5.5
5.5
−55
+125
C
0
0
0
0
20
20
10
5
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
VOL
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
High−Level Input
Voltage
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.3 to 5.5
0.70 VCC
−
−
0.70 VCC
−
Low−Level Input
Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.3 to 5.5
−
−
0.30 VCC
−
0.30 VCC
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
Parameter
Condition
V
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
IIN
Input Leakage Current
VIN = 5.5 V or GND
1.65 to 5.5
−
−
0.1
−
1.0
mA
IOZ
3−State Output
Leakage Current
VOUT = 0 V to 5.5 V
1.65 to 5.5
−
−
0.5
−
5.0
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0
−
−
1.0
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or GND
5.5
−
−
1.0
−
10
mA
ICCT
Quiescent Supply
Current
3.6
−
−
10
−
100
mA
VIN = 3.0 V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
4
NL27WZ06
AC ELECTRICAL CHARACTERISTICS
Symbol
tPZL
tPLZ
Parameter
Condition
Propagation Delay,
(Figures 3 and 4)
Propagation Delay,
(Figures 3 and 4)
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
1.65 to 1.95
−
6.0
9.0
−
9.5
ns
2.3 to 2.7
−
3.6
6.1
−
6.5
3.0 to 3.6
−
2.7
5.6
−
6.0
4.5 to 5.5
−
2.1
4.4
−
4.8
1.65 to 1.95
−
4.0
9.0
−
9.5
2.3 to 2.7
−
2.8
6.1
−
6.5
3.0 to 3.6
−
2.5
5.6
−
6.0
4.5 to 5.5
−
2.2
4.4
−
4.8
ns
CAPACITIVE CHARACTERISTICS
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
4.0
pF
CPD
Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
4.0
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
www.onsemi.com
5
NL27WZ06
OPEN
2 x VCC
Test
Switch
Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
50
500
500
tPHZ / tPZH
GND
50
500
500
GND
R1
OUTPUT
DUT
RL
RT
CL, pF
RL, W
R1 , W
See AC Characteristics Table
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
~VCC
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
tPZH
VOH
Vmo
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
1.65 to 1.95
VCC/2
VCC/2
VCC/2
0.15
2.3 to 2.7
VCC/2
VCC/2
VCC/2
0.15
3.0 to 3.6
VCC/2
VCC/2
VCC/2
0.3
4.5 to 5.5
VCC/2
VCC/2
VCC/2
0.3
www.onsemi.com
6
tPZL, tPLZ, tPZH, tPHZ
VY, V
NL27WZ06
DEVICE ORDERING INFORMATION
Packages
Specific Device Code
Pin 1 Orientation
(See below)
Shipping†
NL27WZ06DFT2G
SC−88
MF
Q4
3000 / Tape & Reel
NL27WZ06DFT2G−Q*
SC−88
MF
Q4
3000 / Tape & Reel
Device
NL27WZ06DBVT1G
SC−74
MF
Q4
3000 / Tape & Reel
NL27WZ06MU1TCG
(Contact onsemi)
UDFN6, 1.45 x 1.0 x 0.5P
K (Rotated 90 CW)
Q4
3000 / Tape & Reel
NL27WZ06MU3TCG
(Contact onsemi)
UDFN6, 1.0 x 1.0 x 0.35P
Y (Rotated 90 CW)
Q4
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*−Q Suffix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
PIN 1 ORIENTATION IN TAPE AND REEL
www.onsemi.com
7
NL27WZ06
PACKAGE DIMENSIONS
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
2X
aaa H D
D
H
A
D
6
5
GAGE
PLANE
4
1
2
L
L2
E1
E
DETAIL A
3
aaa C
2X
bbb H D
2X 3 TIPS
e
B
6X
A2
A
ccc C
A1
SIDE VIEW
DIM
A
A1
A2
b
C
D
E
E1
e
L
L2
aaa
bbb
ccc
ddd
b
ddd
TOP VIEW
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
C
M
C A-B D
DETAIL A
SEATING
PLANE
END VIEW
c
RECOMMENDED
SOLDERING FOOTPRINT*
6X
6X
0.30
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
MILLIMETERS
MIN
NOM MAX
−−−
−−−
1.10
0.00
−−−
0.10
0.70
0.90
1.00
0.15
0.20
0.25
0.08
0.15
0.22
1.80
2.00
2.20
2.00
2.10
2.20
1.15
1.25
1.35
0.65 BSC
0.26
0.36
0.46
0.15 BSC
0.15
0.30
0.10
0.10
INCHES
NOM MAX
−−− 0.043
−−− 0.004
0.035 0.039
0.008 0.010
0.006 0.009
0.078 0.086
0.082 0.086
0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.006 BSC
0.006
0.012
0.004
0.004
MIN
−−−
0.000
0.027
0.006
0.003
0.070
0.078
0.045
NL27WZ06
PACKAGE DIMENSIONS
SC−74
CASE 318F
ISSUE P
GENERIC
MARKING DIAGRAM*
XXX MG
G
XXX
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
STYLE 1:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
STYLE 2:
PIN 1. NO CONNECTION
2. COLLECTOR
3. EMITTER
4. NO CONNECTION
5. COLLECTOR
6. BASE
STYLE 3:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
STYLE 4:
PIN 1. COLLECTOR 2
2. EMITTER 1/EMITTER 2
3. COLLECTOR 1
4. EMITTER 3
5. BASE 1/BASE 2/COLLECTOR 3
6. BASE 3
STYLE 5:
PIN 1. CHANNEL 1
2. ANODE
3. CHANNEL 2
4. CHANNEL 3
5. CATHODE
6. CHANNEL 4
STYLE 7:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 8:
PIN 1. EMITTER 1
2. BASE 2
3. COLLECTOR 2
4. EMITTER 2
5. BASE 1
6. COLLECTOR 1
STYLE 9:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 10:
PIN 1. ANODE/CATHODE
2. BASE
3. EMITTER
4. COLLECTOR
5. ANODE
6. CATHODE
STYLE 11:
PIN 1. EMITTER
2. BASE
3. ANODE/CATHODE
4. ANODE
5. CATHODE
6. COLLECTOR
www.onsemi.com
9
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
NL27WZ06
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
PIN ONE
REFERENCE
0.10 C
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
OPTIONAL
CONSTRUCTIONS
A
A1
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
0.05 C
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
DETAIL B
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
L
L
MOUNTING FOOTPRINT
A2
C
SEATING
PLANE
6X
0.30
PACKAGE
OUTLINE
e
6X
L
1.24
3
1
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
DETAIL A
6X
0.53
6
4
BOTTOM VIEW
6X
b
0.10 C A B
0.05 C
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
NOTE 3
www.onsemi.com
10
NL27WZ06
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉÉ
ÉÉÉ
ÉÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
e
5X
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
L
5X
0.48
3
1
6X
0.22
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
NOTE 3
1
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy
and soldering details, please download the
onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
www.onsemi.com
11
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
