Dual 2-Input AND Gate
NL27WZ08
The NL27WZ08 is a high performance dual 2−input AND Gate
operating from a 1.65 V to 5.5 V supply.
Features
•
•
•
•
•
•
•
•
•
Designed for 1.65 V to 5.5 V VCC Operation
2.7 ns tPD at VCC = 5 V (typ)
Inputs/Outputs Overvoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 24 mA at 3.0 V
Available in US8, UDFN8 and UQFN8 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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MARKING
DIAGRAMS
UDFN8, 1.95x1.0
MU1 SUFFIX
CASE 517CA
&
Y1
A2
B2
&
Y2
Figure 1. Logic Symbol
1
XM
1
UDFN8, 1.6x1.0
MU2 SUFFIX
CASE 517BY
1
UDFN8, 1.45x1.0
MU3 SUFFIX
CASE 517BZ
1
IEEE/IEC
A1
B1
XX M
G
US8
US SUFFIX
CASE 493
UQFN8, 1.6x1.6
MQ1 SUFFIX
CASE 523AN
8
UQFN8, 1.4x1.2
MQ2 SUFFIX
CASE 523AS
X, XX
M
G
XM
XM
1
XX MG
XM
1
= Specific Device Code
= Date Code*
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
October, 2019 − Rev. 13
1
Publication Order Number:
NL27WZ08/D
NL27WZ08
A1
1
8
VCC
B1
2
7
Y1
Y2
3
6
B2
GND
4
5
A1
1
8
VCC
B1
2
7
Y1
Y2
3
6
B2
A1
7
GND
4
8
1
Y1
GND
4
5
Y2
5
VCC
A2
US8
B1
6
A2
2
B2
3
A2
UQFN8
UDFN8
Figure 2. Pinout
PIN ASSIGNMENT
FUNCTION TABLE
Y = AB
Pin
Function
1
A1
2
B1
A
B
Y
3
Y2
L
L
L
4
GND
L
H
L
5
A2
H
L
L
6
B2
H
H
H
7
Y1
8
VCC
Inputs
H = HIGH Logic Level
L = LOW Logic Level
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2
Output
NL27WZ08
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
Characteristics
−0.5 to +6.5
V
VIN
DC Input Voltage
−0.5 to +6.5
V
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
VIN < GND
−50
mA
VOUT < GND
−50
mA
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IOUT
DC Output Source/Sink Current
±50
mA
DC Supply Current per Supply Pin or Ground Pin
±100
mA
ICC or IGND
TSTG
−65 to +150
°C
TL
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 secs
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 2)
US8
UQFN8
UDFN8
250
208
111
°C/W
PD
Power Dissipation in Still Air
US8
UDFN8
UQFN8
250
601
1127
mW
Level 1
−
MSL
Moisture Sensitivity
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
−
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
V
$100
mA
VESD
ILatchup
Latchup Performance (Note 4)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
VCC
Positive DC Supply Voltage
VIN
DC Input Voltage
VOUT
TA
tr , tf
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
Operating Temperature Range
Input Rise and Fall Time
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
0
0
VCC
5.5
5.5
−55
+125
°C
0
0
0
0
20
20
10
5
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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3
NL27WZ08
DC ELECTRICAL CHARACTERISTICS
TA = 255C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
High−Level Input
Voltage
1.65 to 1.95
0.65 VCC
−
−
0.65 VCC
−
V
2.3 to 5.5
0.70 VCC
−
−
0.70 VCC
−
Low−Level Input
Voltage
1.65 to 1.95
−
−
0.35 VCC
−
0.35 VCC
2.3 to 5.5
−
−
0.30 VCC
−
0.30 VCC
VIN = VIH or VIL
IOH = −100 mA
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
VCC
1.4
2.1
2.4
2.7
2.5
4.0
−
−
−
−
−
−
−
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
−
−
−
−
−
−
−
Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
Input Leakage Current
VIN = 5.5 V or GND
1.65 to 5.5
−
−
0.1
−
±1.0
mA
IOFF
Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0
−
−
1.0
−
10
mA
ICC
Quiescent Supply
Current
VIN = VCC or GND
5.5
−
−
1.0
−
10
mA
Symbol
VIH
VIL
VOH
VOL
IIN
Parameter
High−Level Output
Voltage
Condition
V
V
V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
TA = 25°C
Symbol
tPLH,
tPHL
Parameter
Propagation Delay
VCC (V)
1.8 ± 0.15
2.5 ± 0.2
3.3 ± 0.3
Test Conditions
CL = 15 pF
RD = 1 MW
R1 = Open
5.0 ± 0.5
3.3 ± 0.3
5.0 ± 0.5
CL = 50 pF,
RD = 500 W, R1 = Open
TA = −55 to 125°C
Min
Typ
Max
Min
Max
Units
−
5.7
10.5
−
11.0
ns
−
3.5
5.8
−
6.2
−
2.6
3.9
−
4.3
−
1.9
3.1
−
3.3
−
3.2
4.8
−
5.2
−
2.5
3.7
−
4.0
CAPACITIVE CHARACTERISTICS (tR = tF = 3.0 ns)
Symbol
CIN
Parameter
Condition
Typical
Units
Input Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VIN = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 3.3 V, VIN = 0 V or VCC
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC
9
11
pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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4
NL27WZ08
OPEN
2 x VCC
Test
Switch
Position
tPLH / tPHL
Open
tPLZ / tPZL
2 x VCC
50
500
500
tPHZ / tPZH
GND
50
500
500
GND
R1
OUTPUT
DUT
RL
RT
CL, pF
RL, W
R1 , W
See AC Characteristics Table
X = Don’t Care
CL *
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
Figure 3. Test Circuit
tr = 3 ns
tf = 3 ns
90%
90%
Vmi
INPUT
Vmi
INPUT
Vmi
10%
10%
tPHL
Vmi
GND
GND
tPZL
tPLH
Vmo
OUTPUT
VCC
VCC
tPLZ
~VCC
VOH
Vmo
OUTPUT
Vmo
VOL + VY
VOL
VOL
tPLH
OUTPUT
tPHL
Vmo
tPZH
VOH
Vmo
tPHZ
VOH
VOH − VY
Vmo
OUTPUT
VOL
~0 V
Figure 4. Switching Waveforms
Vmo, V
VCC, V
Vmi, V
tPLH, tPHL
1.65 to 1.95
VCC/2
(VOH − VOL)/2
VCC/2
0.15
2.3 to 2.7
VCC/2
(VOH − VOL)/2
VCC/2
0.15
3.0 to 3.6
VCC/2
(VOH − VOL)/2
VCC/2
0.3
4.5 to 5.5
VCC/2
(VOH − VOL)/2
VCC/2
0.3
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5
tPZL, tPLZ, tPZH, tPHZ
VY, V
NL27WZ08
DEVICE ORDERING INFORMATION
Packages
Specific Device Code
Pin 1 Orientation
(See below)
Shipping†
NL27WZ08USG
US8
L2
Q4
3000 / Tape & Reel
NLV27WZ08USG*
US8
L2
Q4
3000 / Tape & Reel
NL27WZ08MQ1TCG
UQFN8, 1.6 x 1.6, 0.5P
AD
Q1
3000 / Tape & Reel
NL27WZ08MU1TCG
UDFN8, 1.95 x 1.0, 0.5P
AH
Q4
3000 / Tape & Reel
NL27WZ08MU1TWG
UDFN8, 1.95 x 1.0, 0.5P
AK
Q1
3000 / Tape & Reel
NL27WZ08MU3TCG
UDFN8, 1.45 x 1.0, 0.35P
F
Q4
3000 / Tape & Reel
NL27WZ08MU2TCG
UDFN8, 1.6 x 1.0, 0.4P
J
Q4
3000 / Tape & Reel
NL27WZ08MQ2TCG
(In Development)
UQFN8, 1.4 x 1.2, 0.4P
TBD
TBD
3000 / Tape & Reel
SM8
TBD
TBD
3000 / Tape & Reel
Device
NL27WZ08
(In Development)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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6
NL27WZ08
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE B
−X−
A
8
J
−Y−
5
B
DETAIL E
L
1
4
R
G
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
S
U
C
−T−
SEATING
PLANE
0.10 (0.004)
M
H
0.10 (0.004) T
K
D
N
R 0.10 TYP
T X Y
V
M
F
DETAIL E
SOLDERING FOOTPRINT*
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
3.8
0.015
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
NL27WZ08
PACKAGE DIMENSIONS
UDFN8, 1.45x1, 0.35P
CASE 517BZ
ISSUE O
ÉÉ
ÉÉ
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.48
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.45 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
L
8X
0.22
4
L1
1.18
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
NOTE 3
1
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
8
NL27WZ08
PACKAGE DIMENSIONS
UDFN8, 1.6x1, 0.4P
CASE 517BY
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
0.49
e/2
e
1
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.00 BSC
0.40 BSC
0.25
0.35
0.30
0.40
L
8X
0.26
4
L1
1.24
8
5
BOTTOM VIEW
8X
0.53
b
0.10
M
C A B
0.05
M
C
1
PKG
OUTLINE
0.40
PITCH
DIMENSIONS: MILLIMETERS
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
NL27WZ08
PACKAGE DIMENSIONS
UDFN8, 1.95x1, 0.5P
CASE 517CA
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
ÉÉ
ÉÉ
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
E
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
0.05 C
A1
SIDE VIEW
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
7X
e/2
e
7X
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.95 BSC
1.00 BSC
0.50 BSC
0.25
0.35
0.30
0.40
0.49
L
8X
0.30
4
1
L1
1.24
8
5
BOTTOM VIEW
8X
b
0.10
M
C A B
0.05
M
C
0.54
NOTE 3
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
1
PKG
OUTLINE
NL27WZ08
PACKAGE DIMENSIONS
UQFN8, 1.6x1.6, 0.5P
CASE 523AN
ISSUE O
A
B
D
PIN ONE
REFERENCE
2X
0.10 C
ÉÉ
ÉÉ
EXPOSED Cu
E
A1
ÇÇ
ÉÉ
ÉÉ
MOLD CMPD
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
DETAIL B
DIM
A
A1
A3
b
D
E
e
L
L1
L3
OPTIONAL
CONSTRUCTION
2X
0.10 C
TOP VIEW
L1
(A3)
DETAIL B
L3
A
0.05 C
b
0.05 C
SIDE VIEW
(0.10)
C
A1
SEATING
PLANE
(0.15)
8X
L
1.70
OPTIONAL
CONSTRUCTION
1
DETAIL A
0.50
PITCH
1
e
5
3
SOLDERING FOOTPRINT*
DETAIL A
8X
L3
MILLIMETERS
MIN
MAX
0.45
0.60
0.00
0.05
0.13 REF
0.15
0.25
1.60 BSC
1.60 BSC
0.50 BSC
0.35
0.45
−−−
0.15
0.25
0.35
0.35
1.70
7
8
8X
b
7X
0.10 C A B
BOTTOM VIEW
0.05 C
0.25
8X
0.53
NOTE 3
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
NL27WZ08
PACKAGE DIMENSIONS
UQFN8, 1.4x1.2, 0.4P
CASE 523AS
ISSUE A
PIN ONE
REFERENCE
2X
2X
0.10 C
L1
ÉÉ
ÉÉ
0.10 C
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
EXPOSED Cu
(A3)
A
MOLD CMPD
DETAIL B
0.05 C
ALTERNATE
CONSTRUCTION
0.05 C
A1
SIDE VIEW
L2
DETAIL A
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ÉÉ
ÇÇ
TOP VIEW
DETAIL B
8X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
L
L
A
B
D
2
C
SOLDERING FOOTPRINT*
SEATING
PLANE
1.61
0.55
L
4
1
e
8
1.40
6
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
1.40 BSC
1.20 BSC
0.40 BSC
0.20
0.40
−−−
0.15
0.30
0.50
6X
1
7X
0.45
b
0.10
M
C A B
0.05
M
C
NOTE 3
8X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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