NLV37WZ04USG

DATA SHEET www.onsemi.com Triple Buffer with Open Drain Outputs MARKING DIAGRAMS NL37WZ07 US8 US SUFFIX CASE 493 The NL37WZ07 is a high performance triple buffer with open drain outputs operating from a 1.65 V to 5.5 V supply. Commercial Features • • • • • • • • XXXX ALYW Designed for 1.65 V to 5.5 V VCC Operation 2.1 ns tPD at VCC = 5 V (Typ) Inputs/Outputs Overvoltage Tolerant up to 5.5 V IOFF Supports Partial Power Down Protection Source/Sink 24 mA at 3.0 V Available in US8, UDFN8 and UQFN8 Packages Chip Complexity < 100 FETs These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant A1 1 Y1 A2 1 Y2 A3 1 Y3 XX M G NLV Prefix UDFN8, 1.45x1.0 MU3 SUFFIX CASE 517BZ XM 1 UDFN8, 1.95x1.0 MU1 SUFFIX CASE 517CA 1 UQFN8, 1.4x1.2 MQ2 SUFFIX CASE 523AS XM XM 1 Figure 1. Logic Symbol 1 8 UQFN8, 1.6x1.6 MQ1 SUFFIX CASE 523AN X, XX, XXXX A L Y W M G 1 XX MG = Specific Device Code = Assembly Location = Lot Code = Year Code = Week Code = Date Code = Pb−Free Package ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2012 March, 2022 − Rev. 10 1 Publication Order Number: NL37WZ07/D NL37WZ07 A1 1 8 VCC Y3 2 7 Y1 A2 3 6 A3 GND 4 5 Y2 A1 1 8 VCC Y3 2 7 Y1 A2 3 6 A3 4 5 Y2 Y3 6 A2 5 VCC GND 4 8 1 Y1 GND US8 A1 7 2 A3 3 Y2 UQFN8 (Top View) UDFN8 Figure 2. Pinout PIN ASSIGNMENT FUNCTION TABLE Pin US8 / UDFN8 UQFN8 A Input Y Output 1 A1 Y1 L L 2 Y3 A3 H Z 3 A2 Y2 4 GND GND 5 Y2 A2 6 A3 Y3 7 Y1 A1 8 VCC VCC www.onsemi.com 2 NL37WZ07 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VIN DC Input Voltage NLV −0.5 to +7.0 −0.5 to +6.5 V VOUT Characteristics DC Output Voltage (NLV) Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +7.0 −0.5 to +7.0 V DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) −0.5 to VCC + 0.5 −0.5 to +6.5 −0.5 to +6.5 V VIN < GND −50 mA VOUT < GND −50 mA IIK DC Input Diode Current IOK DC Output Diode Current IOUT DC Output Source/Sink Current ±50 mA DC Supply Current per Supply Pin or Ground Pin ±100 mA −65 to +150 °C ICC or IGND TSTG Storage Temperature Range TL Lead Temperature, 1 mm from Case for 10 secs 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) US8 UQFN8 UDFN8 250 210 231 °C/W PD Power Dissipation in Still Air US8 UQFN8 UDFN8 500 595 541 mW Level 1 − MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − ESD Withstand Voltage (Note 3) Human Body Model Charged Device Model 2000 1000 V ±100 mA VESD ILatchup Latchup Performance (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A. 4. Tested to EIA/JESD78 Class II. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics VCC Positive DC Supply Voltage VIN DC Input Voltage VOUT TA tr , tf DC Output Voltage Active−Mode (High or Low State) Tri−State Mode (Note 1) Power−Down Mode (VCC = 0 V) Operating Temperature Range Input Rise and Fall Time VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 5.5 V Min Max Unit 1.65 5.5 V 0 5.5 V 0 0 0 VCC 5.5 5.5 −55 +125 °C 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 NL37WZ07 DC ELECTRICAL CHARACTERISTICS Symbol VIH VIL TA = 255C −555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units High−Level Input Voltage (NLV) 1.65 to 1.95 0.75 x VCC − − 0.75 x VCC − V 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − High−Level Input Voltage 1.65 to 1.95 0.65 x VCC − − 0.65 x VCC − 2.3 to 5.5 0.70 x VCC − − 0.70 x VCC − Low−Level Input Voltage (NLV) 1.65 to 1.95 − − 0.25 x VCC − 0.25 x VCC 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC Low−Level Input Voltage 1.65 to 1.95 − − 0.35 x VCC − 0.35 x VCC Parameter Condition V V V 2.3 to 5.5 − − 0.30 x VCC − 0.30 x VCC Low−Level Output Voltage VIN = VIH or VIL IOL = 100 mA IOL = 4 mA IOL = 8 mA IOL = 12 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 − − − − − − − − 0.08 0.2 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 − − − − − − − 0.1 0.24 0.3 0.4 0.4 0.55 0.55 IIN Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1 − ±1.0 mA IOZ 3−State Output Leakage Current VOUT = 0 V to 5.5 V 1.65 to 5.5 − − ±0.5 − ±5.0 mA IOFF Power Off Leakage Current VIN = 5.5 V or VOUT = 5.5 V 0 − − 1.0 − 10 mA ICC Quiescent Supply Current VIN = VCC or GND 5.5 − − 1.0 − 10 mA VOL V Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. AC ELECTRICAL CHARACTERISTICS Symbol tPZL tPLZ Parameter Condition Propagation Delay, A to Y (Figures 3 and 4) Propagation Delay, A to Y (Figures 3 and 4) TA = 255C −555C 3 TA 3 1255C VCC (V) Min Typ Max Min Max Units 1.65 to 1.95 − 6.0 9.0 − 9.5 ns 2.3 to 2.7 − 3.6 6.1 − 6.5 3.0 to 3.6 − 2.7 5.6 − 6.0 4.5 to 5.5 − 2.1 4.4 − 4.8 1.65 to 1.95 − 4.0 9.0 − 9.5 2.3 to 2.7 − 2.8 6.1 − 6.5 3.0 to 3.6 − 2.5 5.6 − 6.0 2.2 4.4 − 4.8 4.5 to 5.5 ns CAPACITIVE CHARACTERISTICS Symbol CIN Parameter Condition Typical Units Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF CPD Power Dissipation Capacitance (Note 5) 10 MHz, VCC = 3.3 V, VIN = 0 V or VCC 10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 9 11 pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC. www.onsemi.com 4 NL37WZ07 OPEN 2 x VCC Test Switch Position tPLH / tPHL Open tPLZ / tPZL 2 x VCC 50 500 500 tPHZ / tPZH GND 50 500 500 GND R1 OUTPUT DUT RL RT CL, pF RL, W R1 , W See AC Characteristics Table X = Don’t Care CL * CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 3 ns tf = 3 ns 90% 90% Vmi INPUT Vmi INPUT Vmi 10% 10% tPHL Vmi GND GND tPZL tPLH Vmo OUTPUT VCC VCC tPLZ ~VCC VOH Vmo OUTPUT Vmo VOL + VY VOL VOL tPLH OUTPUT tPHL Vmo tPZH VOH Vmo tPHZ VOH VOH − VY Vmo OUTPUT VOL ~0 V Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL 1.65 to 1.95 VCC/2 VCC/2 VCC/2 0.15 2.3 to 2.7 VCC/2 VCC/2 VCC/2 0.15 3.0 to 3.6 VCC/2 VCC/2 VCC/2 0.3 4.5 to 5.5 VCC/2 VCC/2 VCC/2 0.3 www.onsemi.com 5 tPZL, tPLZ, tPZH, tPHZ VY, V NL37WZ07 DEVICE ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping† NL37WZ07USG US8 L7 Q4 3000 / Tape & Reel NLV37WZ07USG* US8 L7 Q4 3000 / Tape & Reel NL37WZ07MQ1TCG (In Development) UQFN8, 1.6 x 1.6, 0.5P TBD TBD 3000 / Tape & Reel NL37WZ07MU1TCG (In Development) UDFN8, 1.95 x 1.0, 0.5P TBD TBD 3000 / Tape & Reel NL37WZ07MU3TCG (In Development) UDFN8, 1.45 x 1.0, 0.35P TBD TBD 3000 / Tape & Reel NL37WZ07MQ2TCG (In Development) UQFN8, 1.4 x 1.2, 0.4P TBD TBD 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 6 NL37WZ07 PACKAGE DIMENSIONS US8 CASE 493 ISSUE F *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 NL37WZ07 PACKAGE DIMENSIONS UDFN8, 1.45x1, 0.35P CASE 517BZ−01 ISSUE O ÉÉ ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* e/2 7X e 1 7X MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.48 L 8X 0.22 4 L1 1.18 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.53 NOTE 3 1 PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 NL37WZ07 PACKAGE DIMENSIONS UDFN8, 1.95x1, 0.5P CASE 517CA−01 ISSUE O PIN ONE REFERENCE 2X 0.10 C 2X ÉÉ ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D E DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A 0.05 C A1 SIDE VIEW C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* e/2 e 7X 7X L 0.49 4 1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 8X 0.30 L1 1.24 8 5 BOTTOM VIEW 8X b 0.10 M C A B 0.05 M C 0.54 NOTE 3 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 9 NL37WZ07 PACKAGE DIMENSIONS UQFN8, 1.4x1.2, 0.4P CASE 523AS ISSUE A ÉÉ ÉÉ PIN ONE REFERENCE 2X 2X 0.10 C 0.10 C L A B D L1 DETAIL A E ALTERNATE CONSTRUCTIONS EXPOSED Cu (A3) A MOLD CMPD DETAIL B 0.05 C ALTERNATE CONSTRUCTION 0.05 C A1 SIDE VIEW L2 DETAIL A DIM A A1 A3 b D E e L L1 L2 ÉÉ ÇÇ TOP VIEW DETAIL B 8X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. L 2 C SEATING PLANE SOLDERING FOOTPRINT* 1.61 L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.15 0.25 1.40 BSC 1.20 BSC 0.40 BSC 0.20 0.40 −−− 0.15 0.30 0.50 0.55 1 e 8 6 BOTTOM VIEW 6X 1.40 b 0.10 M C A B 0.05 M C 1 7X 0.45 NOTE 3 8X 0.25 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 10 NL37WZ07 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN−01 ISSUE O A B D PIN ONE REFERENCE 2X 0.10 C ÉÉ ÉÉ E A1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. MOLD CMPD EXPOSED Cu ÇÇÇ ÉÉÉ ÉÉÉ A3 DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 2X 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.15) (0.10) C A1 SEATING PLANE MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 DETAIL A OPTIONAL CONSTRUCTION 8X 8X L3 L SOLDERING FOOTPRINT* e 1.70 5 3 0.50 PITCH 1 1 7 8 DETAIL A 8X b 0.35 0.10 C A B BOTTOM VIEW 0.05 C 1.70 NOTE 3 7X 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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