NLV74HC595ADTR2G

8-Bit Serial-Input/Serial or Parallel-Output Shift Register with Latched 3-State Outputs High−Performance Silicon−Gate CMOS www.onsemi.com MC74HC595A The MC74HC595A consists of an 8−bit shift register and an 8−bit D−type latch with three−state parallel outputs. The shift register accepts serial data and provides a serial output. The shift register also provides parallel data to the 8−bit latch. The shift register and latch have independent clock inputs. This device also has an asynchronous reset for the shift register. The HC595A directly interfaces with the SPI serial data port on CMOS MPUs and MCUs. SOIC−16 D SUFFIX CASE 751B Features • • • • • • • • • • Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7 A Chip Complexity: 328 FETs or 82 Equivalent Gates Improvements over HC595 ♦ Improved Propagation Delays ♦ 50% Lower Quiescent Power ♦ Improved Input Noise and Latchup Immunity NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free and are RoHS Compliant TSSOP−16 DT SUFFIX CASE 948F 1 QFN16 MN SUFFIX CASE 485AW MARKING DIAGRAMS 16 16 HC 595A ALYWG G HC595AG AWLYWW 1 1 SOIC−16 TSSOP−16 595A ALYWG G QFN16* *V595A marking used for NLV74HC595AMN1TWG A WL, L YY, Y WW, W G, G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 11 of this data sheet. © Semiconductor Components Industries, LLC, 2016 July, 2021 − Rev. 25 1 Publication Order Number: MC74HC595A/D MC74HC595A QB 1 16 VCC QC 2 15 QA QC 2 QD 3 14 A QD 3 QE 4 13 OUTPUT ENABLE QE 4 QF 5 12 LATCH CLOCK QF 5 QG 6 11 SHIFT CLOCK QG 6 QH 7 10 RESET QH 7 GND 8 9 QB VCC 1 16 15 QA 14 A 13 OUTPUT ENABLE GND 12 LATCH CLOCK 11 SHIFT CLOCK 8 9 GND SQH SQH SOIC, TSSOP 10 RESET QFN Figure 1. Pin Assignments LOGIC DIAGRAM SERIAL DATA INPUT A 14 15 1 2 3 4 SHIFT REGISTER LATCH 5 6 7 SHIFT 11 CLOCK 10 RESET 9 LATCH 12 CLOCK OUTPUT 13 ENABLE QA QB QC QD QE QF QG QH SQH VCC = PIN 16 GND = PIN 8 www.onsemi.com 2 PARALLEL DATA OUTPUTS SERIAL DATA OUTPUT MC74HC595A MAXIMUM RATINGS Symbol Parameter Value Unit –0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) Vin DC Input Voltage (Referenced to GND) –0.5 to VCC+0.5 V Vout DC Output Voltage (Referenced to GND) –0.5 to VCC+0.5 V Iin DC Input Current, per Pin ±20 mA Iout DC Output Current, per Pin ±35 mA ICC DC Supply Current, VCC and GND Pins ±75 mA PD Power Dissipation in Still Air, 500 450 mW Tstg Storage Temperature –65 to +150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) 260 VESD ESD Withstand Voltage Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) > 3000 > 400 N/A SOIC Package† TSSOP Package† This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. _C V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. †Derating: SOIC Package: –7 mW/_C from 65_ to 125_C TSSOP Package: −6.1 mW/_C from 65_ to 125_C 1. Tested to EIA/JESD22−A114−A. 2. Tested to EIA/JESD22−A115−A. 3. Tested to JESD22−C101−A. RECOMMENDED OPERATING CONDITIONS Symbol VCC Vin, Vout Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TA Operating Temperature, All Package Types tr, tf Input Rise and Fall Time (Figure 1) VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Min Max Unit 2.0 6.0 V 0 VCC V –55 +125 _C 0 0 0 1000 500 400 ns Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 3 MC74HC595A DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC V Guaranteed Limit –55 to 25_C ≤ 85_C ≤ 125_C Unit VIH Minimum High−Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| ≤ 20 mA 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 1.5 2.1 3.15 4.2 V VIL Maximum Low−Level Input Voltage Vout = 0.1 V or VCC – 0.1 V |Iout| ≤ 20 mA 2.0 3.0 4.5 6.0 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 0.5 0.9 1.35 1.8 V VOH Minimum High−Level Output Voltage, QA − QH Vin = VIH or VIL |Iout| ≤ 20 mA 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 V 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.2 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.4 0.4 0.4 2.0 4.5 6.0 1.9 4.4 5.9 1.9 4.4 5.9 1.9 4.4 5.9 3.0 4.5 6.0 2.48 3.98 5.48 2.34 3.84 5.34 2.2 3.7 5.2 2.0 4.5 6.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 6.0 0.26 0.26 0.26 0.33 0.33 0.33 0.4 0.4 0.4 Symbol Parameter Test Conditions Vin = VIH or VIL VOL Maximum Low−Level Output Voltage, QA − QH Vin = VIH or VIL |Iout| ≤ 20 mA Vin = VIH or VIL VOH Minimum High−Level Output Voltage, SQH Maximum Low−Level Output Voltage, SQH |Iout| ≤ 2.4 mA |Iout| ≤ 6.0 mA |Iout| ≤ 7.8 mA Vin = VIH or VIL IIoutI ≤ 20 mA Vin = VIH or VIL VOL |Iout| ≤ 2.4 mA |Iout| ≤ 6.0 mA |Iout| ≤ 7.8 mA |Iout| ≤ 2.4 mA IIoutI ≤ 4.0 mA IioutI ≤ 5.2 mA Vin = VIH or VIL IIoutI ≤ 20 mA Vin = VIH or VIL |Iout| ≤ 2.4 mA IIoutI ≤ 4.0 mA IioutI ≤ 5.2 mA V V V Iin Maximum Input Leakage Current Vin = VCC or GND 6.0 ±0.1 ±1.0 ±1.0 mA IOZ Maximum Three−State Leakage Current, QA − QH Output in High−Impedance State Vin = VIL or VIH Vout = VCC or GND 6.0 ±0.5 ±5.0 ±10 mA ICC Maximum Quiescent Supply Current (per Package) Vin = VCC or GND lout = 0 mA 6.0 4.0 40 160 mA www.onsemi.com 4 MC74HC595A AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns) VCC V Guaranteed Limit –55 to 25_C ≤ 85_C ≤ 125_C Unit fmax Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 7) 2.0 3.0 4.5 6.0 6.0 15 30 35 4.8 10 24 28 4.0 8.0 20 24 MHz tPLH, tPHL Maximum Propagation Delay, Shift Clock to SQH (Figures 1 and 7) 2.0 3.0 4.5 6.0 140 100 28 24 175 125 35 30 210 150 42 36 ns tPHL Maximum Propagation Delay, Reset to SQH (Figures 2 and 7) 2.0 3.0 4.5 6.0 145 100 29 25 180 125 36 31 220 150 44 38 ns tPLH, tPHL Maximum Propagation Delay, Latch Clock to QA − QH (Figures 3 and 7) 2.0 3.0 4.5 6.0 140 100 28 24 175 125 35 30 210 150 42 36 ns tPLZ, tPHZ Maximum Propagation Delay, Output Enable to QA − QH (Figures 4 and 8) 2.0 3.0 4.5 6.0 150 100 30 26 190 125 38 33 225 150 45 38 ns tPZL, tPZH Maximum Propagation Delay, Output Enable to QA − QH (Figures 4 and 8) 2.0 3.0 4.5 6.0 135 90 27 23 170 110 34 29 205 130 41 35 ns tTLH, tTHL Maximum Output Transition Time, QA − QH (Figures 3 and 7) 2.0 3.0 4.5 6.0 60 23 12 10 75 27 15 13 90 31 18 15 ns tTLH, tTHL Maximum Output Transition Time, SQH (Figures 1 and 7) 2.0 3.0 4.5 6.0 75 27 15 13 95 32 19 16 110 36 22 19 ns Symbol Parameter Cin Maximum Input Capacitance − 10 10 10 pF Cout Maximum Three−State Output Capacitance (Output in High−Impedance State), QA − QH − 15 15 15 pF Typical @ 25°C, VCC = 5.0 V CPD 300 Power Dissipation Capacitance (Per Package)* www.onsemi.com 5 pF MC74HC595A TIMING REQUIREMENTS (Input tr = tf = 6.0 ns) VCC V Guaranteed Limit 25_C to –55_C ≤ 85_C ≤ 125_C Unit tsu Minimum Setup Time, Serial Data Input A to Shift Clock (Figure 5) 2.0 3.0 4.5 6.0 50 40 10 9.0 65 50 13 11 75 60 15 13 ns tsu Minimum Setup Time, Shift Clock to Latch Clock (Figure 6) 2.0 3.0 4.5 6.0 75 60 15 13 95 70 19 16 110 80 22 19 ns th Minimum Hold Time, Shift Clock to Serial Data Input A (Figure 5) 2.0 3.0 4.5 6.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 ns trec Minimum Recovery Time, Reset Inactive to Shift Clock (Figure 2) 2.0 3.0 4.5 6.0 50 40 10 9.0 65 50 13 11 75 60 15 13 ns tw Minimum Pulse Width, Reset (Figure 2) 2.0 3.0 4.5 6.0 60 45 12 10 75 60 15 13 90 70 18 15 ns tw Minimum Pulse Width, Shift Clock (Figure 1) 2.0 3.0 4.5 6.0 50 40 10 9.0 65 50 13 11 75 60 15 13 ns tw Minimum Pulse Width, Latch Clock (Figure 6) 2.0 3.0 4.5 6.0 50 40 10 9.0 65 50 13 11 75 60 15 13 ns tr, tf Maximum Input Rise and Fall Times (Figure 1) 2.0 3.0 4.5 6.0 1000 800 500 400 1000 800 500 400 1000 800 500 400 ns Symbol Parameter www.onsemi.com 6 MC74HC595A FUNCTION TABLE Inputs Operation Reset Resulting Function Serial Input A Shift Clock Latch Clock Output Enable Shift Register Contents Latch Register Contents Serial Output SQH Parallel Outputs QA − QH Reset shift register L X X L, H, ↓ L L U L U Shift data into shift register H D ↑ L, H, ↓ L D → SRA; SRN → SRN+1 U SRG → SRH U Shift register remains unchanged H X L, H, ↓ L, H, ↓ L U U U U Transfer shift register contents to latch register H X L, H, ↓ ↑ L U SRN → LRN U SRN Latch register remains unchanged X X X L, H, ↓ L * U * U Enable parallel outputs X X X X L * ** * Enabled Force outputs into high impedance state X X X X H * ** * Z SR = shift register contents LR = latch register contents D = data (L, H) logic level U = remains unchanged ↑ = Low−to−High ↓ = High−to−Low * = depends on Reset and Shift Clock inputs ** = depends on Latch Clock input PIN DESCRIPTIONS INPUTS A (Pin 14) Output Enable (Pin 13) Active−low Output Enable. A low on this input allows the data from the latches to be presented at the outputs. A high on this input forces the outputs (QA−QH) into the high−impedance state. The serial output is not affected by this control unit. Serial Data Input. The data on this pin is shifted into the 8−bit serial shift register. CONTROL INPUTS Shift Clock (Pin 11) Shift Register Clock Input. A low− to−high transition on this input causes the data at the Serial Input pin to be shifted into the 8−bit shift register. OUTPUTS QA − QH (Pins 15, 1, 2, 3, 4, 5, 6, 7) Reset (Pin 10) SQH (Pin 9) Noninverted, 3−state, latch outputs. Active−low, Asynchronous, Shift Register Reset Input. A low on this pin resets the shift register portion of this device only. The 8−bit latch is not affected. Noninverted, Serial Data Output. This is the output of the eighth stage of the 8−bit shift register. This output does not have three−state capability. Latch Clock (Pin 12) Storage Latch Clock Input. A low−to−high transition on this input latches the shift register data. www.onsemi.com 7 MC74HC595A SWITCHING WAVEFORMS tr SHIFT CLOCK tw tf VCC VCC 90% 50% 10% tw GND GND tPHL 1/fmax OUTPUT SQH 50% OUTPUT SQH tPHL tPLH 50% RESET 90% 50% 10% trec VCC SHIFT CLOCK tTLH 50% GND tTHL Figure 1. LATCH CLOCK Figure 2. OUTPUT ENABLE VCC 50% VCC 50% GND GND tPLH tPZL tPHL OUTPUT Q OUTPUT Q tTLH 10% VOL 90% VOH HIGH IMPEDANCE tTHL Figure 4. VCC SHIFT CLOCK VALID VCC 50% GND 50% tsu GND LATCH CLOCK th VCC SWITCH CLOCK tPHZ 50% Figure 3. tsu HIGH IMPEDANCE 50% tPZH 90% QA-QH 50% OUTPUTS 10% SERIAL INPUT A tPLZ VCC 50% GND 50% tw GND Figure 6. Figure 5. TEST CIRCUITS TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST OUTPUT DEVICE UNDER TEST CL* *Includes all probe and jig capacitance 1 kW CL* CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 7. Figure 8. www.onsemi.com 8 MC74HC595A EXPANDED LOGIC DIAGRAM OUTPUT ENABLE 13 LATCH CLOCK 12 SERIAL DATA INPUT A 14 D Q D SRA Q 15 QA LRA R Q D D SRB Q 1 QB LRB R Q D D SRC Q 2 QC LRC R Q D D SRD Q 3 QD LRD PARALLEL DATA OUTPUTS R Q D D SRE Q 4 QE LRE R Q D D SRF Q 5 QF LRF R Q D D SRG Q 6 QG LRG R SHIFT CLOCK Q D 11 D SRH Q 7 QH LRH R RESET 10 9 www.onsemi.com 9 SERIAL DATA OUTPUT SQH MC74HC595A TIMING DIAGRAM SHIFT CLOCK SERIAL DATA INPUT A RESET LATCH CLOCK OUTPUT ENABLE QA QB QC QD QE QF QG QH SERIAL DATA OUTPUT SQH NOTE: implies that the output is in a high−impedance state. www.onsemi.com 10 MC74HC595A ORDERING INFORMATION Device Package Shipping† MC74HC595ADG 48 Units / Rail NLV74HC595ADG* 48 Units / Rail MC74HC595ADR2G NLV74HC595ADR2G* SOIC−16 (Pb−Free) 2500 / Tape & Reel 2500 / Tape & Reel MC74HC595AADR2G 2500 / Tape & Reel NLV74HC595AADR2G* (Contact ON Semiconductor) 2500 / Tape & Reel MC74HC595ADTG 96 Units / Tube NLV74HC595ADTG* MC74HC595ADTR2G 96 Units / Tube TSSOP−16 (Pb−Free) 2500 / Tape & Reel NLV74HC595ADTR2G* 2500 / Tape & Reel NLV74HC595AADTR2G* 2500 / Tape & Reel MC74HC595AMNTWG# NLV74HC595AMNTWG*# 3000 / Tape & Reel QFN16 (Pb−Free) NLV74HC595AMN1TWG*# 3000 / Tape & Reel 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. #MN suffix is with pull−back lead, MN1 is without pull−back lead. Refer to ’Detail A’ of case outline on page 13. www.onsemi.com 11 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN16, 2.5x3.5, 0.5P CASE 485AW−01 ISSUE O 1 SCALE 2:1 D PIN ONE REFERENCE A B ÉÉÉ ÉÉÉ ÉÉÉ DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS E TOP VIEW MOLD CMPD DETAIL B ALTERNATE CONSTRUCTIONS A DETAIL B (A3) 0.10 C NOTE 4 C SIDE VIEW XXXX ALYWG G SEATING PLANE 0.15 C A B XXXX = Specific Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) D2 16X L K 8 10 DETAIL A 0.15 C A B E2 16X 2 15 e MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.20 0.30 2.50 BSC 0.85 1.15 3.50 BSC 1.85 2.15 0.50 BSC 0.20 --0.35 0.45 --0.15 GENERIC MARKING DIAGRAM* A1 0.08 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 ÇÇÇ ÇÇÇ ÉÉÉ ÉÉÉ EXPOSED Cu 0.15 C 2X L L1 0.15 C 2X 16X L DATE 11 DEC 2008 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. b 0.10 C A B 1 0.05 C NOTE 3 SOLDERING FOOTPRINT* e/2 3.80 BOTTOM VIEW 2.10 0.50 PITCH 2.80 1.10 1 16X 0.60 16X 0.30 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: DESCRIPTION: 98AON36347E QFN16, 2.5X3.5, 0.5P Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOIC−16 CASE 751B−05 ISSUE K DATE 29 DEC 2006 SCALE 1:1 −A− 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 _ C −T− SEATING PLANE J M D DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 16 PL 0.25 (0.010) M T B S A S STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR COLLECTOR BASE EMITTER NO CONNECTION EMITTER BASE COLLECTOR EMITTER COLLECTOR STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE CATHODE ANODE NO CONNECTION CATHODE CATHODE NO CONNECTION ANODE CATHODE STYLE 3: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. COLLECTOR, DYE #1 BASE, #1 EMITTER, #1 COLLECTOR, #1 COLLECTOR, #2 BASE, #2 EMITTER, #2 COLLECTOR, #2 COLLECTOR, #3 BASE, #3 EMITTER, #3 COLLECTOR, #3 COLLECTOR, #4 BASE, #4 EMITTER, #4 COLLECTOR, #4 STYLE 4: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. STYLE 5: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. DRAIN, DYE #1 DRAIN, #1 DRAIN, #2 DRAIN, #2 DRAIN, #3 DRAIN, #3 DRAIN, #4 DRAIN, #4 GATE, #4 SOURCE, #4 GATE, #3 SOURCE, #3 GATE, #2 SOURCE, #2 GATE, #1 SOURCE, #1 STYLE 6: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE CATHODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE ANODE STYLE 7: PIN 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. SOURCE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE P‐CH SOURCE P‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) GATE N‐CH COMMON DRAIN (OUTPUT) COMMON DRAIN (OUTPUT) SOURCE N‐CH COLLECTOR, DYE #1 COLLECTOR, #1 COLLECTOR, #2 COLLECTOR, #2 COLLECTOR, #3 COLLECTOR, #3 COLLECTOR, #4 COLLECTOR, #4 BASE, #4 EMITTER, #4 BASE, #3 EMITTER, #3 BASE, #2 EMITTER, #2 BASE, #1 EMITTER, #1 SOLDERING FOOTPRINT 8X 6.40 16X 1 1.12 16 16X 0.58 1.27 PITCH 8 9 DIMENSIONS: MILLIMETERS DOCUMENT NUMBER: DESCRIPTION: 98ASB42566B SOIC−16 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSSOP−16 CASE 948F−01 ISSUE B 16 DATE 19 OCT 2006 1 SCALE 2:1 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U S V S K S ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION N−N J PIN 1 IDENT. N 8 1 0.25 (0.010) M 0.15 (0.006) T U S A −V− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. N F DETAIL E −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ GENERIC MARKING DIAGRAM* SOLDERING FOOTPRINT 7.06 16 XXXX XXXX ALYW 1 1 0.65 PITCH 16X 0.36 DOCUMENT NUMBER: DESCRIPTION: 16X 1.26 98ASH70247A TSSOP−16 DIMENSIONS: MILLIMETERS XXXX A L Y W G or G = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Electronic versions are uncontrolled except when accessed directly from the Document Repository. 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