NLV74LCX02DTR2G

MC74LCX02 Low-Voltage CMOS Quad 2-Input NOR Gate With 5 V−Tolerant Inputs The MC74LCX02 is a high performance, quad 2−input NOR gate operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX02 inputs to be safely driven from 5 V devices. Current drive capability is 24 mA at the outputs. http://onsemi.com SOIC−14 NB D SUFFIX CASE 751A TSSOP−14 DT SUFFIX CASE 948G Features • • • • • • PIN ASSIGNMENT Designed for 2.3 V to 3.6 V VCC Operation 5 V Tolerant Inputs − Interface Capability With 5 V TTL Logic VCC O2 B2 A2 O3 B3 A3 LVTTL Compatible 14 13 12 11 10 9 8 LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA • • ESD Performance: Human Body Model >2000 V; • Machine Model >200 V These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 1 2 3 4 5 6 7 O0 A0 B0 O1 A1 B1 GND MARKING DIAGRAMS 14 A0 B0 A1 B1 A2 B2 A3 B3 LCX02G AWLYWW 2 1 3 O0 1 5 4 6 SOIC−14 NB O1 11 14 13 12 LCX 02 ALYWG G O2 8 10 9 O3 1 TSSOP−14 Figure 1. Logic Diagram A WL, L Y WW, W G or G PIN NAMES Pins Function An, Bn Data Inputs On Outputs = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 10 1 Publication Order Number: MC74LCX02/D MC74LCX02 TRUTH TABLE Inputs Outputs An Bn On L L H L H L H L L H H L H = High Voltage Level L = Low Voltage Level For ICC reasons, DO NOT FLOAT Inputs MAXIMUM RATINGS Symbol VCC Parameter Value DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current Condition Unit −0.5 to +7.0 V −0.5 ≤ VI ≤ +7.0 V −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V −50 VI < GND mA −50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range MSL Moisture Sensitivity °C −65 to +150 Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Type Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC Supply Voltage VI Input Voltage VO Output Voltage (HIGH or LOW State) (3−State) IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V −24 −12 −8 mA IOL LOW Level Output Current VCC = 3.0 V − 3.6 V VCC = 2.7 V − 3.0 V VCC = 2.3 V − 2.7 V +24 +12 +8 mA TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V −40 +85 °C 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 MC74LCX02 DC ELECTRICAL CHARACTERISTICS TA = −40°C to +85°C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 2.3 V ≤ VCC ≤ 2.7 V 1.7 2.7 V ≤ VCC ≤ 3.6 V 2.0 Max Unit V 2.3 V ≤ VCC ≤ 2.7 V 0.7 2.7 V ≤ VCC ≤ 3.6 V 0.8 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mA VCC − 0.2 VCC = 2.3 V; IOH = −8 mA 1.8 VCC = 2.7 V; IOH = −12 mA 2.2 VCC = 3.0 V; IOH = −18 mA 2.4 VCC = 3.0 V; IOH = −24 mA 2.2 V V 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 V VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA IOFF Power Off Leakage Current IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5 mA ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA 2. These values of VI are used to test DC electrical characteristics only. AC CHARACTERISTICS (tR = tF = 2.5 ns; RL = 500 W) Limits TA = −40°C to +85°C Symbol VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Parameter Waveform Min Max Min Max Min Max Unit tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns tPHL Input−to−Output 1.5 5.5 1.5 6.2 1.5 6.6 tOSHL Output−to−Output Skew 1.0 tOSLH (Note 3) 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol VOLP VOLV Characteristic Condition Min Typ Max Unit Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V 4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is measured in the LOW state. http://onsemi.com 3 MC74LCX02 CAPACITIVE CHARACTERISTICS Symbol Condition Typical Unit CIN Input Capacitance Parameter VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF Vcc Vmi An, Bn Vmi 0V tPHL tPLH VOH Vmo On Vmo VOL WAVEFORM 1 − PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 2. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 3. Test Circuit http://onsemi.com 4 MC74LCX02 ORDERING INFORMATION Package Shipping† MC74LCX02DG SOIC−14 NB (Pb−Free) 55 Units / Rail MC74LCX02DR2G SOIC−14 NB (Pb−Free) 2500 Tape & Reel MC74LCX02DTG TSSOP−14 (Pb−Free) 96 Units / Rail MC74LCX02DTR2G TSSOP−14 (Pb−Free) 2500 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 5 MC74LCX02 PACKAGE DIMENSIONS TSSOP−14 DT SUFFIX CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S S N 2X 14 L/2 0.25 (0.010) 8 M B −U− L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A −V− ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 −−− 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 INCHES MIN MAX 0.193 0.200 0.169 0.177 −−− 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74LCX02 PACKAGE DIMENSIONS SOIC−14 NB CASE 751A−03 ISSUE K D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S e DETAIL A h A X 45 _ M A1 C SEATING PLANE DIM A A1 A3 b D E e H h L M MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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