NLX2G16CMUTCG

NLX2G16 Dual Buffer The NLX2G16 MiniGatet is an advanced high−speed CMOS dual non−inverting buffer in ultra−small footprint. The NLX2G16 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. www.onsemi.com Features MARKING DIAGRAMS UDFN6 1.0 x 1.0 CASE 517BX M UDFN6 1.2 x 1.0 CASE 517AA D M F • High Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C 24 mA Balanced Output Source and Sink Capability Balanced Propagation Delays Overvoltage Tolerant (OVT) Input and Output Pins Ultra−Small Packages NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant T • • • • • • • • M 1 1 UDFN6 1.45 x 1.0 CASE 517AQ 1 IN A1 1 6 OUT Y1 GND 2 5 VCC IN A2 3 4 OUT Y2 M = Date Code ORDERING INFORMATION See detailed ordering and shipping information on page 4 of this data sheet. Figure 1. Pinout (Top View) IN A1 1 OUT Y1 IN A2 1 OUT Y2 Figure 2. Logic Symbol PIN ASSIGNMENT 1 FUNCTION TABLE A Y L H L H © Semiconductor Components Industries, LLC, 2016 June, 2016 − Rev. 7 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 1 Publication Order Number: NLX2G16/D NLX2G16 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage −0.5 to +7.0 V VIN DC Input Voltage −0.5 to +7.0 V DC Output Voltage −0.5 to +7.0 V VIN < GND −50 mA VOUT < GND −50 mA VOUT Parameter IIK DC Input Diode Current IOK DC Output Diode Current IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current per Ground Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias 150 °C MSL FR ILATCHUP Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ±500 Latchup Performance Above VCC and Below GND at 125°C (Note 5) mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/UESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 1.65 5.5 V Digital Input Voltage 0 5.5 V Output Voltage 0 5.5 V −55 +125 °C 0 0 0 0 20 20 10 5 ns/V VCC Positive DC Supply Voltage VIN VOUT TA Operating Free−Air Temperature Dt/DV Input Transition Rise or Fall Rate VCC = 1.8 V ± 0.18 VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. www.onsemi.com 2 NLX2G16 DC ELECTRICAL CHARACTERISTICS VCC (V) Min Typ TA = +855C Max Min Max TA = −555C to +1255C Min Max Symbol Parameter VIH Low−Level Input Voltage 1.65−1.95 0.75 x VCC 0.75 x VCC 0.75 x VCC 2.3 to 5.5 0.70 x VCC 0.70 x VCC 0.70 x VCC Low−Level Input Voltage 1.65−1.95 0.25 x VCC 0.25 x VCC 0.25 x VCC 2.3 − 5.5 0.30 x VCC 0.30 x VCC 0.30 x VCC VIL VOH VOL High− Level Output Voltage Low−Level Output Voltage Conditions TA = 255C VIN = VIH or VIL IOH = −100 mA VIN = VIH or VIL IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA VIN = VIH or VIL IOL = 100 mA 1.65 − 5.5 VCC − 0.1 VCC VCC − 0.1 VCC − 0.1 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.8 2.68 4.2 1.29 1.9 2.4 2.3 3.8 1.29 1.9 2.4 2.3 3.8 1.65 − 5.5 Unit V V V 0.1 0.1 0.1 0.24 0.3 0.4 0.55 0.55 0.24 0.3 0.4 0.55 0.55 0.24 0.3 0.4 0.55 0.55 V VIN = VIH or VIL IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 1.65 2.3 3.0 3.0 4.5 Input Leakage Current 0 v VIN v 5.5 V 0 to 5.5 ±0.1 ±1.0 ±1.0 mA IOFF Power−Off Output Leakage Current VIN or VOUT = 5.5 V 0 1.0 10 10 mA ICC Quiescent Supply Current VIN = 0 V or VCC 5.5 1.0 10 10 mA IIN 0.08 0.1 0.15 0.22 0.22 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 3 NLX2G16 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) Parameter Symbol tPLH, tPHL Propagation Delay Input A to Output VCC (V) Test Condition 1.65−1.95 TA = −555C to +1255C TA = 255C Min Typ Max Min Max Unit RL = 1 MW, CL = 15 pF 1.8 8.0 9.6 1.8 10.2 ns 2.3−2.7 RL = 1 MW, CL = 15 pF 1.0 3.0 5.2 1.0 5.8 3.0−3.6 RL = 1 MW, CL = 15 pF 0.8 2.3 3.6 0.8 4.0 RL = 500 W, CL = 50 pF 1.2 3.0 4.6 1.2 5.1 RL = 1 MW, CL = 15 pF 0.5 1.8 2.9 0.5 3.2 RL = 500 W, CL = 50 pF 0.8 2.4 3.8 0.8 4.2 4.5−5.5 CIN Input Capacitance 5.5 VIN = 0 V or VCC 7.0 pF CPD Power Dissipation Capacitance (Note 6) 3.3 5.5 10 MHz VIN = 0 V or VCC 9 11 pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC. VCC VCC A or B 50% GND tPLH PULSE GENERATOR DUT RT tPHL CL RL Y 50% VCC RT = ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit Figure 3. Switching Waveforms ORDERING INFORMATION Package Shipping† NLX2G16MUTCG UDFN6, 1.2 x 1.0, 0.4P (Pb−Free) 3000 / Tape & Reel NLX2G16AMUTCG, NLVX2G16AMUTCG* UDFN6, 1.45 x 1.0, 0.5P (Pb−Free) 3000 / Tape & Reel NLX2G16CMUTCG UDFN6, 1.0 x 1.0, 0.35P (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable. www.onsemi.com 4 NLX2G16 PACKAGE DIMENSIONS UDFN6, 1.2x1.0, 0.4P CASE 517AA ISSUE D EDGE OF PACKAGE PIN ONE REFERENCE 2X 0.10 C L1 ÉÉ ÉÉ E DETAIL A Bottom View (Optional) TOP VIEW 2X EXPOSED Cu 0.10 C (A3) 0.10 C A1 A 10X 0.08 C MOLD CMPD ÉÉÉ ÉÉÉ DETAIL B Side View (Optional) SEATING PLANE SIDE VIEW A3 DIM A A1 A3 b D E e L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.20 BSC 1.00 BSC 0.40 BSC 0.30 0.40 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT* 6X 6X 0.42 0.22 C A1 5X 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. A B D L 3 L2 6X 0.40 PITCH b 0.10 C A B 0.05 C 6 4 DIMENSIONS: MILLIMETERS e NOTE 3 BOTTOM VIEW 1.07 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 5 NLX2G16 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 NLX2G16 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 6X BOTTOM VIEW b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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