NOIL1SM0300A-WWC

DATA SHEET www.onsemi.com LUPA300 CMOS Image Sensor NOIL1SM0300A Features • 640(H) x 480(V) Active Pixels (VGA Resolution) • 9.9 mm x 9.9 mm Square Pixels (Based on the High-Fill Factor • • • • • • • • • • • • Active Pixel Sensor Technology of FillFactory (US patent No. 6,225,670 and others)). Optical Format: 1/2 Optical Inch Pixel Rate of 80 MHz Frame Rate: 250 fps at Full Resolution On-Chip 10 bit ADCs Global Shutter Subsampling (Y Direction) Serial Pheripheral Interface (SPI) Programmable Read Out Direction (X and Y) Random Programmable Windowing Power Dissipation: 190 mW 48-pin LCC Package These Devices are Pb−Free and are RoHS Compliant Figure 1. LUPA300 Package Photo Applications • Machine Vision • Motion Tracking Overview This document describes the interfacing and driving of the LUPA300 image sensor. The pixel size and resolution result in a 6.3 mm x 4.7 mm optical active area (1/2 inch). This VGA-resolution CMOS active pixel sensor features global shutter and a maximal frame rate of 250 fps in full resolution, where integration during readout is possible. The readout speed can be boosted by means of subsampling and windowed Region Of Interest (ROI) readout. High dynamic range scenes can be captured using the double and multiple slope functionality. User programmable row and column start/stop positions allow windowing. subsampling reduces resolution while maintaining the constant field of view and an increased frame rate. The programmable gain and offset amplifier maps the signal swing to the ADC input range. A 10-bit ADC converts the analog data to a 10-bit digital word stream. The sensor uses a 3-wire Serial-Parallel (SPI) interface. It operates with a 3.3 V and 2.5 V power supply and requires only one master clock for operation up to 80 MHz pixel rate. It is housed in an 48-pin ceramic LCC package. The sensor is available in a monochrome version or Bayer (RGB) patterned color filter array. This data sheet allows the user to develop a camera-system based on the described timing and interfacing. ORDERING INFORMATION Marketing Part Number Description NOIL1SM0300A-QDC Mono with Glass NOIL1SE0300A-QDC Color micro lens with Glass NOIL1SM0300A-WWC Mono Wafer Sales © Semiconductor Components Industries, LLC, 2014 August, 2021 − Rev. 12 1 Package 48 pin LCC Wafer Sales Publication Order Number: NOIL1SM0300A/D NOIL1SM0300A SPECIFICATIONS GENERAL SPECIFICATIONS Parameter ELECTRO−OPTICAL SPECIFICATIONS Specifications Parameter Typical Specifications Pixel Architecture 6 transistor pixel Optical Format ½ optical inch Pixel Size 9.9 mm x 9.9 mm Shutter Type Pipelined Global shutter Resolution 640 (H) x 480 (V) Frame Rate 250 fps Subsampling subsampling is possible (only in the Y-direction) Sub-sampling pattern: Y0Y0Y0Y0 FPN 2.5% RMSp-p (Min: 10%, Max: 3.1%) PRNU 2.5% RMS, Max: 3.1% Randomly programmable ROI read out. Implemented as scanning of lines/columns from an uploaded position Conversion gain 34 uV/e- at output Saturation charge 35.000 e- Sensitivity 3200 V.m2/W.s Windowing (ROI) Read out direction Read out direction can be reversed in X and Y Programmable gain Range x1 to x16, in 16 steps using 4-bits programming Programmable offset 256 steps (8 bit) Digital output On−chip 10−bit ADCs at 80 Msamples/s Power dissipation 17 V/lux.s (180 lux = 1 W/m2) Peak QE * FF 45% Dark current (at 21°C) 300 mV/s Noise electrons 32e- S/N ratio 43 dB 160 mW not including output load Parasitic sensitivity 1/5000 190 mW with output load of 15 pF Dynamic Range 61 dB Package type 48 pin LCC Extended dynamic range Multiple slope (up to 90 dB optical dynamic range) Mass ±1 g MTF 60% ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Table 1. RECOMMENDED OPERATING RATINGS (Notes 1 and 2) Symbol TJ Parameter Operating temperature range Min Max Units −40 70 °C Table 2. ABSOLUTE MAXIMUM RATINGS (Notes 2, 3 and 4) Symbol VDD [5] TS %RH ESD[3] & LU[4] Parameter Min Max Units DC Supply Voltage −0.5 4.3 V Storage Temperature −30 +85 °C − 85% at 85°C Humidity (Relative) ESD & Latch−up (Notes 3 and 4) mA 1. Operating ratings are conditions in which operation of the device is intended to be functional. All parameters are characterized for DC conditions after thermal equilibrium is established. Unused inputs must always be tied to an appropriate logic level, for example, VDD or GND. 2. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. 3. This device does NOT contain circuitry to protect the inputs against damage caused by high static voltages or electric fields. onsemi recommends that customers become familiar with, and follow the procedures in JEDEC Standard JESD625−A. Refer to Application Note AN52561. 4. The LUPA300 does not have latchup protection. 5. VDD = VDDD = VDDA (VDDD is supply to digital circuit, VDDA to analog circuit). www.onsemi.com 2 NOIL1SM0300A Spectral Response Curve 0.16 0.14 Response (A/W) 0.12 0.1 0.08 0.06 0.04 0.02 0 400 500 600 700 800 900 1000 Wavelength (nm) Figure 2. Spectral Response of LUPA300 Photo−voltaic Response Curve 1.2 Output Voltage (analog) 1 0.8 0.6 0.4 0.2 0 0.00E+00 1.00E+04 2.00E+04 3.00E+04 4.00E+04 5.00E+04 electrons Figure 3. Photo−voltaic Response LUPA300 www.onsemi.com 3 6.00E+04 7.00E+04 NOIL1SM0300A SENSOR ARCHITECTURE The PGAs amplify the signal from the column and add an offset so the signal fits in the input range of the ADC. The four ADCs then convert the signal to the digital domain. Pixels are selected in a 4 * 1 kernel. Every ADC samples the signal from one of the 4 selected pixels. Sampling frequency is 20 MHz. The digital outputs of the four ADCs are multiplexed to one output bus operating at 80 MHz. The floor plan of the architecture is shown in Figure 4. The image core consists of a pixel array, an X- and Y-addressing register, pixel array drivers, and column amplifiers. The image sensor of 640 x 480 pixels is read out in progressive scan. The architecture allows programmable addressing in the x-direction in steps of 8 pixels and in the y-direction in steps of 1 pixel. The starting point of the address is uploadable by means of the Serial Parallel Interface (SPI). Figure 4. Floor Plan of the Sensor Pixel Architecture The LUPA300 is designed on the 6T pixel architecture. Color Filter The LUPA300 can also be processed with a Bayer RGB color pattern. Pixel (0,0) has a red filter. Figure 5. Color Filter Arrangement on the Pixels www.onsemi.com 4 NOIL1SM0300A Frame Rate and Windowing Example: read out of the full resolution at nominal speed (80 MHz pixel rate = 12.5 ns, GRAN=10): Frame period = 7.8 ms + (480 * (400 ns + 12.5 ns * 640) = 4.039 ms => 247.6 fps. In case the sensor operates in subsampling, the ROT is enlarged with 8 clock periods. Frame Rate The frame rate depends on the input clock, the Frame Overhead Time (FOT) and the Row Overhead Time (ROT). The frame period is calculated as follows Frame period = FOT + Nr. Lines * (ROT + Nr. Pixels * clock period) Table 3. FRAME RATE PARAMETERS Parameter FOT Comment Clarification Frame Overhead Time 1200 clock periods for GRAN = 11 624 clock periods for GRAN = 10 336 clock periods for GRAN = 01 192 clock periods for GRAN = 00 ROT Row Overhead Time 48 clock periods for GRAN = 11 32 clock periods for GRAN = 10 24 clock periods for GRAN = 01 20 clock periods for GRAN = 00 Nr. Lines Number of lines read out each frame Nr. Pixels Number of pixels read out each line clock period 1/80 MHz = 12.5 ns line (every line can be addressed) in normal mode and 2 lines in subsampling mode. The window size in the x-direction is uploadable in register NB_OF_PIX. The window size in the y-direction is determined by the register FT_TIMER Windowing Windowing is achieved by the SPI interface. The starting point of the x- and y-address is uploadable, as well as the window size. The minimum step size in the x-direction is 8 pixels (only multiples of 8 can be chosen as start/stop addresses). The minimum step size in the y-direction is 1 Table 4. FRAME RATE PARAMETERS Parameter Frame Rate (fps) Frame Readout (us) Comment 640 x 480 247.5 4038 640 x 240 488.3 2048 Subsampling 256 x 256 1076 929 Windowing Analog to Digital Converter The sensor has four 10-bit pipelined ADC on board. The ADCs are nominally operating at 20 Msamples/s. The input range of the ADC is between 0.75 and 1.75V. The analog input signal is sampled at 2.1 ns delay from the rising edge of the ADC clock. The digital output data appears at the output at 5.5 cycles later. This is at the 6th falling edge succeeding the sample moment. The data is delayed by 3.7 ns with respect to this falling edge. This is illustrated in Figure 6. Table 5. ADC PARAMETERS Parameter Data rate 20 Msamples/s Input range 0.75 V − 1.75 V Quantization 10 bit DNL Typ. < 0.3 LSB INL Typ. < 0.7 LSB www.onsemi.com 5 Specification NOIL1SM0300A 50ns CLK_ADC ADC_IN D1 ADC_OUT D2 D3 D4 D5 D6 DUMMY D7 D1 D8 D2 D3 D4 5.5 clock cycles 3.7ns Figure 6. ADC Timing Programmable Gain Amplifiers Consider as an example that the device has a black level of 1.45V and a swing of 100 mV. With this swing, it fits in the input range of the ADC, but a large part of the range of the ADC is not used in this case. For this reason an offset is added first, to align the black level with the input range of the ADC. In the first step, an offset of 200 mV is added with the default settings of VBLACK and VOFFSET. This results in the red histogram with a average black level of 1.65V. This means that the spread on the black level falls completely inside the range of the ADC. In a second step, the signal is amplified to use the full range of the ADC. The programmable gain amplifiers have two functions: • Adding an offset to the signal to fit it into the range of • the ADC. This is controlled by the VBLACK and VOFFSET SPI settings. Amplifying the signal after the offset is added. Number of pixels Offset Regulation The purpose of offset regulation is to bring the signal in the input range of the ADC. After the column amplifiers, the signal from the pixels has a range from 0.1V (bright) to 1.3V (black). The input range of the ADC is from 0.75V to 1.75V. The amount of offset added is controlled by two SPI settings: VBLACK and VOFFSET. The formula to add offset is: Voutput = Vsignal + (Voffset - Vblack) Note that the FPN (fixed pattern noise) of the sensor causes a spread of about 100 mV on the dark level. To allow FPN correction during post processing of the image, this spread on the dark level needs to be covered by the input range of the ADC. This is why the default settings of the SPI are programmed to add an offset of 200 mV. This way the dark level goes from 1.3V to 1.5V and is the FPN information still converted by the ADC. To match the ADC range, it is recommended to program an offset of 340 mV. To program this offset, the Voffset and Vblack registers can be used. Figure 7 illustrates the operation of the offset regulation with an example. The blue histogram is the histogram of the image taken after the column amplifiers. 1.45V1.65V 1.75V VADC_HIGH Volts Figure 7. Offset Regulation www.onsemi.com 6 NOIL1SM0300A range of the ADC can be used. In this example, Vcal is set at 1.75V (the maximum input range of the ADC) to make sure the spread on the black level is still inside the range of the ADC after amplification. The result after amplification is the purple histogram. Number of pixels Programmable Gain The amplification inside the PGA is controlled by three SPI settings: The PGA gain selection: 16 gain steps are selectable by means of the GAIN_PGA register. Selection word 0000 corresponds with gain 1.32 and selection word 1111 corresponds with gain 15.5. Table 6 gives the 16 gain settings. The unity gain selection of the PGA is done by the UNITY_PGA setting. If this bit is high, the GAIN_PGA settings are ignored. The SEL_UNI setting is used to have more gain steps. If this bit is low, the signal is divided by two before entering the PGA. GAIN_PGA and UNITY_PGA settings are applied afterwards. If the SEL_UNI bit is high, there is a unity feed through to the PGA. This allows having a total gain range of 0.5 to 16 in 32 steps. The amplification in the PGA is done around a pivoting point, set by Vcal as illustrated in Figure 8. The VCAL setting is used to apply the Vcal voltage through an on chip DAC Table 6. GAIN SETTINGS Vcal GAIN_PGA Gain 0000 1.32 0001 1.56 0010 1.85 0011 2.18 0100 2.58 0101 3.05 0110 3.59 0111 4.22 1000 4.9 1001 5.84 1010 6.84 1011 8.02 1100 9.38 1101 11.2 1110 13.12 1111 15.38 Number of pixels 0.75V Volts Figure 8. Effect on Histogram of PGA (gain = 4) (Vcal is the green line) Figure 9 continues on the example in the section, Offset Regulation. The blue histogram is the histogram of the image after the column amplifiers. With offset regulation an offset of 200 mV is added to bring the signal in range of the ADC. The black level of 1.45V is shifted to 1.65V. The red and blue histograms have a swing of 100 mV. This means the input range of the ADC is not completely used. By amplifying the signal with a factor 10 by the PGA, the full 1.45V1.65V 1.75V Vcal Volts Figure 9. Example of PGA Operation www.onsemi.com 7 NOIL1SM0300A Operation and Signaling On chip, the ground lines of every module are kept separate to improve shielding and electrical cross-talk between them. An overview of the supplies is given in Table 7 and Table 8. Table 8 summarizes the supplies realted to the pixel array signals, where Table 7 summarizes the supplies related with all other modules. Power Supplies Every module on chip such as column amplifiers, output stages, digital modules, and drivers has its own power supply and ground. Off chip the grounds can be combined, but not all power supplies may be combined. This results in several different power supplies, but this is required to reduce electrical cross-talk and to improve shielding, dynamic range, and output swing. Table 7. FRAME RATE PARAMETERS Name DC Current Peak Current Typ Max Description VDDA 15.7 mA 50 mA 2.5 V 5% VDDD 6.7 mA 50 mA 2.5 V 2.5 V Power supply digital modules VADC 32.7 mA 100 mA 2.5 V 5% Power supply of ADC circuitry VDDO 3.5 mA 100 mA 2.5 V 5% Power supply output drivers Power supply analog readout module Table 8. OVERVIEW OF THE POWER SUPPLIES RELATED TO PIXEL SIGNALS Name DC Current Peak Current VPIX 3 mA 100 mA Min Typ Max VRES 1 mA 10 mA VRES_DS 1 mA 10 mA 2.8 V Power supply reset dual slope drivers VRES_TS 1 mA 10 mA 2.0 V Power supply reset triple slope drivers VMEM_H 1 mA 1 mA 2.5 V 3.0 V 3.3 V 3.0 V 3.3 V GNDDRIVERS 0V Description Power supply pixel array 3.5 V 3.5 V Power supply reset drivers Power supply for memory element in pixel Ground of the pixel array drivers contribute immediately to the noise on the signal. The voltage supplies VPIX, VDDA and VADC are especially important to be noise free. The maximum currents mentioned in Table 7 and Table 8 are peak currents. All power supplies should be able to deliver these currents except for Vmem_l, which must be able to sink this current. Note that no power supply filtering on chip is implemented and that noise on these power supplies can www.onsemi.com 8 NOIL1SM0300A the column amplifiers with respect to power dissipation, several biasing resistors are required. This optimization results in an increase of signal swing and dynamic range. Biasing Table 9 summarizes the biasing signals required to drive this image sensor. For optimization reasons of the biasing of Table 9. OVERVIEW OF BIAS SIGNALS Signal[1] Comment Related Module DC−Level ADC 693 mV Pixel array precharge 567 mV PGA 650 mV ADC_BIAS Connect with 10 kW to VADC and decouple with 100n to GNDADC PRECHARGE_BIAS Connect with 68 kW to VPIX and decouple with 100 nF to GNDDRIVERS BIAS_PGA Biasing of amplifier stage. Connect with 110 kW to VDDA and decouple with 100 nF to GNDA BIAS_FAST Biasing of columns. Connect with 42 kW to VDDA and decouple with 100 nF to GNDA Column amplifiers 750 mV BIAS_SLOW Biasing of columns. Connect with 1.5 MW to VDDA and decouple with 100 nF to GNDA Column amplifiers 450 mV BIAS_COL Biasing of imager core. Connect with 500 kW to VDDA and decouple with 100 nF to GNDA Column amplifiers 508 mV 1. Each biasing signal determines the operation of a corresponding module in the sense that it controls speed and dissipation. Digital Signals Depending on the operation mode (master or slave), the pixel array of the image sensor requires different digital control signals. The function of each of the signals is shown in Table 10. Table 10. OVERVIEW OF BIAS SIGNALS Signal I/O Comments LINE_VALID Digital output Indicates when valid data is at the outputs. Active high FRAME_VALID Digital output Indicates when a valid frame is readout. Active high INT_TIME_3 Digital I/O In master mode: Output to indicate the triple slope integration time. In slave mode: Input to control the triple slope integration time. Active high INT_TIME_2 Digital I/O In master mode: Output to indicate the dual slope integration time. In slave mode: Input to control the dual slope integration time. Active high INT_TIME_1 Digital I/O In master mode: Output to indicate the integration time. In slave mode: Input to control integration time. Active high RESET_N Digital input Sequencer reset. Active low CLK Digital input Readout clock (80 MHz), sine or square clock SPI_ENABLE Digital input Enable of the SPI SPI_CLK Digital input Clock of the SPI. (Max. 20 MHz) SPI_DATA Digital I/O Data line of the SPI. Bidirectional pin www.onsemi.com 9 NOIL1SM0300A Global Shutter In a global shutter light integration takes place on all pixels in parallel, although subsequent readout is sequential. Figure 10 shows the integration and read out sequence for the synchronous shutter. All pixels are light sensitive at the same period of time. The whole pixel core is reset simultaneously and after the integration time all pixel values are sampled together on the storage node inside each pixel. The pixel core is read out line by line after integration. Note that the integration and read out cycle can occur in parallel or in sequential mode. COMMON SAMPLE&HOLD Flash could occur here COMMON RESET Line number Time axis Integration time Burst Readout time Figure 10. Synchronous Shutter Operation Non Destructive Readout (NDR) time Figure 11. Principle of Non Destructive Readout [1] samples. Essentially an active pixel array is read multiple times, and reset only once. The external system intelligence takes care of the interpretation of the data. Table 11 summarizes the advantages and disadvantages of non destructive readout. The sensor can also be read out in a non destructive way. After a pixel is initially reset, it can be read multiple times, without resetting. The initial reset level and all intermediate signals can be recorded. High light levels saturate the pixels quickly, but a useful signal is obtained from the early samples. For low light levels, one has to use the later or latest NOTE: This mode can be activated by setting the NDR SPI register. The NDR SPI register must only be changed during FOT. The NDR bit should be set high during the first Frame Overhead Time after the pixel array is reset; the NDR bit must be set low during the last Frame Overhead Time before the pixel array is being reset. www.onsemi.com 10 NOIL1SM0300A Table 11. ADVANTAGES AND DISADVANTAGES OF NON DESTRUCTIVE READOUT Advantages Disadvantages Low noise because it is a true CDS. System memory required to record the reset level and the intermediate samples. High sensitivity because the conversion capacitance is kept rather low. Requires multiples readings of each pixel, thus higher data throughput. High dynamic range because the results includes signal for short and long integrations times. Requires system level digital calculations. Sequencer The sequencer generates the complete internal timing of the pixel array and the readout. The timing can be controlled by the user through the SPI register settings. The sequencer operates on the same clock as the ADCs. This is a division by 4 of the input clock. Table 12 shows a list of the internal registers with a short description. In the next section, the registers are explained in more detail. Table 12. INTERNAL REGISTERS Address 0 (0000) Bits Name Description 10:0 SEQUENCER Default : 00000101001 1 mastermode 1: master mode; 0: slave mode 1 ss 1: ss in y; 0: no subsampling 2 gran clock granularity 1 enable_analog_out 1: enabled; 0: disabled 1 calib_line 1: line calibration; 0 frame calibration 1 res2_en 1: enable DS; 0: Disable DS 1 res3_en 1: enable TS; 0: Disable TS 1 reverse_x 1: readout in reverse x direction 0: readout in normal x direction 1 reverse_y 1: readout in reverse y direction 0: readout in normal y direction 1 Ndr 1: enable non destructive readout 0: disable non destructive readout 1 (0001) 7:0 START_X Start pointer X readout Default : 00000000 2 (0010) 8:0 START_Y Start pointer Y readout Default : 000000000 3 (0011) 7:0 NB_PIX Number of kernels to read out (4 pixel kernel) Default : 10100000 4 (0100) 11:0 RES1_LENGTH Length of reset pulse (in number of lines) Default : 000000000010 5 (0101) 11:0 RES2_TIMER Position of reset DS pulse in number of lines Default : 000000000000 6 (0110) 11:0 RES3_TIMER Position of reset TS pulse in number of lines Default : 000000000000 7(0111) 11:0 FT_TIMER Position of frame transfer in number of lines Default : 000111100001 8 (1000) 7:0 VCAL DAC input for vcal Default : 01001010 www.onsemi.com 11 NOIL1SM0300A Table 12. INTERNAL REGISTERS Address Bits Name Description 9 (1001) 7:0 VBLACK DAC input for vblack Default : 01101011 10 (1010) 7:0 VOFFSET DAC input for voffset Default : 01010101 11 (1011) 11:0 ANA_IN_ADC Activate analog ADC input Default : 000011110000 4 sel_test_path Selection of analog test path 4 sel_path Selection of normal analog path 4 bypass_mux Bypass of digital 4 to 1 mux 11:0 PGA_SETTING PGA settings Default : 111110110000 4 gain_pga Gain settings PGA 1 unity_pga PGA unity amplification 1 sel_uni Preamplification of 0.5 (0: enabled) 1 enable_analog_in Activate analog input 4 enable_adc Put separate ADCs in standby 1 sel_calib_fast Select fast calibration of PGA 13 (1101) 11:0 CALIB_ADC 14 (1110) 11:0 CALIB_ADC 15 (1111) 8:0 CALIB_ADC Calibration word of the ADCs Default: calib_adc:101011011111 calib_adc:011011011011 calib_adc:000011011011 12 (1100) Detailed Description of the Internal Registers The registers should only be changed during FOT (when frame valid is low). These registers should only be changed during RESET_N is low: • Mastermode register • Granularity register • Read one, skip one: Y0Y0Y0Y0… By default, the subsampling mode is disabled. Clock granularity (2 bits) The system clock (80 MHz) is divided several times on chip. The clock, that drives the ”snapshot” or synchronous shutter sequencer, can be programmed using the granularity register. The value of this register depends on the speed of your system clock. 11: > 80 MHz 10: 40-80 MHz (default) 01: 20-40 MHz 00: < 20 MHz Enable analog out (1 bit) This bit enables/disables the analog output amplifier. 1: enabled 0: disabled (default) Calib_line (1bit) This bit sets the calibration method of the PGA. Different calibration modes can be set, at the beginning of the frame and for every subsequent line that is read. 1: Calibration is done every line (default) 0: Calibration is done every frame (less row fixed pattern noise) Sequencer Register The sequencer register is an 11 bit wide register that controls all of the sequencer settings. It contains several ”sub-registers”. Mastermode (1 bit) This bit controls the selection of mastermode/slavemode. The sequencer can operate in two modes: master mode and slave mode. In master mode all the internal timing is controlled by the sequencer, based on the SPI settings. In slave mode the integration timing is directly controlled over three pins, the readout timing is still controlled by the sequencer. 1: Master mode (default) 0: Slave mode Subsampling (1bit) This bit enables/disables the subsampling mode. Subsampling is only possible in Y direction and follows this pattern: www.onsemi.com 12 NOIL1SM0300A Res1_length Res2_enable (1bit) This bit enables/disables the dual slope mode of the device. 1: Dual slope is enabled (configured according to the RES2_TIMER register) 0: Dual slope is disabled (RES2_timer register is ignored) - default Res3_enable (1bit) This bit enables/disables the triple slope mode of the device. 1: triple slope is enabled (configured according to the RES3_TIMER register) 0: triple slope is disabled (RES3_timer register is ignored) - default Reverse_X (1bit) The readout direction in X can be reversed by setting this bit through the SPI. 1: Read direction is reversed (from right to left) 0: normal read direction (from left to right) - default Reverse_Y (1bit) The readout direction in Y can be reversed by setting this bit through the SPI. 1: Read direction is reversed (from bottom to top) 0: normal read direction (from top to bottom) - default Ndr (1 bit) This bit enables the non destructive readout mode if desired. 1: ndr enables 0: ndr disables (default) This register sets the length of the reset pulse (how long it remains high). This length is expressed as a number of lines (res1_length - 1). The minimum and default value of this register is 2. The actual time the reset is high is calculated with the following formula: Reset high = (Res1_length-1) * (ROT + Nr. Pixels * clock period) Res2_timer This register defines the position of the additional reset pulse to enable the dual slope capability. This is also defined as a number of lines-1. The actual time on which the additional reset is given is calculated with the following formula: DS high = (Res2_timer-1) * (ROT + Nr. Pixels * clock period) Res3_timer This register defines the position of the additional reset pulse to enable the triple slope capability. This is also defined as a number of lines - 1. The actual time on which the additional reset is given is calculated with the following formula: TS high = (Res3_timer-1) * (ROT + Nr. Pixels * clock period) Ft_timer This register sets the position of the frame transfer to the storage node in the pixel. This means that it also defines the end of the integration time. It is also expressed as a the number of lines - 1. The actual time on which the frame transfer takes place is calculated with the following formula: FT time = (ft_timer-1) * (ROT + Nr. Pixels * clock period) Start_X Register This register sets the start position of the readout in X direction. In this direction, there are 80 (from 0 to 79) possible start positions (8 pixels are addressed at the same time in one clock cycle). Remember that if you put Start_X to 0, pixel 0 is being read out. Example: If you set 23 in the Start_X register readout only starts from pixel 184 (8x23). Vcal This register is the input for the on-chip DAC which generates the Vcal supply used by the PGA. When the register is ”00000000” it sets a Vcal of 2.5V. When the register is 11111111 then it sets a Vcal of 0V. This means that the minimum step you can take with the Vcal register is 9.8 mV/bit (2.5V/256bits). Start_Y Register This register sets the start position of the readout in Y direction. In this direction, there are 480 (from 0 to 479) possible start positions. This means that the start position in Y direction can be set on a line by line basis. Vblack This register is the input for the on-chip DAC which generates the Vblack supply used by the PGA. When the register is ”00000000” it sets a Vblack of 2.5V. When the register is 11111111 then it sets a Vblack of 0V. This means that the minimum step you can take with the Vblack register is 9.8 mV/bit (2.5V/256bits). Nb_pix This register sets the number of pixels to read out. The number of pixels to be read out is expressed as a number of kernels in this register (4 pixels per kernel). This means that there are 160 possible values for the register (from 1 to 160). Example: If you set 37 in the nb_pix register, 148 (37 x 4) pixels are read out. www.onsemi.com 13 NOIL1SM0300A Voffset Table 13. This register is the input for the on-chip DAC, which generates the Voffset supply used by the PGA. When the register is ”00000000” it sets a Voffset of 2.5V. When the register is 11111111 then it sets a Voffset of 0V. This means that the minimum step you can take with the Voffset register is 9.8 mV/bit (2.5V/256bits). Ana_in_ADC This register sets the different paths that can be used as the ADC input (mainly for testing and debugging). The register consists of several ”sub-registers”. Sel_test_path (4 bits) These bits select the analog test path of the ADC. 0000: No analog test path selected (default) 0001: Path of pixel 1 selected 0010: Path of pixel 2 selected Sel_path (4 bits) These bits select the analog path to the ADC. 1111: All paths selected (normal operation) - default 0000: No paths selected (enables ADC to be tested through test paths) 0001: Path of pixel 1 selected 0010: Path of pixel 2 selected Bypass_mux (4 bits) These bits enable the possibility to bypass the digital 4 to 1 multiplexer. 0000: no bypass (default) GAIN_PGA Gain 0000 1.32 0001 1.56 0010 1.85 0011 2.18 0100 2.58 0101 3.05 0110 3.59 0111 4.22 1000 4.9 1001 5.84 1010 6.84 1011 8.02 1100 9.38 1101 11.2 1110 13.12 1111 15.38 Unity_pga (1 bit) This bit sets the PGA in unity amplification. 0: No unity amplification, gain settings apply 1: Unity gain amplification, gain setting are ignored (default) Sel_uni (1 bit) This bit selects whether or not the signal gets a 0.5 amplification before the PGA. 0: amplification of 0.5 before PGA 1: Unity feed through (default) Enable_analog_in (1 bit) This bit enables/disables an analog input to the PGA. 0: analog input disabled (default) 1: analog input enabled Enable_adc (4 bits) These bits can separately enable/disable the different ADCs. 0000: No ADCs enabled 1111: All ADCs enabled (default) 0001: ADC 1 enabled 0010: ADC 2 enabled Sel_calib_fast (1 bit) Selects the fast/slow calibration of the ADC 0: slow calibration 1: fast calibration PGA_SETTING This register defines all parameters to set the PGA. The register consists of different ”sub-registers” Gain_pga (4 bits) These bits set the gain of the PGA. The following Table 13 gives an overview of the different gain settings. www.onsemi.com 14 NOIL1SM0300A 2ADC Calibration Word Data Interface (SPI) The calibration word for the ADCs is distributed over three registers (13, 14 and 15). These registers all have their default value and changing this value is not recommended. The default register values are: calib_adc: 101011011111 calib_adc: 011011011011 calib_adc: 000011011011 The serial-3-wire interface (or Serial-to-Parallel Interface) uses a serial input to shift the data in the register buffer. When the complete data word is shifted into the register buffer the data word is loaded into the internal register where it is decoded. Figure 12. SPI Schematic The timing of the SPI register is explained in the timing diagram below Upload 20 MHz SPI_CLK SPI_IN b b b b b b bb MSB----------------Address bits-------------LSB bbbbb bbb dummy b b b MSB--------------------------------------------------------------------------------------Data bits-------------------------------------------------------------------------------LSB PI_ENABLE Figure 13. Timing of the SPI SPI_CLK is 20 MHz or lower. The SPI bits have a default value that allows the sensor to be read out at full resolution without uploading the SPI bits. SPI_IN (15:12): Address bits SPI_IN (11:0): Data bits When SPI_ENABLE is asserted the parallel data is loaded into the internal registers of the LUPA300. The frequency of www.onsemi.com 15 NOIL1SM0300A TIMING AND READOUT OF THE IMAGE SENSOR the pixel value is put on the column lines. Then the pixels are selected in groups of 4. So in total 160 kernels of 4 pixels are read out. The internal timing is generated by the sequencer. The sequencer can operate in 2 modes: master mode and slave mode. In master mode all the internal timing is controlled by the sequencer, based on the SPI settings. In slave mode the integration timing is directly controlled over three pins, the readout timing is still controlled by the sequencer. The selection between master and slave mode is done by the MASTERMODE register of the SPI. The sequencer is clocked on the core clock; this is the same clock as the ADCs. The core clock is the input clock divided by 4. The timing of the sensor consists of two parts. The first part is related with the integration time and the control of the pixel. The second part is related to the readout of the image sensor. Integration and readout can be in parallel. In this case, the integration time of frame I is ongoing during readout of frame I-1. Figure 14 shows this parallel timing structure. The readout of every frame starts with a Frame Overhead Time (FOT) during which the analog value on the pixel diode is transferred to the pixel memory element. After this FOT, the sensor is read out line per line. The readout of every line starts with a Row Overhead Time (ROT) during which Integration frame I+1 Integration frame I+2 Readout frame I Readout frame I+1 Readout Lines FOT L1 L2 ... L480 ROT K1 K2 ... K160 Readout Pixels Figure 14. Global Readout Timing Integration Timing in Mastermode RES2_TIMER : The number of lines read out (minus 1) after which the dual slope reset pulse is given. The length of the pulse is given by the formula: 4*(12*(GRAN+1)+1) (in clock cycles). RES3_TIMER < 11:0>: The number of lines read out (minus 1) after which the triple slope reset pulse is given. The length of the pulse is given by the formula: 4*(12*(GRAN+1)+1) (in clock cycles). FT_TIMER : The number of lines read out (minus 1) after which the Frame Transfer (FT) and the FOT starts. The length of the pulse is given by the formula: 4*(12*(GRAN+1)+1) (in clock cycles). In mastermode the integration time, the dual slope (DS) integration time, and triple slope (TS) integration time are set by the SPI settings. Figure 15 shows the integration timing and the relationship with the SPI registers. The timing concerning integration is expressed in number of lines read out. The timing is controlled by four SPI registers which need to be uploaded with the desired number of lines. This number is then compared with the line counter that keeps track of the number of lines that is read out. RES1_LENGTH : The number of lines read out (minus 1) after which the pixel reset drops and the integration starts. www.onsemi.com 16 NOIL1SM0300A RESET_N RESET PIXEL PIXEL SAMPLE # LINES READOUT 1 FOT Res1_length Res2_timer Res3_timer 1 FT_timer Res1_length Figure 15. Integration Timing in Master Mode The length of the integration time, the DS integration time and the TS integration time are indicated by 3 output pins: INT_TIME_1, INT_TIME_2 and INT_TIME_3. These outputs are high during the actual integration time. This is from the falling edge of the corresponding reset pulse to the falling edge of the internal pixel sample. Figure 16 illustrates this. The internal pixel sample rises at the moment defined by FT_TIMER (see Figure 15) and the length of the pulse is 4*(12*(GRAN+1)+2). The line counter starts with the value 1 immediately after the rising edge of RESET_N and after the end of the FOT. This means that the four integration timing registers must be uploaded with the desired number of lines plus one. In subsampling mode, the line counter increases with steps of two. In this mode, the counter starts with the value ‘2’ immediately with the rising edge of RESET_N. This means that for correct operation, the four integration timing registers can only be uploaded with an even number of lines if subsampling is enabled. RESET_N RESET RESET DS RESET TS Frame Transfer INT_TIME1 INT_TIME2 INT_TIME3 (internal) Total Integration Time DS Integration Time TS Figure 16. INT_TIME Timing www.onsemi.com 17 Integration Time NOIL1SM0300A Figure 17 shows this principle. While the sensor is being readout the FRAME_VALID signal goes high to indicate the time needed to read out the sensor. When windowing in Y direction is desired in this mode (longer integration time than read out time) the following parameters should be set: The integration time is set by the FT_TIMER register. The actual windowing in Y is achieved when the surrounding system discards the lines which are not desired for the selected window. Readout Time Smaller Than or Equal to Integration Time In this situation the RES_LENGTH register can be uploaded with the smallest possible value, this is the value ’2’. The frame rate is determined by the integration time. The readout time is equal to the integration time, the FT_TIMER register is uploaded with a value equal to the window size to readout plus one. In case the readout time is smaller than the integration time the FT_TIMER register is uploaded with a value bigger than the window size. Total Integration Time PIXEL RESET FOT FT_TIMER FOT Readout FRAME_VALID Figure 17. Readout Time Smaller than Integration Time time. The FT_TIMER register must be set to the desired window size (in Y). Only the RES_LENGTH register needs to be changed during operation. Figure 18 shows this example. Readout Time Larger Than Integration Time In case the readout time is larger than then integration time, the RES_LENGTH register needs to be uploaded with a value larger than two to compensate for the larger readout Integration Time PIXEL RESET FOT FRAME_ VALID FT_TIMER FOT Readout Figure 18. Readout Time Larger than Integration Time activating INT_TIME_2 and INT_TIME_3 separately. At the end of the desired integration time the frame transfer starts by making all 3 INT_TIME pins active low simultaneously. There is always a small delay between the applied external signals and the actual internally generated pulses. These delays are also shown in Figure 19. In case non destructive readout is used, the pulses on the input pins still need to be given. By setting the NDR bit to “1” the internal pixel reset pulses are suppressed but the external pulses are still needed to have the correct timing of the frame transfer. Integration Timing in Slave Mode In slave mode, the registers RES_LENGTH, DS_TIMER, TS_TIMER, and FT_TIMER are ignored. The integration timing is now controlled by the pins INT_TIME_1, INT_TIME_2 and INT_TIME_3, which are now active low input pins. The relationship between the input pins and the integration timing is illustrated in Figure 19. The pixel is reset as soon as IN_TIME_1 is low (active) and INT_TIME_2 and INT_TIME_3 are high. The integration starts when INT_TIME_1 becomes high again and during this integration additional (lower) reset can be given by www.onsemi.com 18 NOIL1SM0300A RESET_N SPI Simultanious min 12 clk periods INT_TIME_1 INT_TIME_2 INT_TIME_3 RESET (internal) DS RESET (internal) TS RESET (internal) PIXEL SAMPLE (internal) FOT FOT Total Integration Time min 12 clk periods DS Integration Time TS Integration Time Figure 19. Integration Timing in Slave Mode Readout Timing LINE_VALIDs when FRAME_VALID is low, must be discarded. Figure 20 and Figure 21 illustrate this. NOTE: The FRAME_VALID signal automatically goes low after 480 LINE_VALID pulses in mastermode. The sensor is readout row by row. The LINE_VALID signal shows when valid data of a row is at the outputs. FRAME_VALID shows which LINE_VALIDs are valid. 12.5ns CLK DATA Invalid Valid ValidValid Valid Invalid Invalid LINE_VALID Figure 20. LINE_VALID Timing FRAME_VALID LINE_VALID Figure 21. FRAME_VALID Timing www.onsemi.com 19 Valid Valid NOIL1SM0300A The data at the output of the sensor is clocked on the rising edge of CLK. There is a delay of 3.2 ns between the rising edge of CLK and a change in DATA. After this delay DATA needs 6 ns to become stable within 10% of VDDD. This means that DATA is stable for a time equal to the clock period minus 6 ns. Figure 22 illustrates this. NOTE: In slave mode, line valids that occur beyond the desired image window should be discarded by the user’s image data acquisition system CLK INVALID DATA LINE_VALID VALID INVALID  INVALID VALID 4ns 3.2ns 3.2 + 6ns Clk period - 6ns 6ns Figure 22. DATA Valid Timing LINE_VALIDs that correspond with lines that are not inside the desired readout window. The length of the FOT and ROT is still controlled by the GRAN register as described in this data sheet. Readout Timing in Slave Mode The start pointer of the window to readout is determined by the START_X and START_Y registers (as by readout in master mode). The size of the window in x-direction is also determined by the NB_OF_PIX register. The length of the window in y-direction is determined by the externally applied integration timing. The sensor does not know the desired y-size to readout. It therefore reads out all lines starting from START_Y. The readout of lines continues until the user decides to start the FOT. Even when the line pointer wants to address non existing rows (row 481 and higher), the sequencer continues to run in normal readout mode. This means that FRAME_VALID remains high and LINE_VALID is toggled as if normal lines are readout. The controller should take care of this and ignore the LINE_VALIDs that correspond with non existing lines and Readout time longer than integration time The sensor should be timed according to the formulas and diagram here: 1. INT_TIME_1 should be brought high at time (read_t - int_t) and preferably immediately after the falling edge of LINE_VALID. 2. At time read_t all INT_TIME_x should simultaneous go low to start the FOT. This is immediately after the falling edge of the last LINE_VALID of the desired readout window. FOT Readout Reset INT_TIME1 Integration 2. At time read_t after the last valid LINE_VALID of the desired window size, all other LINE_VALIDs should be ignored. 3. After the desired integration length all INT_TIME_x should simultaneous go low to start the FOT. Readout time shorter than integration time The sensor should be timed according to the formulas and diagram here: 1. INT_TIME_1 should be brought high after a minimum 2 ms reset time and preferably immediately after the falling edge of the first LINE_VALID. FOT INT_TIME1 FOT Dummy LINE_VALIDs Readout Reset Integration www.onsemi.com 20 FOT NOIL1SM0300A Startup Timing On startup, VDDD should rise together with or before the other supplies. The rise of VDDD should be limited to 1V/100 ms to avoid activation of the on chip ESD protection circuitry. During the rise of VDDD an on chip POR_N signal is generated that resets the SPI registers to its default setting. After VDDD is stable the SPI settings can be uploaded to configure the sensor for future readout and light integration. When powering on the VDDD supply, the RESET_N pin should be kept low to reset the on chip sequencer and addressing logic. The RESET_N pin must remain low until all initial SPI settings are uploaded. RESET_N pin must remain low for at least 500 ns after ALL supplies are stable. The rising edge of RESET_N starts the on chip clock division. The second rising edge of CLK after the rising edge of RESET_N, triggers the rising edge of the core clock. Some SPI settings can be uploaded after the core clock has started. Min 500ns RESET_N POR_N (internal) System clock (external) Core clock (internal) VDDD power supply SPI upload POWER ON VDDD STABLE INVALID SPI upload INVALID SPI upload if required Figure 23. Startup Timing Sequencer Reset Timing By bringing RESET_N low for at least 50 ns, the on chip sequencer is reset to its initial state. The internal clock division is restarted. The second rising edge of CLK after the rising edge of RESET_N the internal clock is restarted. The SPI settings are not affected by RESET_N. If needed the SPI settings can be changed during a low level of RESET_N. System clock (external) Min 50 ns RESET_N Core clock (internal) Sync_Y (internal) Clock_Y (internal) INVALID Normal operation Figure 24. Sequencer Reset Timing www.onsemi.com 21 Normal operation NOIL1SM0300A PIN LIST Table 14. PINLIST Pin No. Name Type Description 1 GNDADC Ground Ground supply of the ADCs 2 DATA Output Databit 3 DATA Output Databit 4 DATA Output Databit 5 DATA Output Databit 6 DATA Output Databit (MSB) 7 GNDD Ground Digital ground supply 8 VDDD Supply Digital power supply (2.5V) 9 GNDADC Ground Ground supply of the ADCs 10 VADC Supply Power supply of the ADCs (2.5V) 11 GNDA Ground Ground supply of analog readout circuitry 12 VDDA Supply Power supply of analog readout circuitry (2.5V) 13 ADC_BIAS Biasing Biasing of ADCs. Connect with 10 kW to VADC and decouple with 100n to GND_ADC 14 BIAS4 Biasing Biasing of amplifier stage. Connect with 110 kW to VDDA and decouple with 100 nF to GNDA 15 BIAS3 Biasing Biasing of columns. Connect with 42 kW to VDDA and decouple with 100 nF to GNDA 16 BIAS2 Biasing Biasing of columns. Connect with 1.5 MW to VDDA and decouple with 100 nF to GNDA. 17 BIAS1 Biasing Biasing of imager core. Connect with 500 kW to VDDA and decouple with 100 nF to GNDA 18 VPIX Supply Power supply of pixel array (2.5V) 19 SPI_ENABLE Digital input Enable of the SPI 20 SPI_CLK Digital input Clock of the SPI. (Max. 20 MHz) 21 SPI_DATA Digital I/O Data line of the SPI. Bidirectional pin 22 VMEM_H Supply Supply of vmem_high of pixelarray (3.3V) 23 GND_DRIVERS Ground Ground of pixel array drivers 24 VRESET_1 Supply Reset supply voltage (typical 3.3V) 25 VRESET_2 Supply Dual slope reset supply voltage. Connect to other supply or ground when dual slope reset is not used 26 VRESET_3 Supply Triple slope reset supply voltage. Connect to other supply or ground when triple slope reset is not used 27 PRECHARGE_BIAS Bias Connect with 68 kW to VPIX and decouple with 100 nF to GND_DRIVERS 28 LINE_VALID Digital output Indicates when valid data is at the outputs. Active high 29 FRAME_VALID Digital output Indicates when valid frame is readout 30 INT_TIME_3 Digital I/O In master mode: Output to indicate the triple slope integration time. In slave mode: Input to control the triple slope integration time 31 INT_TIME_2 Digital I/O In master mode: Output to indicate the dual slope integration time. In slave mode: Input to control the dual slope integration time 32 INT_TIME_1 Digital I/O In master mode: Output to indicate the integration time In slave mode: Input to control integration time 33 VDDD Supply Digital power supply (2.5V) www.onsemi.com 22 NOIL1SM0300A Table 14. PINLIST Pin No. Name Type Description 34 GNDD Ground Digital ground supply 35 VDDA Supply Power supply of analog readout circuitry (2.5V) 36 GNDA Ground Ground supply of analog readout circuitry 37 RESET_N Digital input Sequencer reset, active low 38 CLK Digital input Readout clock (80 MHz), sine or square clock 39 VADC Supply Power supply of the ADCs (2.5V) 40 GNDADC Ground Ground supply of the ADCs 41 VDDO Supply Power supply of the output drivers (2.5V) 42 GNDO Ground Ground supply of the output drivers 43 DATA Output Databit (LSB) 44 DATA Output Databit 45 DATA Output Databit 46 DATA Output Databit 47 DATA Output Databit 48 VADC Supply Power supply of the ADCs (2.5V) www.onsemi.com 23 NOIL1SM0300A Mechanical Package Specification Mechanical Specifications Die (with Pin 1 to the left center) Min Typ Max Units −0.01 0.74 0.01 mm Die center, X offset to the center of the package −50 0 50 mm Die center, Y offset to the center of the package −50 0 50 mm Die position, X tilt −1 0 1 deg Die position, Y tilt −1 0 1 deg Die placement accuracy in package −50 50 mm Die rotation accuracy −1 1 deg Die thickness Optical center referenced from package center (X−dir) 6.1 mm Optical center referenced from package center (Y−dir) 7.1 mm Distance from PCB plane to top of the die surface 1.25 mm 1 mm 0.6 mm Distance from top of the die surface to top of the glass lid Glass Lid Thickness Spectral range for window 400 1000 nm Transmission of the glass lid 92 % Mechanical shock JESD22−B104C; Condition G 2000 G Vibration JESD22−B103B; Condition 1 2000 Hz Mounting Profile Lead−free Infra−Red (IR) profile for LCC package if no socket is used 20 www.onsemi.com 24 NOIL1SM0300A Glass Lid The LUPA300 image sensor uses a glass lid without any coatings. Figure 26 shows the transmission characteristics of the glass lid. As shown in Figure 26, no infrared attenuating filter glass is used. (source: http://www.pgo−online.com). Figure 25. Transmission Characteristics of the Glass Lid ADDITIONAL REFERENCES AND RESOURCES Application Notes and other resources can be found linked to the product web page at www.onsemi.com. Additional information on this device may also be available in the Image Sensor Portal, accessible within the MyON section of www.onsemi.com. A signed NDA is required to access the Image Sensor Portal – please see your onsemi sales representative for more information. For quality and reliability information, please download the Quality & Reliability Handbook (HBD851/D) from www.onsemi.com. For information on Standard terms and Conditions of Sale, please download Terms and Conditions document from www.onsemi.com. For information on Return Material Authorization procedures, please refer to the RMA Policy Procedure document from www.onsemi.com. The Product Acceptance Criteria document, which lists criteria to which this device is tested prior to shipment, is available upon request. For information on ESD and cover glass care and cleanliness, please download the Application Note Image Sensor Handling and Best Practices (AN52561/D) from www.onsemi.com. www.onsemi.com 25 NOIL1SM0300A ACRONYMS Acronym Description Acronym Description ADC analog-to-digital converter IP intellectual property AFE analog front end LE line end BL black pixel data LS line start CDM Charged Device Model LSB least significant bit CDS correlated double sampling LVDS low-voltage differential signaling CMOS complementary metal oxide semiconductor MBS mixed boundary scan CRC cyclic redundancy check MSB most significant bit DAC digital-to-analog converter PGA programmable gain amplifier DDR double data rate PLS parasitic light sensitivity DFT design for test PRBS pseudo-random binary sequence DNL differential nonlinearity PRNU pixel random nonuniformity DS Double Sampling QE quantum efficiency DSNU dark signal nonuniformity RGB red green blue EIA Electronic Industries Alliance RMA Return Material Authorization ESD electrostatic discharge RMS root mean square FE frame end ROI region of interest FF fill factor ROT row overhead time FOT frame overhead time S/H sample and hold FPGA Field Programmable Gate Array SNR signal-to-noise ratio FPN fixed pattern noise SPI serial peripheral interface FPS frames per second TBD to be determined FS frame start TIA Telecommunications Industry Association HBM Human Body Model TJ Junction Temperature IMG regular pixel data TR training pattern INL integral nonlinearity % RH Percent Relative Humidity www.onsemi.com 26 NOIL1SM0300A GLOSSARY conversion gain A constant that converts the number of electrons collected by a pixel into the voltage swing of the pixel. Conversion gain = q/C where q is the charge of an electron (1.602E 19 Coulomb) and C is the capacitance of the photodiode or sense node. CDS Correlated double sampling. This is a method for sampling a pixel where the pixel voltage after reset is sampled and subtracted from the voltage after exposure to light. DNL Differential nonlinearity (for ADCs) DSNU Dark signal nonuniformity. This parameter characterizes the degree of nonuniformity in dark leakage currents, which can be a major source of fixed pattern noise. fill-factor A parameter that characterizes the optically active percentage of a pixel. In theory, it is the ratio of the actual QE of a pixel divided by the QE of a photodiode of equal area. In practice, it is never measured. INL Integral nonlinearity (for ADCs) IR Infrared. IR light has wavelengths in the approximate range 750 nm to 1 mm. Lux Photometric unit of luminance (at 550 nm, 1lux = 1 lumen/m2 = 1/683 W/m2) pixel noise Variation of pixel signals within a region of interest (ROI). The ROI typically is a rectangular portion of the pixel array and may be limited to a single color plane. photometric units Units for light measurement that take into account human physiology. PLS Parasitic light sensitivity. Parasitic discharge of sampled information in pixels that have storage nodes. PRNU Photo-response nonuniformity. This parameter characterizes the spread in response of pixels, which is a source of FPN under illumination. QE Quantum efficiency. This parameter characterizes the effectiveness of a pixel in capturing photons and converting them into electrons. It is photon wavelength and pixel color dependent. read noise Noise associated with all circuitry that measures and converts the voltage on a sense node or photodiode into an output signal. reset The process by which a pixel photodiode or sense node is cleared of electrons. ”Soft” reset occurs when the reset transistor is operated below the threshold. ”Hard” reset occurs when the reset transistor is operated above threshold. reset noise Noise due to variation in the reset level of a pixel. In 3T pixel designs, this noise has a component (in units of volts) proportionality constant depending on how the pixel is reset (such as hard and soft). In 4T pixel designs, reset noise can be removed with CDS. responsivity The standard measure of photodiode performance (regardless of whether it is in an imager or not). Units are typically A/W and are dependent on the incident light wavelength. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. ROI Region of interest. The area within a pixel array chosen to characterize noise, signal, crosstalk, and so on. The ROI can be the entire array or a small subsection; it can be confined to a single color plane. sense node In 4T pixel designs, a capacitor used to convert charge into voltage. In 3T pixel designs it is the photodiode itself. sensitivity A measure of pixel performance that characterizes the rise of the photodiode or sense node signal in Volts upon illumination with light. Units are typically V/(W/m2)/sec and are dependent on the incident light wavelength. Sensitivity measurements are often taken with 550 nm incident light. At this wavelength, 1 683 lux is equal to 1 W/m2; the units of sensitivity are quoted in V/lux/sec. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. spectral response The photon wavelength dependence of sensitivity or responsivity. SNR Signal-to-noise ratio. This number characterizes the ratio of the fundamental signal to the noise spectrum up to half the Nyquist frequency. temporal noise Noise that varies from frame to frame. In a video stream, temporal noise is visible as twinkling pixels. www.onsemi.com 27 NOIL1SM0300A APPENDIX A: FREQUENTLY ASKED QUESTIONS Q: How does the dual (multiple) slope extended dynamic range mode work? analog signal of the pixels below this level to the reset level. After the reset the analog signal starts to decrease with the same slope as before the double slope reset pulse. If the double slope reset pulse is placed at the end of the integration time (90% for instance) the analog signal that reach the saturation levels are not saturated anymore (this increases the optical dynamic range) at read out. It is important to note that pixel signals above the double slope reset level are not influenced by this double slope reset pulse (p1 and p2). If desired, additional reset pulses can be given at lower levels to achieve multiple slope. A: The green lines are the analog signal on the photodiode, which decrease as a result of exposure. The slope is determined by the amount of light at each pixel (the more light the steeper the slope). When the pixels reach the saturation level the analog signal does not change despite further exposure. As shown, without any double slope pulse pixels p3 and p4 reaches saturation before the sample moment of the analog values; no signal is acquired without double slope. When double slope is enabled a second reset pulse is given (blue line) at a certain time before the end of the integration time. This double slope reset pulse resets the Reset pulse Double slope reset pulse Read out Reset level 1 p1 Reset level 2 p2 p3 p4 Saturation level Double slope reset time (usually 510% of the total integration time) Total integration time Figure 26. Dual Slope Diagram www.onsemi.com 28 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LCC48, 14.22x14.22 CASE 115AN ISSUE O DATE 19 JUL 2011 GENERIC MARKING DIAGRAM XXXXX A WL YY WW NNNN DOCUMENT NUMBER: DESCRIPTION: 98AON56509E LCC48, 14.22x14.22 = Specific Device Code = Assembly Location = Wafer Lot = Year = Work Week = Serial Number Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. 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