NOIV1SN1300A-QDC

ON Semiconductor Is Now To learn more about onsemi™, please visit our website at www.onsemi.com onsemi and       and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NOIV1SN1300A, NOIV2SN1300A VITA 1300 1.3 Megapixel 150 FPS Global Shutter CMOS Image Sensor www.onsemi.com Features • • • • • • • • • • • • • • • • • • • • • • SXGA: 1280 x 1024 Active Pixels 4.8 mm x 4.8 mm Pixel Size 1/2 inch Optical Format Monochrome (SN) or Color (SE) 150 Frames per Second (fps) at Full Resolution (LVDS) 37 Frames per Second (fps) at Full Resolution (CMOS) On-chip 10-bit Analog-to-Digital Converter (ADC) 8-bit or 10-bit Output Mode Four LVDS Serial Outputs or Parallel CMOS Output Random Programmable Region of Interest (ROI) Readout Pipelined and Triggered Global Shutter, Rolling Shutter On-chip Fixed Pattern Noise (FPN) Correction Serial Peripheral Interface (SPI) Automatic Exposure Control (AEC) Phase Locked Loop (PLL) High Dynamic Range (HDR) Dual Power Supply (3.3 V and 1.8 V) −40°C to +85°C Operational Temperature Range 48-pin LCC and Bare Die 475 mW Power Dissipation (LVDS) 290 mW Power Dissipation (CMOS) These Devices are Pb−Free and are RoHS Compliant Figure 1. VITA 1300 Photograph Applications • • • • Machine Vision Motion Monitoring Security Barcode Scanning (2D) Description The VITA 1300 is a 1/2 inch Super-eXtended Graphics Array (SXGA) CMOS image sensor with a pixel array of 1280 by 1024. The high sensitivity 4.8 mm x 4.8 mm pixels support pipelined and triggered global shutter readout modes and can also be operated in a low noise rolling shutter mode. In rolling shutter mode, the sensor supports correlated double sampling readout, reducing noise and increasing the dynamic range. The sensor has on-chip programmable gain amplifiers and 10-bit A/D converters. The integration time and gain parameters can be reconfigured without any visible image artifact. Optionally the on-chip automatic exposure control loop (AEC) controls these parameters dynamically. The image’s black level is either calibrated automatically or can be adjusted by adding a user programmable offset. A high level of programmability using a four wire serial peripheral interface enables the user to read out specific regions of interest. Up to 8 regions can be programmed, achieving even higher frame rates. The image data interface of the V1-SN/SE part consists of four LVDS lanes, facilitating frame rates up to 150 frames per second. Each channel runs at 620 Mbps. A separate synchronization channel containing payload information is provided to facilitate the image reconstruction at the receive end. The V2-SN/SE part provides a parallel CMOS output interface at reduced frame rate. The VITA 1300 is packaged in a 48-pin LCC package and is available in a monochrome and color version. Contact your local ON Semiconductor office for more information. © Semiconductor Components Industries, LLC, 2014 December, 2016 − Rev. 10 1 Publication Order Number: NOIV1SN1300A/D NOIV1SN1300A, NOIV2SN1300A ORDERING INFORMATION Part Number Mono/Color NOIV1SN1300A-QDC LVDS Interface mono NOIV1SE1300A-QDC LVDS Interface color NOIV2SN1300A-QDC CMOS Interface mono NOIV2SE1300A-QDC CMOS Interface color NOIV1SN1300A-XXC Die sales, mono Package 48−pin LCC Die Sales The V1-SN/SE base part is used to reference the mono and color versions of the LVDS interface; the V2-SN/SE base part is used to reference the mono and color versions of the CMOS interface. ORDERING CODE DEFINITION PACKAGE MARK Following is the mark on the bottom side of the package with Pin 1 to the left center Line 1: NOI xxxx 1300A where xxxx denotes LVDS (V1) / CMOS (V2), mono micro lens (SN) /color micro lens (SE) option Line 2: -QDC Line 3: AWLYYWW www.onsemi.com 2 NOIV1SN1300A, NOIV2SN1300A CONTENTS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering Code Definition . . . . . . . . . . . . . . . . . . . . . . 2 Package Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Sensor Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Image Sensor Timing and Readout . . . . . . . . . . . . . . Additional Features . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Output Format . . . . . . . . . . . . . . . . . . . . . . . . . . Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . Specifications and Useful References . . . . . . . . . . . . . Silicon Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . www.onsemi.com 3 15 30 33 41 50 66 72 73 74 75 NOIV1SN1300A, NOIV2SN1300A SPECIFICATIONS Key Specifications Table 2. ELECTRO−OPTICAL SPECIFICATIONS Table 1. GENERAL SPECIFICATIONS Parameter Specification Parameter Specification Pixel type Global shutter pixel architecture Active pixels 1280 (H) x 1024 (V) Shutter type Pipelined and triggered global shutter, rolling shutter Pixel size 4.8 mm x 4.8 mm Frame rate at full resolution V1-SN/SE: 150 fps V2-SN/SE: 37 fps Optical format 1/2 inch Conversion gain Master clock V1-SN/SE: 62 MHz when PLL is used, 310 MHz (10-bit) / 248 MHz (8-bit) when PLL is not used V2-SN/SE: 62 MHz 0.072 LSB10/e90 mV/e- Dark noise 2.2 LSB10, 30e- in global shutter 0.9 LSB10, 14e-in rolling shutter Responsivity at 550 nm 24 LSB10 /nJ/cm2, 4.6 V/lux.s Parasitic Light Sensitivity (PLS) 10us > 10us > 10us > 10us > 10us Figure 12. Power Up Sequence Table 6. ENABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 1 Upload # Address Data Description V1-SN/SE 8-bit mode with PLL 1 2 0x0000 Monochrome sensor 0x0001 Color sensor 2 32 0x200C Configure clock management 3 20 0x0000 Configure clock management 4 17 0X210F Configure PLL 5 26 0x1180 Configure PLL lock detector 6 27 0xCCBC Configure PLL lock detector 7 8 0x0000 Release PLL soft reset 8 16 0x0003 Enable PLL 0x0000 Monochrome sensor V1-SN/SE 8-bit mode without PLL 1 2 0x0001 Color sensor 2 32 0x2008 Configure clock management 3 20 0x0001 Enable LVDS clock input www.onsemi.com 17 NOIV1SN1300A, NOIV2SN1300A Table 6. ENABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 1 Upload # Address Data Description V1-SN/SE 10-bit mode with PLL 1 2 0x0000 Monochrome sensor 0x0001 Color sensor 2 32 0x2004 Configure clock management 3 20 0x0000 Configure clock management 4 17 0x2113 Configure PLL 5 26 0x2280 Configure PLL lock detector 6 27 0x3D2D Configure PLL lock detector 7 8 0x0000 Release PLL soft reset 8 16 0x0003 Enable PLL 0x0000 Monochrome sensor 0x0001 Color sensor V1-SN/SE 10-bit mode without PLL 1 2 2 32 0x2000 Configure clock management 3 20 0x0001 Enable LVDS clock input 1 2 0x0002 Monochrome sensor parallel mode selection 0x0003 Color sensor parallel mode selection 2 32 0x200C Configure clock management 3 20 0x0000 Configure clock management 4 16 0x0007 Configure PLL bypass mode V2-SN/SE 10-bit mode The required uploads are listed in Table 4. Note that it is important to follow the upload sequence listed in Table 7. Enable Clock Management - Part 2 The next step to configure the clock management consists of SPI uploads which enables all internal clock distribution. Table 7. ENABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 2 Upload # Address Data Description V1-SN/SE 8-bit mode with PLL 1 9 0x0000 Release clock generator soft reset 2 32 0x200E Enable logic clock 3 34 0x0001 Enable logic blocks V1-SN/SE 8-bit mode without PLL 1 9 0x0000 Release clock generator soft reset 2 32 0x200A Enable logic clock 3 34 0x0001 Enable logic blocks V1-SN/SE 10-bit mode with PLL 1 9 0x0000 Release clock generator soft reset 2 32 0x2006 Enable logic clock 3 34 0x0001 Enable logic blocks V1-SN/SE 10-bit mode without PLL 1 9 0x0000 Release clock generator soft reset 2 32 0x2002 Enable logic clock www.onsemi.com 18 NOIV1SN1300A, NOIV2SN1300A Table 7. ENABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 2 Upload # Address Data Description 3 34 0x0001 Enable logic blocks 1 9 0x0000 Release clock generator soft reset 2 32 0x200E Enable logic clock 3 34 0x0001 Enable logic blocks V2-SN/SE 10-bit mode and may cause the sensor to malfunction. The required uploads are listed in Table 8. Required Register Upload In this phase, the ‘reserved’ register settings are uploaded through the SPI register. Different settings are not allowed Table 8. REQUIRED REGISTER UPLOAD Upload # Address Data Description 1 41 0x085A 2 129[13] 0x0 10-bit mode 0x1 8-bit mode Configure image core 3 65 0x288B Configure CP biasing 4 66 0x53C5 Configure AFE biasing 5 67 0x0344 Configure MUX biasing 6 68 0x0085 Configure LVDS biasing 7 70 0x4800 Configure AFE biasing 8 128 0x4710 Configure black calibration 9 197 0x0103 Configure black calibration 10 176 0x00F5 Configure AEC 11 180 0x00FD Configure AEC 12 181 0x0144 Configure AEC 13 387 0x549F Configure sequencer 14 388 0x549F Configure sequencer 15 389 0x5091 Configure sequencer 16 390 0x1011 Configure sequencer 17 391 0x111F Configure sequencer 18 392 0x1110 Configure sequencer 19 431 0x0356 Configure sequencer 20 432 0x0141 Configure sequencer 21 433 0x214F Configure sequencer 22 434 0x214A Configure sequencer 23 435 0x2101 Configure sequencer 24 436 0x0101 Configure sequencer 25 437 0x0B85 Configure sequencer 26 438 0x0381 Configure sequencer 27 439 0x0181 Configure sequencer 28 440 0x218F Configure sequencer 29 441 0x218A Configure sequencer 30 442 0x2101 Configure sequencer www.onsemi.com 19 NOIV1SN1300A, NOIV2SN1300A Table 8. REQUIRED REGISTER UPLOAD Upload # Address Data Description 31 443 0x0100 Configure sequencer 32 447 0x0B55 Configure sequencer 33 448 0x0351 Configure sequencer 34 449 0x0141 Configure sequencer 35 450 0x214F Configure sequencer 36 451 0x214A Configure sequencer 37 452 0x2101 Configure sequencer 38 453 0x0101 Configure sequencer 39 454 0x0B85 Configure sequencer 40 455 0x0381 Configure sequencer 41 456 0x0181 Configure sequencer 42 457 0x218F Configure sequencer 43 458 0x218A Configure sequencer 44 459 0x2101 Configure sequencer 45 460 0x0100 Configure sequencer 46 469 0x2184 Configure sequencer 47 472 0x1347 Configure sequencer 48 476 0x2144 Configure sequencer 49 480 0x8D04 Configure sequencer 50 481 0x8501 Configure sequencer 51 484 0xCD04 Configure sequencer 52 485 0xC501 Configure sequencer 53 489 0x0BE2 Configure sequencer 54 493 0x2184 Configure sequencer 55 496 0x1347 Configure sequencer 56 500 0x2144 Configure sequencer 57 504 0x8D04 Configure sequencer 58 505 0x8501 Configure sequencer 59 508 0xCD04 Configure sequencer 60 509 0xC501 Configure sequencer stream. This action exists of a set of SPI uploads. The soft power up uploads are listed in Table 9. Soft Power Up During the soft power up action, the internal blocks are enabled and prepared to start processing the image data Table 9. SOFT POWER UP REGISTER UPLOADS FOR MODE DEPENDENT REGISTERS Upload # Address Data Description V1-SN/SE 8-bit mode with PLL 1 32 0x200F Enable analog clock distribution 2 10 0x0000 Release soft reset state 3 64 0x0001 Enable biasing block 4 72 0x0203 Enable charge pump 5 40 0x0003 Enable column multiplexer www.onsemi.com 20 NOIV1SN1300A, NOIV2SN1300A Table 9. SOFT POWER UP REGISTER UPLOADS FOR MODE DEPENDENT REGISTERS Upload # Address Data Description 6 48 0x0001 Enable AFE 7 112 0x0007 Enable LVDS transmitters V1-SN/SE 8-bit mode without PLL 1 32 0x200B Enable analog clock distribution 2 10 0x0000 Release soft reset state 3 64 0x0001 Enable biasing block 4 72 0x0203 Enable charge pump 5 40 0x0003 Enable column multiplexer 6 48 0x0001 Enable AFE 7 112 0x0007 Enable LVDS transmitters V1-SN/SE 10-bit mode with PLL 1 32 0x2007 Enable analog clock distribution 2 10 0x0000 Release soft reset state 3 64 0x0001 Enable biasing block 4 72 0x0203 Enable charge pump 5 40 0x0003 Enable column multiplexer 6 48 0x0001 Enable AFE 7 112 0x0007 Enable LVDS transmitters V1-SN/SE 10-bit mode without PLL 1 32 0x2003 Enable analog clock distribution 2 10 0x0000 Release soft reset state 3 64 0x0001 Enable biasing block 4 72 0x0203 Enable charge pump 5 40 0x0003 Enable column multiplexer 6 48 0x0001 Enable AFE 7 112 0x0007 Enable LVDS transmitters 1 32 0x200F Enable analog clock distribution 2 10 0x0000 Release soft reset state 3 64 0x0001 Enable biasing block 4 72 0x0203 Enable charge pump 5 40 0x0003 Enable column multiplexer 6 48 0x0001 Enable AFE 7 112 0x0000 Configure I/O V2-SN/SE 10-bit mode The ‘Enable Sequencer’ action consists of a set of register uploads. The required uploads are listed in Table 10. Enable Sequencer During the ‘Enable Sequencer’ action, the frame grabbing sequencer is enabled. The sensor starts grabbing images in the configured operation mode. Refer to Sensor States on page 15. www.onsemi.com 21 NOIV1SN1300A, NOIV2SN1300A Table 10. ENABLE SEQUENCER REGISTER UPLOAD Upload # Address Data Description 1 192[0] 0x1 Enable sequencer. Note that this address contains other configuration bits to select the operation mode. User Actions: Functional Modes to Power Down Sequences Disable Sequencer During the ‘Disable Sequencer’ action, the frame grabbing sequencer is stopped. The sensor stops grabbing images and returns to the idle mode. The ’Disable Sequencer’ action consists of a set of register uploads. as listed in Table 11. Refer to Silicon Errata on page 73 for standby power considerations. Table 11. DISABLE SEQUENCER REGISTER UPLOAD Upload # Address Data Description 1 192[0] 0x0 Disable sequencer. Note that this address contains other configuration bits to select the operation mode. current dissipation. This action exists of a set of SPI uploads. The soft power down uploads are listed in Table 12. Soft Power Down During the soft power down action, the internal blocks are disabled and the sensor is put in standby state to reduce the Table 12. SOFT POWER DOWN REGISTER UPLOAD Upload # Address Data Description 1 112 0x0000 Disable LVDS transmitters 2 48 0x0000 Disable AFE 3 40 0x0000 Disable column multiplexer 4 72 0x0200 Disable charge pump 5 64 0x0000 Disable biasing block 6 10 0x0999 Soft reset This action can be implemented with the SPI uploads as shown in Table 13. Disable Clock Management - Part 2 The ‘Disable Clock Management’ action stops the internal clocking to further decrease the power dissipation. Table 13. DISABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 2 Upload # Address Data Description V1-SN/SE 8-bit mode with PLL 1 34 0x0000 Disable logic blocks 2 32 0x200C Disable logic clock 3 9 0x0009 Soft reset clock generator V1-SN/SE 8-bit mode without PLL 1 34 0x0000 Disable logic blocks 2 32 0x2008 Disable logic clock 3 9 0x0009 Soft reset clock generator 0x0000 Disable logic blocks V1-SN/SE 10-bit mode with PLL 1 34 www.onsemi.com 22 NOIV1SN1300A, NOIV2SN1300A Table 13. DISABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 2 Upload # Address Data Description 2 32 0x2004 Disable logic clock 3 9 0x0009 Soft reset clock generator V1-SN/SE 10-bit mode without PLL 1 34 0x0000 Disable logic blocks 2 32 0x2000 Disable logic clock 3 9 0x0009 Soft reset clock generator 1 34 0x0000 Disable logic blocks 2 32 0x200C Disable logic clock 3 9 0x0009 Soft reset clock generator V2-SN/SE 10-bit mode This action can be implemented with the SPI uploads as shown in Table 14. Disable Clock Management - Part 1 The ‘Disable Clock Management’ action stops the internal clocking to further decrease the power dissipation. Table 14. DISABLE CLOCK MANAGEMENT REGISTER UPLOAD − PART 1 Upload # Address Data Description 1 16 0x0000 Disable PLL 2 8 0x0099 Soft reset PLL 3 20 0x0000 Configure clock management Power Down Sequence Figure 13 illustrates the timing diagram of the preferred power down sequence. It is important that the sensor is in reset before the clock input stops running. Otherwise, the internal PLL becomes unstable and the sensor gets into an unknown state. This can cause high peak currents. The same applies for the ramp down of the power supplies. The preferred order to ramp down the supplies is first vdd_pix, second vdd_33, and finally vdd_18. Any other sequence can cause high peak currents. NOTE: The ‘clock input’ can be the CMOS PLL clock input (clk_pll), or the LVDS clock input (lvds_clock_inn/p) in case the PLL is bypassed. clock input reset_n vdd_18 vdd_33 vdd_pix > 10us > 10us > 10us > 10us Figure 13. Power Down Sequence www.onsemi.com 23 NOIV1SN1300A, NOIV2SN1300A Sensor Re−configuration Sensor Configuration During the standby, idle, or running state several sensor parameters can be reconfigured. • Frame Rate and Exposure Time: Frame rate and exposure time changes can occur during standby, idle, and running states. • Signal Path Gain: Signal path gain changes can occur during standby, idle, and running states. • Windowing: Changes with respect to windowing can occur during standby, idle, and running states. Refer to Multiple Window Readout on page 33 for more information. • Subsampling: Changes of the subsampling mode can occur during standby, idle, and running states. Refer to Subsampling on page 34 for more information. • Shutter Mode: The shutter mode can only be changed during standby or idle mode. Reconfiguring the shutter mode during running state is not supported. This device contains multiple configuration registers. Some of these registers can only be configured while the sensor is not acquiring images (while register 192[0] = 0), while others can be configured while the sensor is acquiring images. For the latter category of registers, it is possible to distinguish the register set that can cause corrupted images (limited number of images containing visible artifacts) from the set of registers that are not causing corrupted images. These three categories are described here. Static Readout Parameters Some registers are only modified when the sensor is not acquiring images. Re-configuration of these registers while images are acquired can cause corrupted frames or even interrupt the image acquisition. Therefore, it is recommended to modify these static configurations while the sequencer is disabled (register 192[0] = 0). The registers shown in Table 15 should not be reconfigured during image acquisition. A specific configuration sequence applies for these registers. Refer to the operation flow and startup description. Table 15. STATIC READOUT PARAMETERS Group Addresses Description Clock generator 32 Configure according to recommendation Image core 40 Configure according to recommendation AFE 48 Configure according to recommendation Bias 64–71 Configure according to recommendation LVDS 112 Configure according to recommendation Sequencer mode selection 192 [6:1] All reserved registers Operation modes are: • Rolling shutter enable • triggered_mode • slave_mode Keep reserved registers to their default state, unless otherwise described in the recommendation an image containing visible artifacts. A typical example of a corrupted image is an image which is not uniformly exposed. The effect is transient in nature and the new configuration is applied after the transient effect. Dynamic Configuration Potentially Causing Image Artifacts The category of registers as shown in Table 16 consists of configurations that do not interrupt the image acquisition process, but may lead to one or more corrupted images during and after the re-configuration. A corrupted image is Table 16. DYNAMIC CONFIGURATION POTENTIALLY CAUSING IMAGE ARTIFACTS Group Addresses Description Black level configuration 128–129 197[8] Re-configuration of these registers may have an impact on the black-level calibration algorithm. The effect is a transient number of images with incorrect black level compensation. Sync codes 129[13] 130–135 Incorrect sync codes may be generated during the frame in which these registers are modified. Datablock test configurations 144–150 Modification of these registers may generate incorrect test patterns during a transient frame. www.onsemi.com 24 NOIV1SN1300A, NOIV2SN1300A shown in Table 17. Some re-configuration may lead to one frame being blanked. This happens when the modification requires more than one frame to settle. The image is blanked out and training patterns are transmitted on the data and sync channels. Dynamic Readout Parameters It is possible to reconfigure the sensor while it is acquiring images. Frame-related parameters are internally re-synchronized to frame boundaries, such that the modified parameter does not affect a frame that has already started. However, there can be restrictions to some registers as Table 17. DYNAMIC READOUT PARAMETERS Group Addresses Subsampling/binning 192[7] 192[8] Description Subsampling or binning is synchronized to a new frame start. Black lines 197 Re-configuration of these parameters causes one frame to be blanked out in rolling shutter operation mode, as the reset pointers need to be recalculated for the new frame timing. No blanking in global shutter mode Dummy lines 198 Re-configuration of these parameters causes one frame to be blanked out in rolling shutter operation mode, as the reset pointers need to be recalculated for the new frame timing. No blanking in global shutter mode. ROI configuration 195 256–279 Optionally, it is possible to blank out one frame after re-configuration of the active ROI in rolling shutter mode. Therefore, register 206[8] must be asserted (blank_roi_switch configuration). A ROI switch is only detected when a new window is selected as the active window (re-configuration of register 195). Re-configuration of the ROI dimension of the active window does not lead to a frame blank and can cause a corrupted image. Exposure re-configuration 199-203 Exposure re-configuration does not cause artifact. However, a latency of one frame is observed unless reg_seq_exposure_sync_mode is set to ‘1’ in triggered global mode (master). Gain re-configuration 204 Gains are synchronized at the start of a new frame. Optionally, one frame latency can be incorporated to align the gain updates to the exposure updates (refer to register 204[13] gain_lat_comp). of registers can be programmed in the sync_configuration registers, which can be found at the SPI address 206. Figure 14 shows a re-configuration that does not use the sync_configuration option. As depicted, new SPI configurations are synchronized to frame boundaries. With sync_configuration = ‘1’. Configurations are synchronized to the frame boundaries. Figure 15 shows the usage of the sync_configuration settings. Before uploading a set of registers, the corresponding sync_configuration is de-asserted. After the upload is completed, the sync_configuration is asserted again and the sensor resynchronizes its set of registers to the coming frame boundaries. As seen in the figure, this ensures that the uploads performed at the end of frame N+2 and the start of frame N+3 become active in the same frame (frame N+4). Freezing Active Configurations Though the readout parameters are synchronized to frame boundaries, an update of multiple registers can still lead to a transient effect in the subsequent images, as some configurations require multiple register uploads. For example, to reconfigure the exposure time in master global mode, both the fr_length and exposure registers need to be updated. Internally, the sensor synchronizes these configurations to frame boundaries, but it is still possible that the re-configuration of multiple registers spans over two or even more frames. To avoid inconsistent combinations, freeze the active settings while altering the SPI registers by disabling synchronization for the corresponding functionality before re-configuration. When all registers are uploaded, re-enable the synchronization. The sensor’s sequencer then updates its active set of registers and uses them for the coming frames. The freezing of the active set Time Line Frame NFrame N+1 Frame N+2 Frame N+3 Frame N+4 SPI Registers Active Registers Figure 14. Frame Synchronization of Configurations (no freezing) www.onsemi.com 25 NOIV1SN1300A, NOIV2SN1300A Frame NFrame N+1 Frame N+2 Frame N+3 Frame N+4 Time Line sync_configuration This configuration is not taken into account as sync_register is inactive. SPI Registers Active Registers Figure 15. Re−configuration Using Sync_configuration NOTE: SPI updates are not taken into account while sync_configuration is inactive. The active configuration is frozen for the sensor. Table 18 lists the several sync_configuration possibilities along with the respective registers being frozen. Table 18. ALTERNATE SYNC CONFIGURATIONS Group Affected Registers Description sync_rs_x_length rs_x_length Update of x-length configuration (rolling shutter only) is not synchronized at start of frame when ’0’. The sensor continues with its previous configurations. sync_black_lines black_lines Update of black line configuration is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. sync_dummy_lines sync_exposure sync_gain sync_roi dummy_lines Update of dummy line configuration is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. mult_timer fr_length exposure Update of exposure configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. mux_gainsw afe_gain Update of gain configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. roi_active0[7:0] subsampling binning Update of active ROI configurations is not synchronized at start of frame when ‘0’. The sensor continues with its previous configurations. Note: The window configurations themselves are not frozen. Re-configuration of active windows is not gated by this setting. Window Configuration window configurations. Note that switching between two different windows might result in a corrupted frame. This is inherent in the rolling shutter mechanism, where each line must be reset sequentially before being read out. This corrupted window can be blanked out by setting register 206[8]. In this case, a dead time is noted on the LVDS interface when the window-switch occurs in the sensor. During this blank out, training patterns are sent out on the data and sync channels for the duration of one frame. Global Shutter Mode Up to 8 windows can be defined in global shutter mode (pipelined or triggered). The windows are defined by registers 256 to 279. Each window can be activated or deactivated separately using register 195. It is possible to reconfigure the windows while the sensor is acquiring images. It is also possible to reconfigure the inactive windows or to switch between predefined windows. One can switch between predefined windows by reconfiguring the register 195. This way a minimum number of registers need to be uploaded when it is necessary to switch between two or more sets of windows. As an example of this, scanning the scene at higher frame rates using multiple windows and switching to full frame capture when the object is traced. Switching between the two modes only requires an upload of one register. Black Calibration The sensor automatically calibrates the black level for each frame. Therefore, the device generates a configurable number of electrical black lines at the start of each frame. The desired black level in the resulting output interface can be configured and is not necessarily targeted to ‘0’. Configuring the target to a higher level yields some information on the left side of the black level distribution, while the other end of the distribution tail is clipped to ‘0’ when setting the black level target to ‘0’. The black level is calibrated for the 8 columns contained in one kernel. Configurable parameters for the black-level algorithm are listed in Table 19. Rolling Shutter Mode In rolling shutter mode it is not possible to read multiple windows. Do not activate more than one window (register 195). However, it is possible to configure more than one window and dynamically switch between the different www.onsemi.com 26 NOIV1SN1300A, NOIV2SN1300A Table 19. Configurable Parameters for Black Level Algorithm Group Addresses Description black_lines This register configures the number of black lines that are generated at the start of a frame. At least one black line must be generated. The maximum number is 255. Note: When the automatic black-level calibration algorithm is enabled, make sure that this register is configured properly to produce sufficient black pixels for the black-level filtering. The number of black pixels generated per line is dependent on the operation mode and window configurations: Global Shutter - Each black line contains 160 kernels. Rolling Shutter - As the line length is fundamental for rolling shutter operation, the length of a black line is defined by the active window. gate_first_line When asserting this configuration, the first black line of the frame is blanked out and is not used for black calibration. It is recommended to enable this functionality, because the first line can have a different behavior caused by boundary effects. When enabling, the number of black lines must be set to at least two in order to have valid black samples for the calibration algorithm. auto_blackcal_enable Internal black-level calibration functionality is enabled when set to ‘1’. Required black level offset compensation is calculated on the black samples and applied to all image pixels. When set to ‘0’, the automatic black-level calibration functionality is disabled. It is possible to apply an offset compensation to the image pixels, which is defined by the registers 129[10:1]. Note: Black sample pixels are not compensated; the raw data is sent out to provide external statistics and, optionally, calibrations. 129[9:1] blackcal_offset Black calibration offset that is added or subtracted to each regular pixel value when auto_blackcal_enable is set to ‘0’. The sign of the offset is determined by register 129[10] (blackcal_offset_dec). Note: All channels use the same offset compensation when automatic black calibration is disabled. 129[10] blackcal_offset_dec Sign of blackcal_offset. If set to ‘0’, the black calibration offset is added to each pixel. If set to ‘1’, the black calibration offset is subtracted from each pixel. This register is not used when auto_blackcal_enable is set to ‘1’. black_samples The black samples are low-pass filtered before being used for black level calculation. The more samples are taken into account, the more accurate the calibration, but more samples require more black lines, which in turn affects the frame rate. The effective number of samples taken into account for filtering is 2^ black_samples. Note: An error is reported by the device if more samples than available are requested (refer to register 136). Black Line Generation 197[7:0] 197[8] Black Value Filtering 129[0] 128[10:8] Black Level Filtering Monitoring 136 blackcal_error0 An error is reported by the device if there are requests for more samples than are available (each bit corresponding to one data path). The black level is not compensated correctly if one of the channels indicates an error. There are three possible methods to overcome this situation and to perform a correct offset compensation: • Increase the number of black lines such that enough samples are generated at the cost of increasing frame time (refer to register 197). • Relax the black calibration filtering at the cost of less accurate black level determination (refer to register 128). • Disable automatic black level calibration and provide the offset via SPI register upload. Note that the black level can drift in function of the temperature. It is thus recommended to perform the offset calibration periodically to avoid this drift. NOTE: The maximum number of samples taken into account for black level statistics is half the number of kernels. www.onsemi.com 27 NOIV1SN1300A, NOIV2SN1300A Serial Peripheral Interface indicated in Figure 16. The sensor samples this data on a rising edge of the sck clock (mosi needs to be driven by the system on the falling edge of the sck clock). 3. The tenth bit sent by the master indicates the type of transfer: high for a write command, low for a read command. 4. Data transmission: - For write commands, the master continues sending the 16-bit data, most significant bit first. - For read commands, the sensor returns the requested address on the miso pin, most significant bit first. The miso pin must be sampled by the system on the falling edge of sck (assuming nominal system clock frequency and maximum 10 MHz SPI frequency). 5. When data transmission is complete, the system deselects the sensor one clock period after the last bit transmission by pulling ss_n high. Maximum frequency for the SPI depends on the input clock and type of sensor. The frequency is 1/6th of the PLL input clock or 1/30th (in 10-bit mode) and 1/24th (in 8-bit mode) of the LVDS input clock frequency. At nominal input frequency (62 Mhz / 310 MHz / 248 MHz), the maximum frequency for the SPI is 10 MHz. Bursts of SPI commands can be issued by leaving at least two SPI clock periods between two register uploads. Deselect the chip between the SPI uploads by pulling the ss_n pin high. The sensor configuration registers are accessed through an SPI. The SPI consists of four wires: • sck: Serial Clock • ss_n: Active Low Slave Select • mosi: Master Out, Slave In, or Serial Data In • miso: Master In, Slave Out, or Serial Data Out The SPI is synchronous to the clock provided by the master (sck) and asynchronous to the sensor’s system clock. When the master wants to write or read a sensor’s register, it selects the chip by pulling down the Slave Select line (ss_n). When selected, data is sent serially and synchronous to the SPI clock (sck). Figure 16 shows the communication protocol for read and write accesses of the SPI registers. The VITA 1300 sensor uses 9-bit addresses and 16-bit data words. Data driven by the system is colored blue in Figure 16, while data driven by the sensor is colored yellow. The data in grey indicates high-Z periods on the miso interface. Red markers indicate sampling points for the sensor (mosi sampling); green markers indicate sampling points for the system (miso sampling during read operations). The access sequence is: 1. Select the sensor for read or write by pulling down the ss_n line. 2. One SPI clock cycle after selecting the sensor, the 9-bit data is transferred, most significant bit first. The sck clock is passed through to the sensor as SP I − W R ITE ss_n t_sc ks s ts ck t_sssck sck ts _mos i mo si A8 th_mosi A7 .. .. .. A1 A0 `1' D15 D14 .. .. .. .. D1 D0 miso SPI − REA D ss_n t_sssck t_sc ks s ts ck sck ts_mosi mo si A8 th_mosi A7 .. .. .. A1 A0 `0' th_mi so ts _mi so miso D15 D14 .. .. Figure 16. SPI Read and Write Timing Diagram www.onsemi.com 28 .. .. D1 D0 NOIV1SN1300A, NOIV2SN1300A Table 20. SPI TIMING REQUIREMENTS Group Addresses Description Units 100 (*) ns ss_n low to sck rising edge tsck ns tsckss sck falling edge to ss_n high tsck ns ts_mosi Required setup time for mosi 20 ns th_mosi Required hold time for mosi 20 ns ts_miso Setup time for miso tsck/2-10 ns th_miso Hold time for miso tsck/2-20 ns tspi Minimal time between two consecutive SPI accesses (not shown in figure) 2 x tsck ns tsck sck clock period tsssck *Value indicated is for nominal operation. The maximum SPI clock frequency depends on the sensor configuration (operation mode, input clock). tsck is defined as 1/fSPI. See text for more information on SPI clock frequency restrictions. www.onsemi.com 29 NOIV1SN1300A, NOIV2SN1300A IMAGE SENSOR TIMING AND READOUT reset period, the global photodiode reset condition is abandoned. This indicates the start of the integration or exposure time. The length of the exposure time is defined by the registers exposure and mult_timer. NOTE: The start of the exposure time is synchronized to the start of a new line (during ROT) if the exposure period starts during a frame readout. As a consequence, the effective time during which the image core is in a reset state is extended to the start of a new line. • Make sure that the sum of the reset time and exposure time exceeds the time required to readout all lines. If this is not the case, the exposure time is extended until all (active) lines are read out. • Alternatively, it is possible to specify the frame time and exposure time. The sensor automatically calculates the required reset time. This mode is enabled by the fr_mode register. The frame time is specified in the register fr_length. The following sections describe the configurations for single slope reset mechanism. Dual and triple slope handling during global shutter operation is similar to the single slope operation. Extra integration time registers are available. Global Shutter Mode Pipelined Global Shutter (Master) The integration time is controlled by the registers fr_length[15:0] and exposure[15:0]. The mult_timer configuration defines the granularity of the registers reset_length and exposure. It is read as number of system clock cycles (16.129 ns nominal at 62 MHz) for the V1-SN/SE version and 15.5 MHz cycles (64.516 ns nominal) for the V2-SN/SE version. The exposure control for (Pipelined) Global Master mode is depicted in Figure 17. The pixel values are transferred to the storage node during FOT, after which all photo diodes are reset. The reset state remains active for a certain time, defined by the reset_length and mult_timer registers, as shown in the figure. Note that meanwhile the image array is read out line by line. After this Frame N Exposure State FOT Readout FOT Reset Frame N+1 Integrating FOT Reset Integrating FOT FOT FOT Image Array Global Reset reset_length x mult_timer exposure x mult_timer = ROT = Readout = Readout Dummy Line (blanked) Figure 17. Integration Control for (Pipelined) Global Shutter Mode (Master) exposure and mult_timer, as in the master pipelined global mode. The fr_length configuration is not used. This operation is graphically shown in Figure 18. Triggered Global Shutter (Master) In master triggered global mode, the start of integration time is controlled by a rising edge on the trigger0 pin. The exposure or integration time is defined by the registers Frame N Exposure State FOT Integrating FOT Reset Integrating FOT (No effect on falling edge) trigger0 Readout Reset Frame N+1 FOT FOT FOT Image Array Global Reset exposure x mult_timer = ROT = Readout = Readout Dummy Line (blanked) Figure 18. Exposure Time Control in Triggered Shutter Mode (Master) www.onsemi.com 30 NOIV1SN1300A, NOIV2SN1300A the pixel storage node and readout of the image array. In other words, the high time of the trigger pin indicates the integration time, the period of the trigger pin indicates the frame time. The use of the trigger during slave mode is shown in Figure 19. Notes: • The falling edge on the trigger pin does not have any impact. Note however the trigger must be asserted for at least 100 ns. • The start of the exposure time is synchronized to the start of a new line (during ROT) if the exposure period starts during a frame readout. As a consequence, the effective time during which the image core is in a reset state is extended to the start of a new line. • If the exposure timer expires before the end of readout, the exposure time is extended until the end of the last active line. • The trigger pin needs to be kept low during the FOT. The monitor pins can be used as a feedback to the FPGA/controller (eg. use monitor0, indicating the very first line when monitor_select = 0x5 − a new trigger can be initiated after a rising edge on monitor0). Notes: • The registers exposure, fr_length, and mult_timer are not used in this mode. • The start of exposure time is synchronized to the start of a new line (during ROT) if the exposure period starts during a frame readout. As a consequence, the effective time during which the image core is in a reset state is extended to the start of a new line. • If the trigger is de-asserted before the end of readout, the exposure time is extended until the end of the last active line. • The trigger pin needs to be kept low during the FOT. The monitor pins can be used as a feedback to the FPGA/controller (eg. use monitor0, indicating the very first line when monitor_select = 0x5 − a new trigger can be initiated after a rising edge on monitor0). Triggered Global Shutter (Slave) Exposure or integration time is fully controlled by means of the trigger pin in slave mode. The registers fr_length, exposure and mult_timer are ignored by the sensor. A rising edge on the trigger pin indicates the start of the exposure time, while a falling edge initiates the transfer to Frame N Exposure State FOT Reset Frame N+1 Integrating FOT Reset Integrating FOT trigger0 Readout FOT FOT FOT Image Array Global Reset = ROT = Readout = Readout Dummy Line (blanked) Figure 19. Exposure Time Control in Global−Slave Mode www.onsemi.com 31 NOIV1SN1300A, NOIV2SN1300A Rolling Shutter Mode frame rate by adding so called dummy lines. A dummy line lasts for the same time as a regular line, but no pixel data is transferred to the system. The number of dummy lines is controlled by the register dummy_lines. The rolling shutter exposure mechanism is graphically shown in Figure 20. The exposure time during rolling shutter mode is always an integer multiple of line-times. The exposure time is defined by the register exposure and expressed in number of lines. The register fr_length and mult_timer are not used in this mode. The maximum exposure time is limited by the frame time. It is possible to increase the exposure time at the cost of the Figure 20. Integration Control in Rolling Shutter Mode It is clear that when the number of rows and/or the length of a row are reduced (by windowing or subsampling), the frame time decreases and consequently the frame rate increases. To be able to artificially increase the frame time, it is possible to: • add dummy clock cycles to a row time • add dummy rows to the frame Note: The duration of one line is the sum of the ROT and the time required to read out one line (depends on the number of active kernels in the window). Optionally, this readout time can be extended by the configuration rs_x_length. This register, expressed in number of periods of the logic clock (16.129 ns for the V1-SN/SE version and 64.516 ns for the V2-SN/SE version), determines the length of the x-readout. However, the minimum for rs_x_length is governed by the window size (x-size). www.onsemi.com 32 NOIV1SN1300A, NOIV2SN1300A ADDITIONAL FEATURES Multiple Window Readout Up to eight windows can be defined, possibly (partially) overlapping, as illustrated in Figure 22. The VITA 1300 sensor supports multiple window readout, which means that only the user-selected Regions Of Interest (ROI) are read out. This allows limiting data output for every frame, which in turn allows increasing the frame rate. • In global shutter mode, up to eight ROIs can be configured. • In rolling shutter mode, only a single ROI is supported. All multiple windowing features described further in this section are only valid for global shutter mode. 1280 pixels y1_end ROI 1 1024 pixels y0_end y1_start ROI 0 Window Configuration Figure 24 shows the four parameters defining a region of interest (ROI). y0_start 1280 pixels x0_start y-end x0_end x1_start x1_end Figure 22. Overlapping Multiple Window Configuration 1024 pixels ROI 0 y-start The sequencer analyses each line that need to be read out for multiple windows. Restrictions The following restrictions for each line are assumed for the user configuration: • Windows are ordered from left to right, based on their x−start address: x_start_roi(i) v x_start_roi(j) AND x-start x-end Figure 21. Region of Interest Configuration x_end_roi(i) vx_end_roi(j) • x−start[7:0] Where j > i x-start defines the x-starting point of the desired window. The sensor reads out 8 pixels in one single clock cycle. As a consequence, the granularity for configuring the x-start position is also 8 pixels for no sub sampling. The value configured in the x-start register is multiplied by 8 to find the corresponding column in the pixel array. • x-end[7:0] This register defines the window end point on the x-axis. Similar to x-start, the granularity for this configuration is one kernel. x-end needs to be larger than x-start. • y-start[9:0] The starting line of the readout window. The granularity of this setting is one line, except with color sensors where it needs to be an even number. • y-end[9:0] The end line of the readout window. y-end must be configured larger than y-start. This setting has the same granularity as the y-start configuration. Processing Multiple Windows The sequencer control block houses two sets of counters to construct the image frame. As previously described, the y-counter indicates the line that needs to be read out and is incremented at the end of each line. For the start of the frame, it is initialized to the y-start address of the first window and it runs until the y-end address of the last window to be read out. The last window is configured by the configuration registers and it is not necessarily window #7. The x-counter starts counting from the x-start address of the window with the lowest ID which is active on the addressed line. Only windows for which the current y-address is enclosed are taken into account for scanning. Other windows are skipped. www.onsemi.com 33 NOIV1SN1300A, NOIV2SN1300A • The x-pointer starting position is equal to the x-start ROI 2 ys ROI 3 • ROI 4 ROI 1 • ROI 0 configuration of the first active window on the current line addressed. This window is not necessarily window #0. The x-pointer is not necessarily incremented by one each cycle. At the end of a window it can jump to the start of the next window. Each window can be activated separately. There is no restriction on which window and how many of the 8 windows are active. Subsampling Subsampling is used to reduce the image resolution. This allows increasing the frame rate. Two subsampling modes are supported: for monochrome sensors (V1/V2-SN) and color sensors (V1/V2-SE). Figure 23. Scanning the Image Array with Five Windows Figure 23 illustrates a practical example of a configuration with five windows. The current position of the read pointer (ys) is indicated by a red line crossing the image array. For this position of the read pointer, three windows need to be read out. The initial start position for the x-kernel pointer is the x-start configuration of ROI1. Kernels are scanned up to the ROI3 x-end position. From there, the x-pointer jumps to the next window, which is ROI4 in this illustration. When reaching ROI4’s x-end position, the read pointer is incremented to the next line and xs is reinitialized to the starting position of ROI1. Notes: • The starting point for the readout pointer at the start of a frame is the y-start position of the first active window. • The read pointer is not necessarily incremented by one, but depending on the configuration, it can jump in y-direction. In Figure 23, this is the case when reaching the end of ROI0 where the read pointer jumps to the y-start position of ROI1 Monochrome Sensors For monochrome sensors, the read-1-skip-1 subsampling scheme is used. Subsampling occurs both in x- and ydirection. Color Sensors For color sensors, the read-2-skip-2 subsampling scheme is used. Subsampling occurs both in x- and y- direction. Figure 24 shows which pixels are read and which ones are skipped. Binning Pixel binning is a technique in which different pixels are averaged in the analog domain. A 2x1 binning mode is available on the monochrome sensors (V1/V2-SN). When enabled, two neighboring pixels in the x-direction are averaged while line readout happens in a read-1-skip-1 manner. Pixel binning is not supported on V1/V2-SE. Figure 24. Subsampling Scheme for Monochrome and Color Sensors www.onsemi.com 34 NOIV1SN1300A, NOIV2SN1300A Multiple Slope Integration To increase the dynamic range of the sensor, a second slope is applied in the dual slope mode (green curve). The sensor has the same responsivity in the black as for a single slope, but from ‘knee point 1’ on, the sensor is less responsive to incoming light. The result is that the saturation point is at a higher light power level. To further increase the dynamic range, a third slope can be applied, resulting in a second knee point. The multiple slope function is only available in global shutter modes. Refer to section Global Shutter Mode on page 30 for general notes applicable to the global shutter operation and more particular to the use of the trigger0 pin. ‘Multiple Slope Integration’ is a method to increase the dynamic range of the sensor. The VITA 1300 supports up to three slopes. Figure 25 shows the sensor response to light when the sensor is used with one slope, two slopes, and three slopes. The X-axis represents the light power; the Y-axis shows the sensor output signal. The kneepoint of the multiple slope curves are adjustable in both position and voltage level. It is clear that when using only one slope (red curve), the sensor has the same responsivity over the entire range, until the output saturates at the point indicated with ‘single slope saturation point’. output 1023 slope 3 `kneepoint 2' slope 1 slope 2 `kneepoint 1' 0 single slope saturation point light triple slope saturation point dual slope saturation point Figure 25. Multiple Slope Operation Required Register Uploads Multiple slope integration requires the uploads as described in the following table. Note that these are cumulative with the required register uploads (Table 21) Table 21. REQUIRED UPLOADS FOR MULTIPLE SLOPE INTEGRATION Upload # Address Data Description 1 194[3] 0x1 Configure sequencer 2 385 0x321F Configure sequencer 3 386 0x321F Configure sequencer 4 387 0x321F Configure sequencer 5 388 0x321F Configure sequencer 6 389 0x101F Configure sequencer 15 415 0x703F Configure sequencer 16 416 0x7034 Configure sequencer 17 417 0x7030 Configure sequencer 18 423 0x705F Configure sequencer 19 424 0x7054 Configure sequencer 20 425 0x7050 Configure sequencer To disable multiple slope integration, the following uploads are required on top of disabling dual_slope_enable and triple_slope_enable. Table 22. REQUIRED UPLOADS FOR RETURNING TO SINGLE SLOPE INTEGRATION Upload # Address Data Description 1 385 0x549F Configure sequencer 2 386 0x549F Configure sequencer 7 390 0x549F Configure sequencer 8 391 0x549F Configure sequencer 9 392 0x549F Configure sequencer 3 387 0x549F Configure sequencer 10 393 0x549F Configure sequencer 4 388 0x549F Configure sequencer 11 394 0x5091 Configure sequencer 5 389 0x5091 Configure sequencer 12 395 0x1011 Configure sequencer 6 390 0x1011 Configure sequencer 391 0x111F Configure sequencer 392 0x1110 Configure sequencer 13 396 0x111F Configure sequencer 7 14 397 0x1110 Configure sequencer 8 www.onsemi.com 35 NOIV1SN1300A, NOIV2SN1300A dual_slope_enable and triple_slope_enable and their values are defined by the registers exposure_ds and exposure_ts. NOTE: Dual and triple slope sequences must start after readout of the previous frame is fully completed. Figure 26 shows the frame timing for pipelined master mode with dual and triple slope integration and fr_mode = ‘0’ (fr_length representing the reset length). In triggered master mode, the start of integration is initiated by a rising edge on trigger0, while the falling edge does not have any relevance. Exposure duration and dual/triple slope points are defined by the registers. Kneepoint Configuration (Multiple Slope Reset Levels) The kneepoint reset levels are configured by means of DAC configurations in the image core. The dual slope kneepoint is configured with the dac_ds configuration, while the triple slope kneepoint is configured with the dac_ts register setting. Both are located on address 41. Multiple Slope Integration in “Master Mode” (Pipelined or Triggered) In master mode, the time stamps for the double and triple slope resets are configured in a similar way as the exposure time. They are enabled through the registers Figure 26. Multiple Slope Operation in Master Mode for fr_mode = ‘0’ (Pipelined) initiates the triple slope reset sequence. Rising edges on trigger1 and trigger2 do not have any impact. NOTE: Dual and triple slope sequences must start after readout of the previous frame is fully completed. Slave Mode In slave mode, the register settings for integration control are ignored. The user has full control through the trigger0, trigger1 and trigger2 pins. A falling edge on trigger1 initiates the dual slope reset while a falling edge on trigger2 Figure 27. Multiple Slope Operation in Slave Mode www.onsemi.com 36 NOIV1SN1300A, NOIV2SN1300A Black Reference exposure time and gain are reconfigured together, as an exposure time update always has one frame latency. The sensor reads out one or more black lines at the start of every new frame. The number of black lines to be generated is programmable and is minimal equal to 1. The length of the black lines depends on the operation mode: for Rolling Shutter mode, the length of the black line is equal to the line length configured in the active window. For Global Shutter mode, the sensor always reads out the entire line (160 kernels), independent of window configurations. The black references are used to perform black calibration and offset compensation in the data channels. The raw black pixel data is transmitted over the usual output interface, while the regular image data is compensated (can be bypassed). On the output interface, black lines can be seen as a separate window, however without Frame Start and Ends (only Line Start/End). The Sync code following the Line Start and Line End indications (“window ID”) contains the active window number for Rolling Shutter operation, while it is 0 for Snapshot Shutter operation. Black reference data is classified by a BL code. Table 23. SIGNAL PATH GAIN STAGES (Analog Gain Stages) Signal Path Gain gain_stage1 Gain Stage 1 gain_stage2 Gain Stage 2 GAIN total 0x2 1.00 0xF 1.00 1.00 0x2 1.00 0x7 1.14 1.14 0x2 1.00 0x3 1.33 1.33 0x2 1.00 0x5 1.60 1.60 0x2 1.00 0x1 2.00 2.00 0x1 2.00 0x7 1.14 2.29 0x1 2.00 0x3 1.33 2.67 0x1 2.00 0x5 1.60 3.20 0x1 2.00 0x1 2.00 4.00 0x1 2.00 0x6 2.67 5.33 0x1 2.00 0x2 4.00 8.00 Digital Gain Stage The digital gain stage allows fine gain adjustments on the digitized samples. The gain configuration is an absolute 5.7 unsigned number (5 digits before and 7 digits after the decimal point). Analog Gain Stages Two gain steps are available in the analog data path to apply gain to the analog signal before it is digitized. The gain amplifier can apply a gain of 1x to 8x to the analog signal. The moment a gain re-configuration is applied and becomes valid can be controlled by the gain_lat_comp configuration. With ‘gain_lat_comp’ set to ‘0’, the new gain configurations are applied from the very next frame. With ‘gain_lat_comp’ set to ‘1’, the new gain settings are postponed by one extra frame. This feature is useful when Automatic Exposure Control Requested Illumination Level (Target) AEC Statistics Total Gain Requested Gain Changes The exposure control mechanism has the shape of a general feedback control system. Figure 28 shows the high level block diagram of the exposure control loop. AEC Filter AEC Enforcer Integration Time Analog Gain (Coarse Steps) Digital Gain (Fine Steps) Image Capture Figure 28. Automatic Exposure Control Loop Three main blocks can be distinguished: • The statistics block compares the average of the current • • image’s samples to the configured target value for the average illumination of all pixels The relative gain change request from the statistics block is filtered in the time domain (low pass filter) before being integrated. The output of the filter is the total requested gain in the complete signal path. The enforcer block accepts the total requested gain and distributes this gain over the integration time and gain stages (both analog and digital) www.onsemi.com 37 NOIV1SN1300A, NOIV2SN1300A The automatic exposure control loop is enabled by asserting the aec_enable configuration in register 160. NOTE: Dual and Triple slope integration is not supported in conjunction with the AEC. Color Sensor The weight of each color can be configured for color sensors by means of scale factors. Note these scale factor are only used to calculate the statistics in order to compensate for (off-chip) white balancing and/or color matrices. The pixel values itself are not modified. The scale factors are configured as 3.7 unsigned numbers (0x80 = unity). AEC Statistics Block The statistics block calculates the average illumination of the current image. Based on the difference between the calculated illumination and the target illumination the statistics block requests a relative gain change. Table 26. COLOR SCALE FACTORS Statistics Subsampling and Windowing For average calculation, the statistics block will sub-sample the current image or windows by taking every fourth sample into account. Note that only the pixels read out through the active windows are visible for the AEC. In the case where multiple windows are active, the samples will be selected from the total samples. Samples contained in a region covered by multiple (overlapping) window will be taking into account only once. It is possible to define an AEC specific sub-window on which the AEC will calculate it’s average. For instance, the sensor can be configured to read out a larger frame, while the illumination is measured on a smaller region of interest, e.g. center weighted. Name Description 192[10] roi_aec_enable When 0x0, all active windows are selected for statistics calculation. When 0x1, the AEC samples are selected from the active pixels contained in the region of interest defined by roi_aec 253-255 roi_aec These registers define a window from which the AEC samples will be selected when roi_aec_enable is asserted. Configuration is similar to the regular region of interests. The intersection of this window with the active windows define the selected pixels. It is important that this window at least overlaps with one or more active windows. Table 25. AEC TARGET ILLUMINATION CONFIGURATION Name Description desired_in­ tensity Target intensity value, on 10­bit scale. For 8­bit mode, target value is con­ figured on desired_intensity[9:2] 162[9:0] red_scale_factor Red scale factor for AEC statistics 163[9:0] green1_scale_factor Green1 scale factor for AEC statistics 164[9:0] green2_scale_factor Green2 scale factor for AEC statistics 165[9:0] blue_scale_factor Blue scale factor for AEC statistics Exposure Control Parameters The several gain parameters are described below, in the order in which these are controlled by the AEC for large adjustments. Small adjustments are regulated by digital gain only. • Exposure Time In rolling shutter mode, the exposure time is the time elapsed between resetting a particular line and reading it out. This time is constant for all lines in a frame, lest the image be non-uniformly exposed. The exposure time is always an integer multiple of the line time. In a snapshot shutter mode, the exposure is the time between the global image array reset de-assertion and the pixel charge transfer. The granularity of the integration time steps is configured by the mult_timer register. NOTE: The exposure_time register is ignored when the AEC is enabled. The register fr_length defines the frame time and needs to be configured accordingly. Target Illumination The target illumination value is configured by means of register desired_intensity. Register Description AEC Enforcer Block The enforcer block calculates the four different gain parameters, based on the required total gain, thereby respecting a specific hierarchy in those configurations. Some (digital) hysteresis is added so that the (analog) sensor settings don’t need to change too often. Important note for rolling shutter operation: a minimum of 4 dummy lines is required when using the automatic exposure controller. 161[9:0] Name Configure these factors to their default value for monochrome sensors. AEC Filter Block The filter block low-pass filters the gain change requests received from the statistics block. The filter can be restarted by asserting the restart_filter configuration of register 160. Table 24. AEC SAMPLE SELECTION Register Register www.onsemi.com 38 NOIV1SN1300A, NOIV2SN1300A • Analog Gain The sensor has two analog gain stages, configurable independently from each other. Typically the AEC shall first regulate the first stage. Optionally this behavior can be inverted by setting the amp_pri register. • Digital Gain The last gain stage is a gain applied on the digitized samples. The digital gain is represented by a 5.7 unsigned number (i.e. 7 bits after the decimal point). While the analog gain steps are coarse, the digital gain stage makes it possible to achieve very fine adjustments. AEC Control Range The control range for each of the exposure parameters can be pre-programmed in the sensor. Note that for rolling shutter operation the maximum integration time should not exceed the number of lines read out (i.e. the sum of black lines, active window-defined lines and dummy lines). Table 27 lists the relevant registers. Register Name Description min_exposure Lower bound for the integration time applied by the AEC 169[1:0] min_mux_gain Lower bound for the first stage analog amplifier. This stage has two configurations with the following approximative gains: 0x0 = 1x 0x1 = 2x 169[3:2] 169[15:4] min_afe_gain min_digital_gain Upper bound for the integration time applied by the AEC 171[1:0] max_mux_gain Upper bound for the first stage analog amplifier. This stage has two configurations with the following approximative gains: 0x0 = 1x 0x1 = 2x 171[15:4] max_digital_gain Upper bound for the digital gain stage. This configuration specifies the effective gain in 5.7 unsigned format Register Name Description AEC Status Registers Lower bound for the digital gain stage. This configuration specifies the effective gain in 5.7 unsigned format max_exposure Upper bound for the second stage analog amplifier This stage has four configurations with the following approximative gains: 0x0 = 1.00x 0x1 = 1.33x 0x2 = 2.00x 0x3 = 2.50x Table 28. EXPOSURE CONTROL STATUS REGISTERS Lower bound for the second stage analog amplifier This stage has four configurations with the following approximative gains: 0x0 = 1.00x 0x1 = 1.33x 0x2 = 2.00x 0x3 = 2.50x 170[15:0] max_afe_gain AEC Update Frequency As an integration time update has a latency of one frame, the exposure control parameters are evaluated and updated every other frame. Note: The gain update latency must be postpone to match the integration time latency. This is done by asserting the gain_lat_comp register on address 204[13]. Exposure Control Status Registers Configured integration and gain parameters are reported to the user by means of status registers. The sensor provides two levels of reporting: the status registers reported in the AEC address space are updated once the parameters are recalculated and requested to the internal sequencer. The status registers residing in the sequencer’s address space on the other hand are updated once these parameters are taking effect on the image readout. The first set shall thus lead the second set of status registers. Table 27. MINIMUM AND MAXIMUM EXPOSURE CONTROL PARAMETERS 168[15:0] 171[3:2] 184[15:0] total_pixels Total number of pixels taken into account for the AEC statistics. 186[9:0] average Calculated average illumination level for the current frame. 187[15:0] exposure AEC calculated exposure. Note: this parameter is updated at the frame end. 188[1:0] mux_gain AEC calculated analog gain (1st stage) Note: this parameter is updated at the frame end. 188[3:2] afe_gain AEC calculated analog gain (2st stage) Note: this parameter is updated at the frame end. www.onsemi.com 39 NOIV1SN1300A, NOIV2SN1300A 188[15:4] digital_gain Temperature Sensor AEC calculated digital gain (5.7 unsigned format) Note: this parameter is updated at the frame end. The VITA 1300 has an on-chip temperature sensor which can output a digital code (Tsensor) of the silicon junction temperature. The Tsensor output is a 8-bit digital count between 0 and 255, proportional to the temperature of the silicon substrate. This reading can be translated directly to a temperature reading in °C by calibrating the 8-bit readout at 0°C and 85°C to achieve an output accuracy of ±2°C. The Tsensor output can also be calibrated using a single temperature point (example: room temperature or the ambient temperature of the application), to achieve an output accuracy of ±5°C. The resolution of the temperature sensor in ºC / bit is made almost constant over process variations by design. Therefore any process variation will result in an offset in the bit count and this offset will remain within ±5°C over the temperature range of 0°C and 85°C. Tsensor output digital code can be read out through the SPI interface. Refer to the Register Map on page 50 The output of the temperature sensor to the SPI: tempd_reg_temp: This is the 8-bit N count readout proportional to temperature. The input from the SPI: The reg_tempd_enable is a global enable and this enables or disables the temperature sensor when logic high or logic low respectively. The temperature sensor is reset or disabled when the input reg_tempd_enable is set to a digital low state. Sequencer Status Registers 208[15:0] mult_timer mult_timer for current frame (global shutter only). Note: this parameter is updated once it takes effect on the image. 209[15:0] reset_length Image array reset length for the current frame (global shutter only). Note: this parameter is updated once it takes effect on the image. 210[15:0] exposure Exposure for the current frame. Note: this parameter is updated once it takes effect on the image. 211[15:0] exposure_ds Dual slope exposure for the current frame. Note this parameter is not controlled by the AEC. Note: this parameter is updated once it takes effect on the image. 212[15:0] exposure_ts Triple slope exposure for the current frame. Note this parameter is not controlled by the AEC. Note: this parameter is updated once it takes effect on the image. 213[4:0] mux_gainsw 1st stage analog gain for the current frame. Note: this parameter is updated once it takes effect on the image. 213[12:5] afe_gain 2st stage analog gain for the current frame. Note: this parameter is updated once it takes effect on the image. 214[11:0] db_gain Digital gain configuration for the current frame (5.7 unsigned format). Note: this parameter is updated once it takes effect on the image. 214[11:0] dual_slope Dual slope configuration for the current frame Note 1: this parameter is updated once it takes effect on the image. Note 2: This parameter is not controlled by the AEC. 214[11:0] triple_slope Triple slope configuration for the current frame. Note 1: this parameter is updated once it takes effect on the image. Note 2: This parameter is not controlled by the AEC. Calibration using one temperature point The temperature sensor resolution is fixed for a given type of package for the operating range of 0°C to +85°C and hence devices can be calibrated at any ambient temperature of the application, with the device configured in the mode of operation. Interpreting the actual temperature for the digital code readout: The formula used is TJ = R (Nread - Ncalib) + Tcalib TJ = junction die temperature R = resolution in degrees/LSB (typical 0.75 deg/LSB) Nread = Tsensor output (LSB count between 0 and 255) Tcalib = Tsensor calibration temperature Ncalib = Tsensor output reading at Tcalib Monitor Pins The internal sequencer has two monitor outputs (Pin 44 and Pin 45) that can be used to communicate the internal states from the sequencer. A three-bit register configures the assignment of the pins. www.onsemi.com 40 NOIV1SN1300A, NOIV2SN1300A Table 29. REGISTER SETTING FOR THE MONITOR SELECT PIN monitor_select [2:0] 192 [13:11] monitor pin 0x0 monitor0 monitor1 ‘0’ ‘0’ 0x1 monitor0 monitor1 Integration Time ROT Indication (‘1’ during ROT, ‘0’ outside) 0x2 monitor0 monitor1 Integration Time Dual/Triple Slope Integration (asserted during DS/TS FOT sequence) 0x3 monitor0 monitor1 Start of x-Readout Indication Black Line Indication (‘1’ during black lines, ‘0’ outside) 0x4 monitor0 monitor1 Frame Start Indication Start of ROT Indication 0x5 monitor0 monitor1 First Line Indication (‘1’ during first line, ‘0’ for all others) Start of ROT Indication 0x6 monitor0 monitor1 ROT Indication (‘1’ during ROT, ‘0’ outside) Start of X-Readout Indication 0x7 monitor0 monitor1 Start of X-readout Indication for Black Lines Start of X-readout Indication for Image Lines Description DATA OUTPUT FORMAT The VITA 1300 is available in two different versions: Frame Format The frame format in 8-bit mode is identical to the 10-bit mode with the exception that the Sync and data word depth is reduced to eight bits. The frame format in 10-bit mode is explained by example of the readout of two (overlapping) windows as shown in Figure 29 (a). The readout of a frame occurs on a line-by-line basis. The read pointer goes from left to right, bottom to top. Figure 29 indicates that, after the FOT is completed, the sensor reads out a number of black lines for black calibration purposes. After these black lines, the windows are processed. First a number of lines which only includes information of ‘ROI 0’ are sent out, starting at position y0_start. When the line at position y1_start is reached, a number of lines containing data of ‘ROI 0’ and ‘ROI 1’ are sent out, until the line position of y0_end is reached. From there on, only data of ‘ROI 1’ appears on the data output channels until line position y1_end is reached During read out of the image data over the data channels, the sync channel sends out frame synchronization codes which give information related to the image data that is sent over the four data output channels. Each line of a window starts with a Line Start (LS) indication and ends with a Line End (LE) indication. The line start of the first line is replaced by a Frame Start (FS); the line end of the last line is replaced with a Frame End indication (FE). Each such frame synchronization code is followed by a window ID (range 0 to 7). For overlapping windows, the line synchronization codes of the overlapping windows with lower IDs are not sent out (as shown in the • V1-SN/SE: Four LVDS output channels, together with • an LVDS clock output and an LVDS synchronization output channel. V2-SN/SE: A 10-bit parallel CMOS output, together with a CMOS clock output and ‘frame valid’ and ‘line valid’ CMOS output signals. V1-SN/SE: LVDS Interface Version LVDS Output Channels The image data output occurs through four LVDS data channels. A synchronization LVDS channel and an LVDS output clock signal is foreseen to synchronize the data. The four data channels are used to output the image data only. The sync channel transmits information about the data sent over these data channels (includes codes indicating black pixels, normal pixels, and CRC codes). 8-bit / 10-bit Mode The sensor can be used in 8-bit or 10-bit mode. In 10-bit mode, the words on data and sync channel have a 10-bit length. The output data rate is 620 Mbps. In 8-bit mode, the words on data and sync channel have an 8-bit length, the output data rate is 496 Mbps. Note that the 8-bit mode can only be used to limit the data rate at the consequence of image data word depth. It is not supported to operate the sensor in 8-bit mode at a higher clock frequency to achieve higher frame rates. www.onsemi.com 41 NOIV1SN1300A, NOIV2SN1300A illustration: no LE/FE is transmitted for the overlapping part of window 0). NOTE: In Figure 29, only Frame Start and Frame End Sync words are indicated in (b). CRC codes are also omitted from the figure. y1_end ROI 1 y0_end y1_start ROI 0 y0_start x0_start x0_end x1_start x1_end (a) Integration Time Handling Readout Handling FOT É É B L Reset N Exposure Time N Readout Frame N-1 ROI 1 ROI 0 FS0 FS1 Reset N+1 FOT FOT FE1 É É B L Exposure Time N+1 FOT Readout Frame N ROI 1 ROI 0 FS0 FS1 FOT FE1 (b) Figure 29. V1−SN/SE: Frame Sync Codes Figure 30 shows the detail of a black line readout during global or full-frame readout. Sequencer Internal State FOT ROT ROT black line Ys ROT ROT line Ys+1 line Ye data channels sync channel data channels sync channel Training TR Training LS BL timeslot 0 timeslot 1 BL BL BL timeslot 157 BL timeslot 158 BL LE timeslot 159 CRC CRC timeslot Figure 30. V1−SN/SE: Time Line for Black Line Readout www.onsemi.com 42 TR NOIV1SN1300A, NOIV2SN1300A Figure 31 shows shows the details of the readout of a number of lines for single window readout, at the beginning of the frame. Sequencer Internal State FOT ROT black ROT line Ys+1 ROT line Ys line Ye ROT data channels sync channel Training data channels TR sync channel Training FS ID timeslot Xstart IMG IMG IMG timeslot Xstart + 1 IMG timeslot Xend - 2 IMG IMG timeslot Xend - 1 ID LE CRC timeslot Xend TR CRC timeslot Figure 31. V1−SN/SE: Time Line for Single Window Readout (at the start of a frame) Figure 32 shows the detail of the readout of a number of lines for readout of two overlapping windows. Sequencer Internal State FOT ROT ROT black line Ys ROT ROT line Ys+1 line Ye data channels sync channel data channels sync channel Training Training TR LS IDM IMG IMG LS timeslot XstartM IDN IMG IMG IMG LE timeslot XstartN IDN CRC TR timeslot XendN Figure 32. V1−SN/SE: Time Line Showing the Readout of Two Overlapping Windows active at the same time, the sync channel transmits the frame synchronization codes of the window with highest index only. Frame Synchronization for 10−bit Mode Table 30 shows the structure of the frame synchronization code. Note that the table shows the default data word (configurable) for 10-bit mode. If more than one window is Table 30. FRAME SYNCHRONIZATION CODE DETAILS FOR 10-BIT MODE Sync Word Bit Position Register Address Default Value 9:7 N/A 0x5 Frame start indication 9:7 N/A 0x6 Frame end indication 9:7 N/A 0x1 Line start indication Line end indication 9:7 N/A 0x2 6:0 131[6:0] 0x2A Description These bits indicate that the received sync word is a frame synchronization code. The value is programmable by a register setting www.onsemi.com 43 NOIV1SN1300A, NOIV2SN1300A • Window Identification • Data Classification Codes Frame synchronization codes are always followed by a 3-bit window identification (bits 2:0). This is an integer number, ranging from 0 to 7, indicating the active window. If more than one window is active for the current cycle, the highest window ID is transmitted. For the remaining cycles, the sync channel indicates the type of data sent through the data links: black pixel data (BL), image data (IMG), or training pattern (TR). These codes are programmable by a register setting. The default values are listed in Table 31. Table 31. SYNCHRONIZATION CHANNEL DEFAULT IDENTIFICATION CODE VALUES FOR 10-BIT MODE Sync Word Bit Position Register Address Default Value 9:0 132 [9:0] 0x015 Black pixel data (BL). This data is not part of the image. The black pixel data is used internally to correct channel offsets. 9:0 133 [9:0] 0x035 Valid pixel data (IMG). The data on the data output channels is valid pixel data (part of the image). 9:0 134 [9:0] 0x059 CRC value. The data on the data output channels is the CRC code of the finished image data line. 9:0 135 [9:0] 0x3A6 Training pattern (TR). The sync channel sends out the training pattern which can be programmed by a register setting. Description and not sent out. Table 32 shows the structure of the frame synchronization code, together with the default value, as specified in SPI registers. The same restriction for overlapping windows applies in 8-bit mode. Frame Synchronization in 8-bit Mode The frame synchronization words are configured using the same registers as in 10-bit mode. The two least significant bits of these configuration registers are ignored Table 32. FRAME SYNCHRONIZATION CODE DETAILS FOR 8-BIT MODE Sync Word Bit Position Register Address Default Value 7:5 N/A 0x5 Frame start (FS) indication 7:5 N/A 0x6 Frame end (FE) indication 7:5 N/A 0x1 Line start (LS) indication 7:5 N/A 0x2 Line end (LE) indication 4:0 [6:2] 0x0A Description These bits indicate that the received sync word is a frame synchronization code. The value is programmable by a register setting. • Window Identification • Data Classification Codes Similar to 10-bit operation mode, the frame synchronization codes are followed by a window identification. The window ID is located in bits 4:2 (all other bit positions are ‘0’). The same restriction for overlapping windows applies in 8-bit mode. BL, IMG, CRC, and TR codes are defined by the same registers as in 10-bit mode. Bits 9:2 of the respective configuration registers are used as classification code with default values shown in Table 33. Table 33. SYNCHRONIZATION CHANNEL DEFAULT IDENTIFICATION CODE VALUES FOR 8-BIT MODE Sync Word Bit Position Register Address Default Value 7:0 132 [9:2] 0x05 Black pixel data (BL). This data is not part of the image. The black pixel data is used internally to correct channel offsets. 7:0 133 [9:2] 0x0D Valid pixel data (IMG). The data on the data output channels is valid pixel data (part of the image). 7:0 134 [9:2] 0x16 CRC value. The data on the data output channels is the CRC code of the finished image data line. 7:0 135 [9:2] 0xE9 Training Pattern (TR). The sync channel sends out the training pattern which can be programmed by a register setting. Description www.onsemi.com 44 NOIV1SN1300A, NOIV2SN1300A In 8-bit mode, the training pattern for the data channels is defined by the same register as in 10-bit mode, where the lower two bits are omitted; see Table 35. Training Patterns on Data Channels In 10-bit mode, during idle periods, the data channels transmit training patterns, indicated on the sync channel by a TR code. These training patterns are configurable independent of the training code on the sync channel as shown in Table 34. Table 34. TRAINING CODE ON SYNC CHANNEL IN 10-BIT MODE Sync Word Bit Position Register Address Default Value [9:0] 130 [9:0] 0x3A6 Description Data channel training pattern. The data output channels send out the training pattern, which can be programmed by a register setting. The default value of the training pattern is 0x3A6, which is identical to the training pattern indication code on the sync channel. Table 35. TRAINING PATTERN ON DATA CHANNEL IN 8-BIT MODE Data Word Bit Position Register Address Default Value [7:0] 130 [9:2] 0xE9 Description Data Channel Training Pattern (Training pattern). kernel (kernel [0, 0]) is located in the bottom left corner. The data order of this image data on the data output channels depends on the subsampling mode. Cyclic Redundancy Code At the end of each line, a CRC code is calculated to allow error detection at the receiving end. Each data channel transmits a CRC code to protect the data words sent during the previous cycles. Idle and training patterns are not included in the calculation. The sync channel is not protected. A special character (CRC indication) is transmitted whenever the data channels send their respective CRC code. The polynomial in 10-bit operation mode is x10 + x9 + x6 + x3 + x2 + x + 1. The CRC encoder is seeded at the start of a new line and updated for every (valid) data word received. The CRC seed is configurable using the crc_seed register. When ‘0’, the CRC is seeded by all-‘0’; when ‘1’ it is seeded with all-‘1’. In 8-bit mode, the polynomial is x8 + x6 + x3 + x2 + 1. The CRC seed is configured by means of the crc_seed register. Note The CRC is calculated for every line. This implies that the CRC code can protect lines from multiple windows. kernel (159,1023) pixel array ROI kernel (x_start,y_start) kernel (0,0) 0 1 2 3 5 6 7 Figure 33. Kernel Organization in Pixel Array • V1−SN/SE: No Subsampling The image data is read out in kernels of eight pixels in x-direction by one pixel in y-direction. One data channel output delivers two pixel values of one kernel sequentially. Figure 34 shows how a kernel is read out over the four output channels. For even positioned kernels, the kernels are read out ascending, while for odd positioned kernels the data order is reversed (descending). Data Order To read out the image data through the output channels, the pixel array is organized in kernels. The kernel size is eight pixels in x-direction by one pixel in y-direction. Figure 33 indicates how the kernels are organized. The first www.onsemi.com 45 NOIV1SN1300A, NOIV2SN1300A kernel 12 kernel 13 kernel 14 kernel 15 time LSB MSB 7 7 6 5 4 3 2 1 0 channel #3 6 channel #2 5 channel #0 4 channel #1 3 channel #3 2 channel #2 1 channel #0 0 pixel # (odd kernel) channel #1 pixel # (even kernel) LSB MSB Note: The bit order is always MSB first, regardless the kernel number 10-bit 10-bit Figure 34. V1−SN/SE: Data Output Order when Subsampling is Disabled • V1−SN/SE: Subsampling on Monochrome Sensor pixel positions inside that kernel are read out. Figure 35 shows the data order. Note that there is no difference in data order for even/odd kernel numbers, as opposed to the ‘no-subsampling’ readout. To read out the image data with subsampling enabled on a monochrome sensor, two neighboring kernels are combined to a single kernel of 16 pixels in the x-direction and one pixel in the y-direction. Only the pixels at the even kernel 12 kernel 13 kernel 14 kernel 15 time 2 12 MSB LSB channel #1 MSB 4 10 6 8 channel #3 14 channel #2 0 channel #0 pixel # LSB Note: The bit order is always MSB first, regardless the kernel number 10-bit 10-bit Figure 35. V1−SN/SE: Data Output Order in Subsampling Mode on a Monochrome Sensor • V1−SN/SE: Subsampling on Color Sensor the y-direction. Only the pixels 0, 1, 4, 5, 8, 9, 12, and 13 are read out. Figure 36 shows the data order. Note that there is no difference in data order for even/odd kernel numbers, as opposed to the ‘no-subsampling’ readout. To read out the image data with subsampling enabled on a color sensor, two neighboring kernels are combined to a single kernel of 16 pixels in the x-direction and one pixel in www.onsemi.com 46 NOIV1SN1300A, NOIV2SN1300A kernel 12 kernel 13 kernel 14 kernel 15 time 13 LSB MSB 4 channel #1 12 MSB 5 9 8 channel #3 1 channel #2 0 channel #0 pixel # LSB Note: The bit order is always MSB first, regardless the kernel number 10-bit 10-bit Figure 36. V1−SN/SE: Data Output Order in Subsampling Mode on a Color Sensor V2−SN/SE: CMOS Interface Version The frame_valid indication is asserted at the start of a new frame and remains asserted until the last line of the frame is completely transmitted. The line_valid indication serves the following needs: • While the line_valid indication is asserted, the data channels contain valid pixel data. • The line valid communicates frame timing as it is asserted at the start of each line and it is de-asserted at the end of the line. Low periods indicate the idle time between lines (ROT). • The data channels transmit the calculated CRC code after each line. This can be detected as the data words right after the falling edge of the line valid. CMOS Output Signals The image data output occurs through a single 10-bit parallel CMOS data output, operating at 62 MSps. A CMOS clock output, ‘frame valid’ and ‘line valid’ signal is foreseen to synchronize the output data. No windowing information is sent out by the sensor. 8-bit/10-bit Mode The 8-bit mode is not supported when using the parallel CMOS output interface. Frame Format Frame timing is indicated by means of two signals: frame_valid and line_valid. Sequencer Internal State FOT ROT black ROT line Ys ROT line Ys+1 ROT line Ye FOT ROT black data channels frame_valid line_valid Figure 37. V2−SN/SE: Frame Timing Indication starting at position y0_start. When the line at position y1_start is reached, a number of lines containing data of ‘ROI 0’ and ‘ROI 1’ are sent out, until the line position of y0_end is reached. Then, only data of ‘ROI 1’ appears on the data output until line position y1_end is reached. The line_valid strobe is not shown in Figure 38. The frame format is explained with an example of the readout of two (overlapping) windows as shown in Figure 38 (a). The readout of a frame occurs on a line-by-line basis. The read pointer goes from left to right, bottom to top. Figure 38 (a) and (b) indicate that, after the FOT is finished, a number of lines which include information of ‘ROI 0’ are sent out, www.onsemi.com 47 NOIV1SN1300A, NOIV2SN1300A 1280 pixels 1024 pixels y1_end ROI1 y0_end y1_start ROI0 y0_start x0_start x0_end x1_start x1_end (a) Reset Exposure Time N N Readout Frame N -1 Integration Time Handling Readout Handling FOT ROI1 ROI0 Reset Exposure Time N +1 N+1 Readout Frame N FOT FOT ROI0 ROI1 FOT FOT Frame valid (b) Figure 38. V2−SN/SE: Frame Format to Read Out Image Data Black Lines: Black pixel data is also sent through the data channels. To distinguish these pixels from the regular image data, it is possible to ‘mute’ the frame and/or line valid indications for the black lines. Table 36. BLACK LINE FRAME_VALID AND LINE_VALID SETTINGS bl_frame_valid_enable bl_line_valid_enable 0x1 0x1 The black lines are handled similar to normal image lines. The frame valid indication is asserted before the first black line and the line valid indication is asserted for every valid (black) pixel. 0x1 0x0 The frame valid indication is asserted before the first black line, but the line valid indication is not asserted for the black lines. The line valid indication indicates the valid image pixels only. This mode is useful when one does not use the black pixels and when the frame valid indication needs to be asserted some time before the first image lines (for example, to precondition ISP pipelines). 0x0 0x1 In this mode, the black pixel data is clearly unambiguously indicated by the line valid indication, while the decoding of the real image data is simplified. 0x0 0x0 Black lines are not indicated and frame and line valid strobes remain de-asserted. Note however that the data channels contains the black pixel data and CRC codes (Training patterns are interrupted). Description www.onsemi.com 48 NOIV1SN1300A, NOIV2SN1300A • V2-SN/SE: No Subsampling Data Order To read out the image data through the parallel CMOS output, the pixel array is divided in kernels. The kernel size is eight pixels in x-direction by one pixel in y-direction. Figure 33 on page 45 indicates how the kernels are organized. The data order of this image data on the data output channels depends on the subsampling mode. kernel 12 kernel 13 The image data is read out in kernels of eight pixels in x-direction by one pixel in y-direction. Figure 39 shows the pixel sequence of a kernel which is read out over the single CMOS output channel. The pixel order is different for even and odd kernel positions. kernel 14 kernel 15 time pixel # (even kernel) 0 2 4 6 1 3 pixel # (odd kernel) 5 7 7 5 3 1 6 4 2 0 time Figure 39. V2−SN/SE: Data Output Order without Subsampling • V2−SN/SE: Subsampling On Monochrome Sensor pixel positions inside that kernel are read out. Figure 40 shows the data order Note that there is no difference in data order for even/odd kernel numbers, as opposed to the ‘no-subsampling’ readout. To read out the image data with subsampling enabled on a monochrome sensor, two neighboring kernels are combined to a single kernel of 16 pixels in the x-direction and one pixel in the y-direction. Only the pixels at the even kernel 12 kernel 13 kernel 14 kernel 15 time pixel # 0 2 4 6 14 12 10 8 time Figure 40. V2−SN/SE: Data Output Order with Subsampling on a Monochrome Sensor • V2−SN/SE: Subsampling On Color Sensor the y-direction. Only the pixels 0, 1, 4, 5, 8, 9, 12, and 13 are read out. Figure 41 shows the data order. Note that there is no difference in data order for even/odd kernel numbers, as opposed to the ‘no-subsampling’ readout. To read out the image data with subsampling enabled on a color sensor, two neighboring kernels are combined to a single kernel of 16 pixels in the x-direction and one pixel in kernel 12 kernel 13 kernel 14 kernel 15 time pixel # 0 13 4 9 1 12 5 8 time Figure 41. V2−SN/SE: Data Output Order with Subsampling on a Color Sensor www.onsemi.com 49 NOIV1SN1300A, NOIV2SN1300A REGISTER MAP Table 37. REGISTER MAP Address Offset Address Default (Hex) Default (Dec) chip_id 0x560D 22029 id 0x560D 22029 reserved 0x0000 0 reserved 0x0000 0 chip_configuration 0x0000 0 0x0 0 soft_reset_pll 0x099 153 [3:0] pll_soft_reset 0x9 9 PLL Reset 0x9: Soft Reset State others: Operational [7:4] pll_lock_soft_reset 0x9 9 PLL Lock Detect Reset 0x9: Soft Reset State others: Operational soft_reset_cgen 0x09 9 cgen_soft_reset 0x9 9 0x0999 2457 Bit Field Register Name Description Type Chip ID [Block Offset: 0] 0 0 [15:0] 1 1 [3:0] 2 2 [1:0] RO Chip ID RO Reserved RW Configure as per part #: NOIV1SN1300A-QDC: 0x0 NOIV1SE1300A-QDC: 0x1 NOIV2SN1300A-QDC: 0x2 NOIV2SE1300A-QDC: 0x3 Reset Generator [Block Offset: 8] 0 1 8 9 [3:0] 2 10 soft_reset_analog RW RW Clock Generator Reset 0x9: Soft Reset State others: Operational RW [3:0] mux_soft_reset 0x9 9 Column MUX Reset 0x9: Soft Reset State others: Operational [7:4] afe_soft_reset 0x9 9 AFE Reset 0x9: Soft Reset State others: Operational [11:8] ser_soft_reset 0x9 9 Serializer Reset 0x9: Soft Reset State others: Operational 0x0004 4 PLL [Block Offset: 16] 0 1 16 17 power_down RW [0] pwd_n 0x0 0 PLL Power Down ‘0’ = Power Down, ‘1’ = Operational [1] enable 0x0 0 PLL Enable ‘0’ = disabled, ‘1’ = enabled [2] bypass 0x1 1 PLL Bypass ‘0’ = PLL Active, ‘1’ PLL Bypassed 0x2113 8467 reserved www.onsemi.com 50 RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [15:0] Default (Hex) Default (Dec) reserved 0x2113 8467 config 0x0000 0 clock_in_pwd_n 0x0 0 Power down clock Input reserved 0x0 0 Reserved pll_lock 0x0000 0 0x0 0 reserved 0x2182 8578 reserved 0x2182 8578 Reserved reserved 0x3D2D 15661 Reserved reserved 0x3D2D 15661 Reserved config 0x0004 4 Register Name Description Type Reserved I/O [Block Offset: 20] 0 20 [0] [10:8] RW PLL lock detector [Block Offset: 24] 0 24 [0] 2 26 [14:0] 3 27 [15:0] lock RO PLL Lock Indication RW RW Clock Generator [Block Offset: 32] 0 32 RW [0] enable_analog 0x0 0 Enable analog clocks ‘0’ = disabled, ‘1’ = enabled [1] enable_log 0x0 0 Enable logic clock ‘0’ = disabled, ‘1’ = enabled [2] select_pll 0x1 1 Input Clock Selection ‘0’ = Select LVDS clock input, ‘1’ = Select PLL clock input [3] adc_mode 0x0 0 Set operation mode ‘0’ = 10-bit mode, ‘1’ = 8-bit mode [11:8] reserved 0x0 0 Reserved [14:12] reserved 0x0 0 Reserved config 0x0000 0 enable 0x0 0 0x0000 0 General Logic [Block Offset: 34] 0 34 [0] RW Logic General Enable Configuration ‘0’ = Disable ‘1’ = Enable Image Core [Block Offset: 40] 0 40 image_core_config RW [0] imc_pwd_n 0x0 0 Image Core Power Down ‘0’ = powered down, ‘1’ = powered up [1] mux_pwd_n 0x0 0 Column Multiplexer Power Down ‘0’ = powered down, ‘1’ = powered up [2] colbias_enable 0x0 0 Bias Enable ‘0’ = disabled ‘1’ = enabled www.onsemi.com 51 NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address 1 41 Bit Field Register Name Default (Hex) Default (Dec) image_core_config 0x1B5A 7002 Description Type RW [3:0] dac_ds 0xA 10 Double Slope Reset Level [7:4] dac_ts 0x5 5 Triple Slope Reset Level [10:8] reserved 0x3 3 Reserved [12:11] reserved 0x3 3 Reserved [13] reserved 0x0 0 Reserved [14] reserved 0x0 0 Reserved [15] reserved 0x0 0 Reserved 0x0000 0 0x0 0 0x0000 0 0x0 0 AFE [Block Offset:48] 0 48 power_down [0] pwd_n RW Power down for AFEs (8 columns) ‘0’ = powered down, ‘1’ = powered up Bias [Block Offset: 64] 0 64 power_down [0] 1 65 configuration 0x888B 34955 0x1 1 External Resistor Selection ‘0’ = internal resistor, ‘1’ = external resistor [3:1] reserved 0x5 5 Reserved [7:4] imc_colpc_ibias 0x8 8 Column Precharge ibias Configuration [11:8] imc_colbias_ibias 0x8 8 Column Bias ibias Configuration cp_ibias 0x8 8 Charge Pump Bias afe_bias 0x53C8 21448 [15:12] 3 4 6 Power down bandgap ‘0’ = powered down, ‘1’ = powered up extres [0] 2 pwd_n RW 66 RW RW [3:0] afe_ibias 0x8 8 AFE ibias Configuration [7:4] afe_adc_iref 0xC 12 ADC iref Configuration [14:8] afe_pga_iref 0x53 83 PGA iref Configuration 0x8888 34952 67 mux_bias RW [3:0] mux_25u_stage1 0x8 8 Column Multiplexer Stage 1 Bias Configuration [7:4] mux_25u_stage2 0x8 8 Column Multiplexer Stage 2 Bias Configuration [15:8] reserved 0x88 72 Reserved lvds_bias 0x0088 136 [3:0] lvds_ibias 0x8 8 LVDS Ibias [7:4] lvds_iref 0x8 8 LVDS Iref reserved 0x8888 34952 [11:0] reserved 0x888 2184 [15:2] afe_ref_bias 0x8 8 68 70 www.onsemi.com 52 RW RW Reserved AFE_reference NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field Register Name Default (Hex) Default (Dec) 0x1200 4608 Description Type Charge Pump [Block Offset: 72] 0 72 config RW [0] respd_trans_pwd_n 0x0 0 PD Trans Charge Pump Enable ‘0’ = disabled, ‘1’ = enabled [1] resfd_pwd_n 0x0 0 FD Charge Pump Enable ‘0’ = disabled, ‘1’ = enabled [10:8] respd_trans_trim 0x2 2 PD Trans Charge Pump Trim [14:12] resfd_trim 0x1 1 FD Charge Pump Trim reserved 0x0000 0 reserved 0x000 0 reserved 0x0000 0 reserved 0x0000 0 sensor enable 0x0000 0 0x0 0 0x0000 0 0x00 0 0x0000 0 Reserved [Block Offset: 80] 0 80 [9:0] 1 81 [15:0] RW Reserved RW Reserved Temperature Sensor [Block Offset: 96] 0 96 [0] 1 97 reg_tempd_enable sensor output [7:0] tempd_reg_temp RW Temperature Diode Enable ‘0’ = disabled ‘1’ = enabled RO Temperature Readout Serializer/LVDS [Block Offset: 112] 0 112 power_down RW [0] clock_out_pwd_n 0x0 0 Power down for clock output. ‘0’ =powered down, ‘1’ = powered up [1] sync_pwd_n 0x0 0 Power down for sync channel ‘0’ = powered down, ‘1’ = powered up [2] data_pwd_n 0x0 0 Power down for data channels (4 channels) ‘0’ = powered down, ‘1’ = powered up Data Block [Block Offset: 128] 0 1 128 129 0x4008 16392 [7:0] blackcal black_offset 0x08 8 Desired black level at output [10:8] black_samples 0x0 0 Black pixels taken into account for black calibration. Total samples = 2**black_samples [14:11] reserved 0x8 8 Reserved [15] crc_seed 0x0 0 CRC Seed ‘0’ = All-0 ‘1’ = All-1 0xC001 49153 general_configuration www.onsemi.com 53 RW RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset 2 3 Address Bit Field Register Name Default (Hex) Default (Dec) [0] auto_blackcal_enable 0x1 1 Automatic black calibration is enabled when 1, bypassed when 0 [9:1] blackcal_offset 0x00 0 Black calibration offset used when auto_black_cal_en = ‘0’. [10] blackcal_offset_dec 0x0 0 blackcal_offset is added when 0, subtracted when 1 [11] reserved 0x0 0 Reserved [12] reserved 0x0 0 Reserved [13] 8bit_mode 0x0 0 8bit mode select ‘0’ = 10-bit mode, ‘1’ = 8-bit mode [14] bl_frame_valid_ enable 0x1 1 Assert frame_valid for black lines when ‘1’, gate frame_valid for black lines when ‘0’. V2-SN/SE only [15] bl_line_valid_enable 0x1 1 Assert line_valid for black lines when ‘1’, gate line_valid for black lines when ‘0’. V2-SN/SE only trainingpattern 0x03A6 934 [9:0] trainingpattern 0x3A6 934 [10] reserved 0x0 0 sync_code0 0x002A 42 frame_sync 0x02A 42 sync_code1 0x0015 21 bl 0x015 21 sync_code2 0x0035 53 img 0x035 53 sync_code3 0x0059 89 crc 0x059 89 sync_code4 0x03A6 934 tr 0x3A6 934 blackcal_error0 0x0000 0 blackcal_error[7:0] 0x0000 0 reserved 0x0000 0 130 131 [6:0] 4 132 [9:0] 5 133 [9:0] 6 134 [9:0] 7 135 [9:0] 8 136 [7:0] 9 137 www.onsemi.com 54 Description Type RW Training pattern sent on data channels during idle mode. This data is used to perform word alignment on the LVDS data channels. Reserved RW Frame Sync LSBs. Note The tenth bit indicates frame/line sync code, ninth bit indicates start, eighth bit indicates end. RW Black Pixel Identification Sync Code RW Valid Pixel Identification Sync Code RW CRC Value Identification Sync Code RW Training Value Identification Sync Code RO Black Calibration Error. This flag is set when not enough black samples are available. Black Calibration is not valid. Channels 0-7. RO NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [15:0] 10 138 [15:0] 11 139 12 140 [15:0] [15:0] 13 141 [15:0] Default (Hex) Default (Dec) reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0xFFFF 65535 reserved 0xFFFF 65535 test_configuration Register Name Description Type Reserved RO Reserved RO Reserved RW Reserved RW Reserved Datablock - Test 16 144 17 145 18 146 0x0000 0 [0] testpattern_en 0x0 0 Insert synthesized testpattern when ‘1’ [1] inc_testpattern 0x0 0 Incrementing testpattern when ‘1’, constant testpattern when ‘0’ [2] prbs_en 0x0 0 Insert PRBS when ‘1’ [3] frame_testpattern 0x0 0 Frame test patterns when ‘1’, unframed testpatterns when ‘0’ [4] reserved 0x0 0 Reserved reserved 0x0000 0 0x0100 256 [15:0] 19 20 21 22 0 test_configuration0 RW Reserved RW [7:0] testpattern0_lsb 0x00 0 Testpattern used on datapath #0 when testpattern_en = ‘1’. Note Most significant bits are configured in register 150. [15:8] testpattern1_lsb 0x01 1 Testpattern used on datapath #1 when testpattern_en = ‘1’. Note Most significant bits are configured in register 150. 0x0302 770 147 test_configuration1 RW [7:0] testpattern2_lsb 0x02 2 Testpattern used on datapath #2 when testpattern_en = ‘1’. Note Most significant bits are configured in register 150. [15:8] testpattern3_lsb 0x03 3 Testpattern used on datapath #3 when testpattern_en = ‘1’. Note Most significant bits are configured in register 150. reserved 0x0504 1284 [7:0] reserved 0x04 4 Reserved [15:8] reserved 0x05 5 Reserved 0x0706 1798 148 149 150 reserved RW test_configuration3 RW RW [7:0] reserved 0x06 6 Reserved [15:8] reserved 0x07 7 Reserved 0x0000 0 test_configuration16 www.onsemi.com 55 RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset 26 Address Bit Field Default (Hex) Default (Dec) Description [1:0] testpattern0_msb 0x0 0 Testpattern used when testpattern_en = ‘1’ [3:2] testpattern1_msb 0x0 0 Testpattern used when testpattern_en = ‘1’ [5:4] testpattern2_msb 0x0 0 Testpattern used when testpattern_en = ‘1’ [7:6] testpattern3_msb 0x0 0 Testpattern used when testpattern_en = ‘1’ [9:8] reserved 0x0 0 Reserved [11:10] reserved 0x0 0 Reserved [13:12] reserved 0x0 0 Reserved [15:14] reserved 0x0 0 Reserved reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 reserved 0x0000 0 configuration 0x0010 16 154 [15:0] 27 Register Name 155 [15:0] Type RW Reserved RW Reserved AEC[Block Offset: 160] 0 1 160 [0] enable 0x0 0 AEC Enable [1] restart_filter 0x0 0 Restart AEC filter [2] freeze 0x0 0 Freeze AEC filter and enforcer gains [3] pixel_valid 0x0 0 Use every pixel from channel when 0, every 4th pixel when 1 [4] amp_pri 0x1 1 Stage 1 amplifier gets higher priority than Stage 2 gain distribution if 1. Vice versa if 0 intensity 0x60B8 24760 desired_intensity 0xB8 184 Target average intensity reserved 0x018 24 Reserved red_scale_factor 0x0080 128 red_scale_factor 0x80 128 green1_scale_factor 0x0080 128 green1_scale_factor 0x80 128 green2_scale_factor 0x0080 128 green2_scale_factor 0x80 128 blue_scale_factor 0x0080 128 blue_scale_factor 0x80 128 0x03FF 1023 161 [9:0] [13:10] 2 162 [9:0] 3 163 [9:0] 4 164 [9:0] 5 165 [9:0] 6 166 RW reserved www.onsemi.com 56 RW RW Red scale factor for AEC statistics 3.7 unsigned RW Green1 scale factor for AEC statistics 3.7 unsigned RW Green2 scale factor for AEC statistics 3.7 unsigned RW Blue scale factor for AEC statistics 3.7 unsigned RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [15:0] 7 167 [15:0] 8 168 9 169 [15:0] 10 12 13 14 min_exposure 0x0001 1 min_gain 0x0800 2048 RW Minimum exposure time RW 128 max_exposure 0x03FF 1023 max_exposure 0x03FF 1023 max_gain 0x100D 4109 Minimum digital gain 5.7 unsigned RW Maximum exposure time RW [1:0] max_gain_stage1 0x1 1 Maximum gain stage 1 [3:2] max_gain_stage2 0x3 3 Maximum gain stage 2 [15:4] max_digital_gain 0x100 256 Maximum digital gain 5.7 unsigned reserved 0x0083 131 [7:0] reserved 0x83 131 Reserved [13:8] reserved 0x00 0 Reserved [15:14] reserved 0x0 0 Reserved reserved 0x2824 10276 [7:0] reserved 0x024 36 Reserved [15:8] reserved 0x028 40 Reserved reserved 0x2A96 10902 reserved 0x2A96 10902 reserved 0x0080 128 reserved 0x080 128 reserved 0x0100 256 reserved 0x100 256 reserved 0x0100 256 reserved 0x100 256 reserved 0x0080 128 reserved 0x080 128 reserved 0x00AA 170 reserved 0x0AA 170 reserved 0x0100 256 reserved 0x100 256 reserved 0x0155 341 reserved 0x155 341 total_pixels0 0x0000 0 178 [9:0] 181 [9:0] 184 1 0x080 [9:0] 24 0x0001 min_digital_gain [9:0] 21 min_exposure Reserved [15:4] [9:0] 180 2048 Minimum gain stage 2 [9:0] 20 0x0800 0 175 179 reserved RW 0x0 174 19 2048 min_gain_stage2 [9:0] 18 0x0800 [3:2] 173 177 reserved www.onsemi.com 57 Type Reserved Minimum gain stage 1 172 17 1023 0 171 176 0x03FF 0x0 170 16 reserved Description min_gain_stage1 [15:0] 15 Default (Dec) [1:0] [15:0] 11 Default (Hex) Register Name RW RW RW Reserved RW Reserved RW Reserved RW Reserved RW Reserved RW Reserved RW Reserved RW Reserved RO NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [15:0] 25 185 [2:0] 26 27 186 29 Default (Dec) total_pixels[15:0] 0x0000 0 total_pixels1 0x0000 0 0x0 0 total_pixels[18:16] Description RO Total number of pixels sampled for Average, MSB average_status 0x0000 0 average 0x000 0 AEC Average Status [12] locked 0x0 0 AEC Filter Lock Status exposure_status 0x0000 0 exposure 0x0000 0 gain_status 0x00 0 [1:0] gain_stage1 0x0 0 Gain Stage 1 Status [3:2] gain_stage2 0x0 0 Gain Stage 2 Status [15:4] digital_gain 0x000 0 AEC Digital Gain Status 5.7 unsigned reserved 0x0000 0 reserved 0x000 0 general_configuration 0x00 0 [0] enable 0x0 0 Enable sequencer ‘0’ = Idle, ‘1’ = enabled [1] rolling_shutter_enable 0x0 0 Operation Selection ‘0’ = Global Shutter, ‘1’ = Rolling Shutter [2] reserved 0x0 0 Reserved [3] reserved 0x0 0 Reserved [4] triggered_mode 0x0 0 Triggered Mode Selection (Global Shutter only) ‘0’ = Normal Mode, ‘1’ = Triggered Mode [5] slave_mode 0x0 0 Master/Slave Selection (Global Shutter only) ‘0’ = master, ‘1’ = slave [6] xsm_delay_enable 0x0 0 Insert delay between end of ROT and start of readout if ‘1’. ROT delay is defined by register xsm_delay [7] subsampling 0x0 0 Subsampling mode selection ‘0’ = no subsampling, ‘1’ = subsampling [8] binning 0x0 0 Binning mode selection ‘0’ = no binning, ‘1’ = binning 187 188 189 [12:0] Type Total number of pixels sampled for Average, LSB [9:0] [15:0] 28 Default (Hex) Register Name RO RO AEC Exposure Status RO RO Reserved Sequencer [Block Offset: 192] 0 192 www.onsemi.com 58 RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field 2 3 0 Enable windowing for AEC Statistics. ‘0’ = Subsample all windows ‘1’ = Subsample configured window [13:11] monitor_select 0x0 0 Control of the monitor pins reserved 0x0 0 Reserved 0x0000 0 [7:0] delay_configuration rs_x_length 0x00 0 X-Readout duration in rolling shutter mode (extends lines with dummy pixels). [15:8] xsm_delay 0x00 0 Delay between ROT end and X-readout (only when xsm_delay_enable = ‘1’) integration_control 0x0004 4 [0] dual_slope_enable 0x0 0 Enable Dual Slope (Global mode only) [1] triple_slope_enable 0x0 0 Enable Triple Slope (Global mode only) [2] fr_mode 0x1 1 Representation of fr_length. ‘0’: reset length ‘1’: frame length [9:3] reserved 0x00 0 Reserved 0x0001 1 0x01 1 reserved 0x0000 0 reserved 0x0000 0 black_lines 0x0102 258 black_lines 0x02 2 Number of black lines. Minimum is 1. Range 1 to 255 gate_first_line 0x1 1 Blank out first line ‘0’: No blank-out ‘1’: Blank-out dummy_lines 0x0000 0 dummy_lines 0x000 0 mult_timer 0x0001 1 mult_timer 0x0001 1 fr_length 0x0000 0 195 roi_active0 [7:0] 5 197 [15:0] [7:0] [8] 6 198 [11:0] 7 199 [15:0] 8 200 Description 0x0 194 196 Default (Dec) roi_aec_enable 193 4 Default (Hex) [10] [14] 1 Register Name roi_active[7:0] www.onsemi.com 59 Type RW RW RW Active ROI’s selection RW Reserved RW RW Number of Dummy lines (Rolling Shutter only) Range 0 to 4095 RW Mult Timer (Global Shutter only) Defines granularity (unit = 1/System Clock) of exposure and reset_length RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [15:0] 9 201 [15:0] 10 202 [15:0] 11 203 [15:0] 12 204 13 205 14 206 Default (Hex) Default (Dec) fr_length 0x0000 0 exposure 0x0000 0 exposure 0x0000 0 exposure 0x0000 0 exposure_ds 0x0000 0 exposure 0x0000 0 exposure_ts 0x0000 0 gain_configuration 0x01E2 482 Register Name Description Frame/Reset length (Global Shutter only) Reset length when fr_mode = ‘0’, Frame Length when fr_mode = ‘1’ Granularity defined by mult_timer RW Exposure Time Rolling Shutter: granularity lines Global Shutter: granularity defined by mult_timer RW Exposure Time (Dual Slope) Rolling Shutter: N/A Global Shutter: granularity defined by mult_timer RW Exposure Time (Triple Slope) Rolling Shutter: N/A Global Shutter: granularity defined by mult_timer RW [1:0] gain_stage1 0x02 2 Gain Stage 1 [8:5] gain_stage2 0xF 15 Gain Stage 2 [13] gain_lat_comp 0x0 0 Postpone gain update by 1 frame when ‘1’ to compensate for exposure time updates latency. Gain is applied at start of next frame if ‘0’ 0x0080 128 digital_gain_configuration [11:0] db_gain RW 0x080 128 sync_configuration 0x033F 831 [0] sync_rs_x_length 0x1 1 Update of rs_x_length are not synchronized at start of frame when ‘0’ [1] sync_black_lines 0x1 1 Update of black_lines are not synchronized at start of frame when ‘0’ [2] sync_dummy_lines 0x1 1 Update of dummy_lines are not synchronized at start of frame when ‘0’ [3] sync_exposure 0x1 1 Update of exposure are not synchronized at start of frame when ‘0’ [4] sync_gain 0x1 1 Update of gain settings (gain_sw, afe_gain) are not synchronized at start of frame when ‘0’ www.onsemi.com 60 Type Digital Gain RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset 16 Address Bit Field 1 Update of roi updates (active_roi) are not synchronized at start of frame when ‘0’ [8] blank_roi_switch 0x1 1 Blank first frame after ROI switching [9] blank_subsampling_ss 0x1 1 Blank first frame after subsampling/binning mode switching in global shutter mode (always blanked out in rolling shutter mode) [10] exposure_sync_mode 0x0 0 When ‘0’, exposure configurations are sync’ed at the start of FOT. When ‘1’, exposure configurations sync is disabled (continuously syncing). This mode is only relevant for Triggered Global - master mode, where the exposure configurations are sync’ed at the start of exposure rather than the start of FOT. For all other modes it should be set to ‘0’. Note Sync is still postponed if sync_exposure = ‘0’. mult_timer_status 0x0000 0 mult_timer 0x0000 0 reset_length_status 0x0000 0 reset_length 0x0000 0 exposure_status 0x0000 0 exposure 0x0000 0 exposure_ds_status 0x0000 0 exposure_ds 0x0000 0 exposure_ts_status 0x0000 0 exposure_ts 0x0000 0 gain_status 0x0000 0 [1:0] gain_stage1 0x00 0 Current Stage 1 Gain [8:5] gain_stage2 0x00 0 Current Stage 2 Gain digital_gain_status 0x0000 0 db_gain 208 209 210 211 [15:0] 20 212 [15:0] 21 22 213 214 [11:0] 24 Current Reset Length (not in Slave mode) RO Current Exposure Time (not in Slave mode) RO Current Exposure Time (not in Slave mode) RO Current Exposure Time (not in Slave mode) RO RO 0 Current Digital Gain 0x0 0 Dual Slope Enabled [13] triple_slope 0x0 0 Triple Slope Enabled reserved 0x7F00 32512 reserved 0x7F00 32512 reserved 0x261E 9758 reserved 0x261E 9758 reserved 0x160B 5643 217 218 RO 0x000 [14:0] 26 Mult Timer Status (Master Global Shutter only) dual_slope 216 www.onsemi.com 61 Type RO [12] [14:0] 25 Description 0x1 [15:0] 19 Default (Dec) sync_roi [15:0] 18 Default (Hex) [5] [15:0] 17 Register Name RW Reserved RW Reserved RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Default (Hex) Default (Dec) reserved 0x160B 5643 reserved 0x3E2E 15918 reserved 0x3E2E 15918 reserved 0x6368 25448 reserved 0x6368 25448 reserved 0x3E01 15873 [3:0] reserved 0x1 1 Reserved [7:4] reserved 0x0 0 Reserved [13:8] reserved 0x3E 62 Reserved reserved 0x5EF1 24305 reserved 0x5EF1 24305 reserved 0x6000 24576 reserved 0x6000 24576 reserved 0x0000 0 reserved 0x0000 0 reserved 0xFFFF 65535 reserved 0xFFFF 65535 reserved 0x0422 1058 [4:0] reserved 0x02 2 Reserved [9:5] reserved 0x01 1 Reserved [14:10] reserved 0x01 1 Reserved reserved 0x30F 783 [7:0] reserved 0xF 15 Reserved [15:8] reserved 0x3 3 Reserved reserved 0x0601 1537 [7:0] reserved 0x1 1 Reserved [15:8] reserved 0x6 6 Reserved 0x0000 0 Bit Field [14:0] 27 219 [14:0] 28 220 32 224 [14:0] 33 225 34 226 [15:0] [15:0] 35 227 [15:0] 36 228 58 250 [15:0] 59 60 61 62 251 252 253 roi_aec_configuration0 RW Reserved RW Reserved RW RW Reserved RW Reserved RW Reserved RW Reserved RW RW RW RW 0x00 0 AEC ROI X Start Configuration (used for AEC statistics when roi_aec_enable = ‘1’) [15:8] x_end 0x0 0 AEC ROI X End Configuration (used for AEC statistics when roi_aec_enable = ‘1’) roi_aec_configuration1 0x0000 0 y_start 0x000 0 roi_aec_configuration2 0x0000 0 www.onsemi.com 62 Type Reserved x_start 254 255 Description [7:0] [9:0] 63 Register Name RW AEC ROI Y Start Configuration (used for AEC statistics when roi_aec_enable = ‘1’) RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [9:0] Register Name y_end Default (Hex) Default (Dec) 0x0 0 0x9F00 40704 Description Type AEC ROI Y End Configuration (used for AEC statistics when roi_aec_enable = ‘1’) Sequencer ROI [Block Offset: 256] 0 1 256 roi0_configuration0 [7:0] x_start 0x00 0 ROI 0 X Start Configuration [15:8] x_end 0x9F 159 ROI 0 X End Configuration roi0_configuration1 0x0000 0 y_start 0x000 0 roi0_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi1_configuration0 0x9F00 40704 257 [9:0] 2 258 [9:0] 3 4 259 7 10 RW ROI 1 X Start Configuration [15:8] x_end 0x9F 159 ROI 1 X End Configuration roi1_configuration1 0x0000 0 y_start 0x000 0 roi1_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi2_configuration0 0x9F00 40704 260 261 262 RW ROI 1 Y Start Configuration RW ROI 1 Y End Configuration RW [7:0] x_start 0x00 0 ROI 2 X Start Configuration [15:8] x_end 0x9F 159 ROI 2 X End Configuration roi2_configuration1 0x0000 0 y_start 0x000 0 roi2_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi3_configuration0 0x9F00 40704 263 264 265 266 ROI 0 Y End Configuration 0 [9:0] 9 RW 0x00 [9:0] 8 ROI 0 Y Start Configuration x_start [9:0] 6 RW [7:0] [9:0] 5 RW RW ROI 2 Y Start Configuration RW ROI 2 Y End Configuration RW [7:0] x_start 0x00 0 ROI 3 X Start Configuration [15:8] x_end 0x9F 159 ROI 3 X End Configuration 0x0000 0 roi3_configuration1 www.onsemi.com 63 RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address Bit Field [9:0] 11 267 [9:0] 12 13 268 16 19 22 y_end 0x3FF 1023 roi4_configuration0 RW ROI 3 Y End Configuration ROI 4 X Start Configuration [15:8] x_end 0x9F 159 ROI 4 X End Configuration roi4_configuration1 0x0000 0 y_start 0x000 0 roi4_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi5_configuration0 0x9F00 40704 269 270 271 RW RW ROI 4 Y Start Configuration RW ROI 4 Y End Configuration RW [7:0] x_start 0x00 0 ROI 5 X Start Configuration [15:8] x_end 0x9F 159 ROI 5 X End Configuration roi5_configuration1 0x0000 0 y_start 0x000 0 roi5_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi6_configuration0 0x9F00 40704 272 273 274 RW ROI 5 Y Start Configuration RW ROI 5 Y End Configuration RW [7:0] x_start 0x00 0 ROI 6 X Start Configuration [15:8] x_end 0x9F 159 ROI 6 X End Configuration roi6_configuration1 0x0000 0 y_start 0x000 0 roi6_configuration2 0x03FF 1023 y_end 0x3FF 1023 roi7_configuration0 275 276 277 278 1023 0 [9:0] 21 0x03FF 40704 [9:0] 20 roi3_configuration2 RW ROI 6 Y Start Configuration RW ROI 6 Y End Configuration 0x9F00 40704 [7:0] x_start 0x00 0 ROI 7 X Start Configuration [15:8] x_end 0x9F 159 ROI 7 X End Configuration 0x0000 0 roi7_configuration1 www.onsemi.com 64 Type ROI 3 Y Start Configuration 0x00 [9:0] 18 0 0x9F00 [9:0] 17 0x000 y_start Description x_start [9:0] 15 Default (Dec) [7:0] [9:0] 14 Default (Hex) Register Name RW RW NOIV1SN1300A, NOIV2SN1300A Table 37. REGISTER MAP Address Offset Address [9:0] 23 Default (Hex) Default (Dec) 0x000 0 roi7_configuration2 0x03FF 1023 y_end 0x3FF 1023 Bit Field 279 [9:0] Register Name y_start Description Type ROI 7 Y Start Configuration RW ROI 7 Y End Configuration Reserved [Block Offset: 384] 0 384 reserved [15:0] … … RW reserved Reserved RW … … 127 511 … reserved [15:0] RW reserved Reserved www.onsemi.com 65 NOIV1SN1300A, NOIV2SN1300A PACKAGE INFORMATION Pin List TIA/EIA-644-A Standard and the CMOS I/Os have a 3.3 V signal level. Table 38 and Table 39 show the pin list for both versions. VITA 1300 has two output versions; V1-SN/SE (LVDS) and V2-SN/SE (CMOS). The LVDS I/Os comply to the Table 38. PIN LIST FOR V1-SN/SE LVDS INTERFACE Pack Pin No. Pin Name I/O Type Direction Description 1 vdd_33 Supply 3.3 V Supply 2 mosi CMOS Input SPI Master Out - Slave In 3 miso CMOS Output SPI Master In - Slave Out 4 sck CMOS Input 5 gnd_18 Supply 1.8 V Ground 6 vdd_18 Supply 1.8 V Supply 7 clock_outn LVDS Output LVDS Clock Output (Negative) 8 clock_outp LVDS Output LVDS Clock Output (Positive) 9 doutn0 LVDS Output LVDS Data Output Channel #0 (Negative) 10 doutp0 LVDS Output LVDS Data Output Channel #0 (Positive) 11 doutn1 LVDS Output LVDS Data Output Channel #1 (Negative) 12 doutp1 LVDS Output LVDS Data Output Channel #1 (Positive) 13 doutn2 LVDS Output LVDS Data Output Channel #2 (Negative) 14 doutp2 LVDS Output LVDS Data Output Channel #2 (Positive) 15 doutn3 LVDS Output LVDS Data Output Channel #3 (Negative) 16 doutp3 LVDS Output LVDS Data Output Channel #3 (Positive) 17 syncn LVDS Output LVDS Sync Channel Output (Negative) 18 syncp LVDS Output LVDS Sync Channel Output (Positive) 19 vdd_33 Supply 3.3 V Supply 20 gnd_33 Supply 3.3 V Ground 21 gnd_18 Supply 1.8 V Ground 22 vdd_18 Supply 1.8 V Supply 23 lvds_clock_inn LVDS Input LVDS Clock Input (Negative) 24 lvds_clock_inp LVDS Input LVDS Clock Input (Positive) 25 clk_pll CMOS Input Reference Clock Input for PLL 26 vdd_18 Supply 1.8 V Supply 27 gnd_18 Supply 1.8 V Ground 28 ibias_master Analog 29 vdd_33 Supply 3.3 V Supply 30 gnd_33 Supply 3.3 V Ground 31 vdd_pix Supply Pixel Array Supply 32 gnd_colpc Supply Pixel Array Ground 33 vdd_pix Supply Pixel Array Supply 34 gnd_colpc Supply Pixel Array Ground 35 gnd_33 Supply 3.3 V Ground 36 vdd_33 Supply 3.3 V Supply 37 gnd_colpc Supply Pixel Array Ground I/O SPI Clock Master Bias Reference. Connect with 47k to gnd_33. www.onsemi.com 66 NOIV1SN1300A, NOIV2SN1300A Table 38. PIN LIST FOR V1-SN/SE LVDS INTERFACE Pack Pin No. Pin Name I/O Type Direction Description 38 vdd_pix Supply Pixel Array Supply 39 gnd_colpc Supply Pixel Array Ground 40 vdd_pix Supply Pixel Array Supply 41 trigger0 CMOS Input Trigger Input #0 42 trigger1 CMOS Input Trigger Input #1 43 trigger2 CMOS Input Trigger Input #2 44 monitor0 CMOS Output Monitor Output #0 45 monitor1 CMOS Output Monitor Output #1 46 reset_n CMOS Input Sensor Reset (Active Low) 47 ss_n CMOS Input SPI Slave Select (Active Low) 48 gnd_33 Supply 3.3 V Ground Table 39. PIN LIST FOR V2-SN/SE CMOS INTERFACE Pack Pin No. Pin Name I/O Type Direction Description 1 vdd_33 Supply 3.3 V Supply 2 mosi CMOS Input SPI Master Out - Slave In 3 miso CMOS Output SPI Master In - Slave Out 4 sck CMOS Input 5 gnd_18 Supply 1.8 V Ground 6 vdd_18 Supply 1.8 V Supply 7 dout9 CMOS Output Data Output Bit #9 8 dout8 CMOS Output Data Output Bit #8 9 dout7 CMOS Output Data Output Bit #7 10 dout6 CMOS Output Data Output Bit #6 11 dout5 CMOS Output Data Output Bit #5 12 dout4 CMOS Output Data Output Bit #4 13 dout3 CMOS Output Data Output Bit #3 14 dout2 CMOS Output Data Output Bit #2 15 dout1 CMOS Output Data Output Bit #1 16 dout0 CMOS Output Data Output Bit #0 17 frame_valid CMOS Output Frame Valid Output 18 line_valid CMOS Output Line Valid Output 19 vdd_33 Supply 3.3 V Supply 20 gnd_33 Supply 3.3 V Ground 21 clk_out CMOS Clock output 22 vdd_18 Supply 23 lvds_clock_inn LVDS Input LVDS Clock Input (Negative) 24 lvds_clock_inp LVDS Input LVDS Clock Input (Positive) 25 clk_pll CMOS Input CMOS Clock Input 26 vdd_18 Supply 1.8 V Supply 27 gnd_18 Supply 1.8 V Ground SPI Clock 1.8 V Supply www.onsemi.com 67 NOIV1SN1300A, NOIV2SN1300A Table 39. PIN LIST FOR V2-SN/SE CMOS INTERFACE Pack Pin No. Pin Name I/O Type Direction I/O Description 28 ibias_master Analog Master Bias Reference. Connect with 47k to gnd_33. 29 vdd_33 Supply 3.3 V Supply 30 gnd_33 Supply 3.3 V Ground 31 vdd_pix Supply Pixel Array Supply 32 gnd_colpc Supply Pixel Array Ground 33 vdd_pix Supply Pixel Array Supply 34 gnd_colpc Supply Pixel Array Ground 35 gnd_33 Supply 3.3 V Ground 36 vdd_33 Supply 3.3 V Supply 37 gnd_colpc Supply Pixel Array Ground 38 vdd_pix Supply Pixel Array Supply 39 gnd_colpc Supply Pixel Array Ground 40 vdd_pix Supply Pixel Array Supply 41 trigger0 CMOS Input Trigger Input #0 42 trigger1 CMOS Input Trigger Input #1 43 trigger2 CMOS Input Trigger Input #2 44 monitor0 CMOS Output Monitor Output #0 45 monitor1 CMOS Output Monitor Output #1 46 reset_n CMOS Input Sensor Reset (Active Low) 47 ss_n CMOS Input SPI Slave Select (Active Low) 48 gnd_33 Supply 3.3 V Ground www.onsemi.com 68 NOIV1SN1300A, NOIV2SN1300A Mechanical Specification Parameter Die (Refer to Figure 43 showing Pin 1 reference as left center) Glass Lid Specification Description Die thickness Min Typ Max NA 740 NA Die Size Units mm mm2 8.65 X 7.95 Die center, X offset to the center of package -50 0 50 mm Die center, Y offset to the center of the package -50 0 50 mm Die position, tilt to the Die Attach Plane -1 0 1 deg Die rotation accuracy (referenced to die scribe and lead fingers on package on all four sides) -1 0 1 deg Optical center referenced from the die/package center (X-dir) -179.3 mm Optical center referenced from the die/package center (Y-dir) 1367.1 mm Distance from PCB plane to top of the die surface 1.06 1.26 1.46 mm Distance from top of the die surface to top of the glass lid 0.75 0.95 1.15 mm (-10%) 13.6 X 13.6 (+10%) mm2 Thickness 0.5 0.55 0.6 mm Spectral response range 400 1000 nm 92 % 2000 G 2000 Hz 260 °C XY size Transmission of glass lid (refer to Figure 44) Mechanical Shock JESD22-B104C; Condition G Vibration JESD22-B103B; Condition 1 Mounting Profile Reflow profile according to J-STD-020D.1 Recommended Socket Andon Electronics Corporation http://www.andonelect.com 20 680-48-SM-G10-R14-X Package Drawing GLASS Figure 42. Package Drawing for the 48−pin LCC Package www.onsemi.com 69 NOIV1SN1300A, NOIV2SN1300A • Active Area outer dimensions Optical Center Information The center of the die (CD) is the center of the cavity The center of the die (CD) is exactly at 50% between the outsides of the two outer seal rings The center of the cavity is exactly at 50% between the insides of the finger pads. • Die outer dimensions: ♦ D4 is the reference for the Die (0,0) in mm ♦ D3 is at (7950,0) mm ♦ D2 is at (7950,8650) mm ♦ D3 is at (0,8650) mm A1 is the at (706.9, 3217.7) mm A2 is at (6884.5, 3217.7) mm ♦ A3 is at (6884.5, 8166.5) mm ♦ A4 is at (706.9, 8166.5) mm Center of the Active Area ♦ AA is at (3795.7, 5692.1) mm Center of the Die ♦ CD is at (3975, 4325) mm ♦ ♦ • • Figure 43. Graphical Representation of the Optical Center www.onsemi.com 70 NOIV1SN1300A, NOIV2SN1300A Glass Lid As shown in Figure 44, no infrared attenuating color filter glass is used. A filter must be provided in the optical path when color devices are used (source: http://www.pgo-online.com). The VITA 1300 image sensor uses a glass lid without any coatings. Figure 44 shows the transmission characteristics of the glass lid. Figure 44. Transmission Characteristics of the Glass Lid www.onsemi.com 71 NOIV1SN1300A, NOIV2SN1300A ADDITIONAL REFERENCES AND RESOURCES Application Notes and other resources can be found linked to the product web page at www.onsemi.com. Additional information on this device may also be available in the Image Sensor Portal, accessible within the MyON section of www.onsemi.com. A signed NDA is required to access the Image Sensor Portal – please see your ON Semiconductor sales representative for more information. For quality and reliability information, please download the Quality & Reliability Handbook (HBD851/D) from www.onsemi.com. For information on Standard terms and Conditions of Sale, please download Terms and Conditions document from www.onsemi.com. For information on Return Material Authorization procedures, please refer to the RMA Policy Procedure document from www.onsemi.com. The Product Acceptance Criteria document, which lists criteria to which this device is tested prior to shipment, is available upon request. For information on ESD and cover glass care and cleanliness, please download the Application Note Image Sensor Handling and Best Practices (AN52561/D) from www.onsemi.com. www.onsemi.com 72 NOIV1SN1300A, NOIV2SN1300A SILICON ERRATA VITA 1300 Qualification Status This section describes the erratum for the VITA 1300 family. Details include erratum trigger conditions, scope of impact, available workaround, and silicon revision applicability. Items [1]. Higher Standby current than rated in data sheet Production Silicon VITA 1300 Errata Summary This table defines how the errata applies to the VITA 1300. Part Number Silicon revision VITA 1300 family Production Silicon (same as “ES2”) • PROBLEM DEFINITION Maintain the device in ‘power-off’, ‘idle’ or ‘running’ modes. • FIX STATUS The cause of this problem and its solution have been identified. Silicon fix is planned to correct the deficiency. • COMPLETION DATE Production silicon with Stand-by current fix is planned. In all states except for ‘idle’ and ‘running’ (including ‘reset’) there can be abnormal high power consumption on vdd_33, up to 300mW. • PARAMETERS AFFECTED Power • TRIGGER CONDITION(S) Entering an affected state (reset, low-power standby, standby(1), standby(2)). • SCOPE OF IMPACT High power consumption, not influencing performance when grabbing images. [2]. Rolling shutter mode has first line brighter than the remainder rows in uniform illumination Silicon fix planned • WORKAROUND Higher Standby Current Items Fix Status Part Number Silicon revision VITA 1300 family Production Silicon (same as “ES2”) • SCOPE OF IMPACT Rolling Shutter Mode: First row is brighter in uniform illumination Fix Status No silicon fix planned First 1 to 5 rows may show the blooming effect. Refer to the VITA 1300 Acceptance Criteria Specification for production test criteria. • WORKAROUND Maximum resolution of actual image is 1280 x 1019. • FIX STATUS The cause of this problem has been identified. No silicon fix is planned to correct the deficiency. • COMPLETION DATE Not applicable. • PROBLEM DEFINITION The first line(s) are brighter than the remainder rows in uniform illumination due to blooming. • PARAMETERS AFFECTED Image artifact: Brighter row(s) • TRIGGER CONDITION(S) Artifact observed in rolling shutter mode only. www.onsemi.com 73 NOIV1SN1300A, NOIV2SN1300A ACRONYMS Acronym Description Acronym Description ADC Analog-to-Digital Converter IP Intellectual Property AFE Analog Front End LE Line End BL Black pixel data LS Line Start CDM Charged Device Model LSB least significant bit CDS Correlated Double Sampling LVDS Low-Voltage Differential Signaling CMOS Complementary Metal Oxide Semiconductor MSB most significant bit CRC Cyclic Redundancy Check PGA Programmable Gain Amplifier DAC Digital-to-Analog Converter PLS Parasitic Light Sensitivity DDR Double Data Rate PRBS Pseudo-Random Binary Sequence DNL Differential Non-Llinearity PRNU Photo Response Non-Uniformity DS Double Sampling QE Quantum Efficiency DSNU Dark Signal Non-Uniformity RGB Red-Green-Blue EIA Electronic Industries Alliance RMA Return Material Authorization ESD Electrostatic Discharge rms Root Mean Square FE Frame End ROI Region of Interest FF Fill Factor ROT Row Overhead Time FOT Frame Overhead Time S/H Sample and Hold FPGA Field Programmable Gate Array SNR Signal-to-Noise Ratio FPN Fixed Pattern Noise SPI Serial Peripheral Interface FPS Frame per Second TIA Telecommunications Industry Association FS Frame Start TJ Junction temperature HBM Human Body Model TR Training pattern IMG Image data (regular pixel data) % RH Percent Relative Humidity INL Integral Non-Linearity www.onsemi.com 74 NOIV1SN1300A, NOIV2SN1300A GLOSSARY conversion gain A constant that converts the number of electrons collected by a pixel into the voltage swing of the pixel. Conversion gain = q/C where q is the charge of an electron (1.602E 19 Coulomb) and C is the capacitance of the photodiode or sense node. CDS Correlated double sampling. This is a method for sampling a pixel where the pixel voltage after reset is sampled and subtracted from the voltage after exposure to light. CFA Color filter array. The materials deposited on top of pixels that selectively transmit color. DNL Differential non-linearity (for ADCs) DSNU Dark signal non-uniformity. This parameter characterizes the degree of non-uniformity in dark leakage currents, which can be a major source of fixed pattern noise. fill-factor A parameter that characterizes the optically active percentage of a pixel. In theory, it is the ratio of the actual QE of a pixel divided by the QE of a photodiode of equal area. In practice, it is never measured. INL Integral nonlinearity (for ADCs) IR Infrared. IR light has wavelengths in the approximate range 750 nm to 1 mm. Lux Photometric unit of luminance (at 550 nm, 1lux = 1 lumen/m2 = 1/683 W/m2) pixel noise Variation of pixel signals within a region of interest (ROI). The ROI typically is a rectangular portion of the pixel array and may be limited to a single color plane. photometric units Units for light measurement that take into account human physiology. PLS Parasitic light sensitivity. Parasitic discharge of sampled information in pixels that have storage nodes. PRNU Photo-response non-uniformity. This parameter characterizes the spread in response of pixels, which is a source of FPN under illumination. QE Quantum efficiency. This parameter characterizes the effectiveness of a pixel in capturing photons and converting them into electrons. It is photon wavelength and pixel color dependent. read noise Noise associated with all circuitry that measures and converts the voltage on a sense node or photodiode into an output signal. reset The process by which a pixel photodiode or sense node is cleared of electrons. ”Soft” reset occurs when the reset transistor is operated below the threshold. ”Hard” reset occurs when the reset transistor is operated above threshold. reset noise Noise due to variation in the reset level of a pixel. In 3T pixel designs, this noise has a component (in units of volts) proportionality constant depending on how the pixel is reset (such as hard and soft). In 4T pixel designs, reset noise can be removed with CDS. responsivity The standard measure of photodiode performance (regardless of whether it is in an imager or not). Units are typically A/W and are dependent on the incident light wavelength. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. ROI Region of interest. The area within a pixel array chosen to characterize noise, signal, crosstalk, and so on. The ROI can be the entire array or a small subsection; it can be confined to a single color plane. sense node In 4T pixel designs, a capacitor used to convert charge into voltage. In 3T pixel designs it is the photodiode itself. sensitivity A measure of pixel performance that characterizes the rise of the photodiode or sense node signal in Volts upon illumination with light. Units are typically V/(W/m2)/sec and are dependent on the incident light wavelength. Sensitivity measurements are often taken with 550 nm incident light. At this wavelength, 1 683 lux is equal to 1 W/m2; the units of sensitivity are quoted in V/lux/sec. Note that responsivity and sensitivity are used interchangeably in image sensor characterization literature so it is best to check the units. spectral response The photon wavelength dependence of sensitivity or responsivity. SNR Signal-to-noise ratio. This number characterizes the ratio of the fundamental signal to the noise spectrum up to half the Nyquist frequency. temporal noise Noise that varies from frame to frame. In a video stream, temporal noise is visible as twinkling pixels. www.onsemi.com 75 NOIV1SN1300A, NOIV2SN1300A ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ◊ N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 www.onsemi.com 76 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NOIV1SN1300A/D