NOM02B4-DR11G

DATA SHEET www.onsemi.com 200DPI Contact Image Sensor Module with Binary Output NOM02B4-DR11G Description = Year = Month = Serial Number = Pb−Free Package CP+ THR SP+ VDD DVOUT+ 13 11 9 7 5 3 1 14 12 10 8 6 4 2 GND − SP− GND − DVOUT− CONNECTOR PIN ASSIGNMENT CP− − Applications YY MM SSSSSS G VLED Light Source, Lens and Sensor are Integrated Into a Single Module 256 mm Scanning Width at 8 dots per mm Resolution 410 msec/Line Scanning Speed @ 5.0 MHz Pixel Rate Two−Level Tracking Digital Output Differential LVDS Input and Output Signals Supports B4 Paper Size at up to 52 Pages per Minute Red LED Light Source Wide Dynamic Range, Low Power Compact 272.0 mm x 24.3 mm x 21.5 mm Module Housing Light Weight 2.4 oz Packaging These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant NOM02B4−DR11G YYMMSSSSSS GLED • • • • • • • • • • • MARKING DIAGRAM VLED Features IMAGE SENSOR MODULE B4 CASE MODAJ GLED The NOM02B4−DR11G contact image sensor (CIS) module integrates a red LED light source, lens and image sensor in a compact housing. The module is designed for document scanning, mark reading, gaming and office automation equipment applications and is suitable for scanning documents up to 256 mm wide with a scanning rate of 410 msec/line. The analog output signal is processed by a digitizing comparator referenced to an externally supplied voltage level to produce a serial digital output. The NOM02B4−DR11G module employs proprietary CMOS image sensing technology from onsemi to achieve high−speed performance and high sensitivity. • Mark Readers Including Balloting, Test Scoring and Gaming Machines ORDERING INFORMATION • Document Scanning • Office Automation Equipment Contact Image Sensor Module FIFO Buffer See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Parallel Port Transceiver LED Drivers Paper Insertion Sensing Switch Scan System Timing and Control Motor Motor Controller and Driver Figure 1. Typical Scanner Application © Semiconductor Components Industries, LLC, 2012 August, 2021 − Rev. 2 1 Publication Order Number: NOM02B4−DR11G/D NOM02B4−DR11G Table 1. ORDERING INFORMATION Part Number NOM02B4−DR11G Package Shipping Configuration (Pb−Free) 100 per packing carton Red LED Light Bar VLED GLED VDD Rod Lens GND Photo Sensor Array SP+ SP− Buf CP+ CP− Buf 1 2 3 4 2048 Shift Register THR Pixel 1 corresponds to connector end of the module Figure 2. Simplified Block Diagram Table 2. PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 DVOUT+ Digital Video Output (+) 2 DVOUT− Digital Video Output (−) 3 VDD +5 V power supply 4 GND Ground 5 SP+ Shift register start pulse (+) 6 SP− Shift register start pulse (−) 7 THR Reference voltage input 8 GND Ground 9 CP+ Sampling clock pulse (+) 10 CP− Sampling clock pulse (−) 11 VLED Power supply for the LED light source 12 GLED Ground for the LED light source 13 VLED Power supply for the LED light source 14 GLED Ground for the LED light source www.onsemi.com 2 Comparator DVOUT+ DVOUT− NOM02B4−DR11G Table 3. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Value Unit VDD 7 V VLED 6 V Power supply current ILED 980 mA Input voltage range for SP±, CP± Vin −0.5 to VDD + 0.5 V Vin_thr 0 to VDD V Storage Temperature TSTG −20 to 75 °C Storage Humidity, Non−Condensing HSTG 10 to 90 % ESDHBM $2 kV Power supply voltage Input voltage range for THR ESD Capability, Contact Discharge (Note 1) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. This module assembly has been ESD tested to IEC61000−4−2 (HBM) Contact Discharge Table 4. RECOMMENDED OPERATING RANGES (Unless otherwise specified, these specifications apply TA = 25°C) (Note 2) Parameter Power supply voltage (Note 3) Power supply current Low level input voltage for SP±, CP± High level input voltage for SP±, CP± Min Typ Max Unit VDD 4.5 5 5.5 V VLED 4.5 5 5.5 V IDD 86 96 106 mA ILED 630 650 670 mA VIL 0 0 0.8 V VIH 4.5 5.0 VDD + 0.3 V Threshold voltage level VTHR 1.2 1.75 2.3 V Low level output voltage (digital output level for dark) VOL 0.8 V High level output voltage (digital output level for white) VOH 4.0 V Line scanning rate (Note 4) Tint 372 410 1024 ms f 2.0 5.0 5.5 MHz Clock period to 182 200 500 ns Clock pulse width (Note 6) tw 46 50 125 ns Clock pulse high duty cycle DCCP 20 25 75 % twSP 150 180 480 ns Start pulse setup time tsu 20 ns Start pulse hold time th 20 ns Clock frequency (Note 5) Start pulse width (Note 6) 2. 3. 4. 5. 6. 7. Symbol Prohibit crossing time (Note 7) tprh 20 ns Clock to Video output propagation delay rising tpcor 115 ns Clock to Video output propagation delay falling tpcof 20 ns Operating Temperature Top 0 50 °C Operating Humidity, Non−Condensing Hop 10 60 % Refer to Figure 3 for more information on AC characteristics VLED directly affects illumination intensity, which directly affects DVOUT. Tint is the line scanning rate or integration time. Tint is determined by the interval between two start pulses. The clock is proportional to Tint. Main clock frequency (f) corresponds to the video sampling frequency. Min, Typ, Max specifications reflect operation at the corresponding Min, Typ, Max clock frequency. Prohibit crossing time is to insure that two start pulses are not supplied in the same scan line time. SP may only be active high during one falling edge of CP for any given scan. www.onsemi.com 3 NOM02B4−DR11G Table 5. PHYSICAL SPECIFICATIONS Symbol Typ Unit Scan width Parameter PDw 256 mm Number of Photo Detector Arrays PDAn 32 arrays PDn 2048 elements Number of Photo Detectors Table 6. PHYSICAL CHARACTERISTICS Parameter Pixel pitch Symbol Min PDsp Typ Max 125 Unit mm Inter−array spacing PDAsp 150 180 210 mm Inter−array vertical alignment PDAvxp −40 0 40 mm lp 634 644 nm Red LED peak wavelength Table 7. ELECTRO−OPTICAL CHARACTERISTICS TEST CONDITIONS Parameter Symbol Value Unit VDD 5.0 V VSS −5.0 V VLED 5.0 V f 5.0 MHz DCCP 25 % Line scanning rate Tint 410 ms Operating Temperature Top 25 °C Power supply voltage Clock frequency Clock pulse high duty cycle www.onsemi.com 4 NOM02B4−DR11G Table 8. ELECTRO−OPTICAL CHARACTERISTICS (Unless otherwise specified, these specifications were achieved with the test conditions defined in Table 7) Symbol Parameter Min Typ Max 1.0 1.2 V 30 % % Bright analog output voltage (Note 8) Vpavg 0.8 Bright output non−uniformity (Note 9) Up −30 Unit Bright output non−uniformity total (Note 10) Uptotal 60 Adjacent pixel non−uniformity (Note 11) Upadj 25 % Vd 1500 mV 60 mV Dark output voltage (Note 12) Dark non−uniformity (Note 13) Ud Modulation transfer function at 50 line pairs per in (lp/in) (Note 14) MTF50 40 % Modulation transfer function at 100 line pairs per in (lp/in) (Notes 14, 15) MTF100 20 % 8. Vpavg = Ȍ Vp(n)/2048, where Vp is the pixel amplitude value for a bright signal defined as a white document with LEDs turned on, n is the sequential pixel number in one scan line. 9. Up = [(Vpmax – Vpavg)/Vpavg] x 100%, or [Vpavg – Vpmin)/Vpavg] x 100%, whichever is greater, where Vpmax is the maximum pixel voltage of any pixel at full bright Vpmin is the minimum pixel voltage of any pixel at full bright 10. Uptotal = [(Vpmax – Vpmin)/Vpavg] x 100%, 11. Upadj = MAX [ | (Vp(n) – Vp(n+1) | / Vp(n)] x 100%, where Upadj is the nonuniformity in percent between adjacent pixels for a bright background 12. Vd is the pixel amplitude value for a dark signal defined as a black document with LEDs turned off 13. Ud = Vdmax – Vdmin, where Vdmax is the maximum pixel voltage of any dark pixel with the LEDs turned off Vdmin is the minimum pixel voltage of any dark pixel with the LEDs turned off 14. MTF = [(Vmax – Vmin)/(Vmax + Vmin)] x 100%, where Vmax is the maximum output voltage at the specified line pairs per inch (lp/in) Vmin is the minimum output voltage at the specified lp/in 15. For information only. to tw CP tprh tprh th SP tsu tpcof twSP Vd VOUT GND Vp tpcor Pixel 1 Pixel 2 Figure 3. Timing Diagram www.onsemi.com 5 Pixel 3 Pixel 4 NOM02B4−DR11G DESCRIPTION OF OPERATION be digitized is fed into the scanner where a sensor detects its The NOM02B4−DR11G module consists of 32 contact presence. The scanner then operates the motor to move the image sensors, each with 64 pixel elements, that are paper under the contact image sensor module. The module cascaded to provide 2048 photo−detectors with their illuminates the paper with internal LEDs and the image associated multiplex switches and double−buffered digital sensor pixel array detects the amount of reflected light and shift register that controls its sequential readout. The analog simultaneously measures a full line of pixels which are pixel signal is proportional to the exposure on the sampled and transferred to a FIFO for storage and corresponding picture elements on the document. A conversion to a parallel output format. Once the pixel line is comparator digitizes the analog pixels into a serial binary bit processed, the motor advances the paper and the next scan stream as each pixel is compared to the external reference line is captured. voltage THR as shown in Figure 2. In operation, the sensor module produces a binary one for each pixel with a voltage Initialization above THR and a binary zero for each pixel with a voltage below THR. The DVOUT signal outputs 2048 pixels for Document no each scan line. The first bit shifted out from DVOUT during Detected? each scan represents the first pixel on the connector end of the module. A pictorial of the NOM02B4−DR11G cross section view Start Scan is shown in Figure 4. Mounted in the module is a one−to−one SP= , CP= CTR=0 graded−index micro lens array that focuses the scanned document image onto the sensing plane. Illumination is CP= accomplished by means of an integrated LED light source. All components are housed in a small plastic housing, which Read Pixel into Memory has a glass cover. The top surface of the glass acts as the focal point for the object being scanned and protects the imaging no CTR++ == 2048 array, micro lens assembly and LED light source from dust. Functional Description Glass Window Document Surface Transfer Scan Line Data Light Path Rod Lens Module Housing Document Detected? LED Bar yes Done Sensors Figure 5. Typical Scanner Algorithm PCB Figure 4. Module Cross Section View Figure 5 outlines the basic steps in the scanner control sequence. First the circuits are initialized and the scanner waits for a document to be detected, usually by a paper sensing switch. Then a start pulse and clock pulse are supplied to capture a line image. At the next clock pulse the first pixel value appears on the output. The pixel can be stored in a local line buffer memory. Subsequent clocks cause the remaining pixels to be shifted out and stored in the line buffer. Once the complete line has been shifted out it can be transferred to the host application and the system advances the paper and the line scan process repeats until the paper sensing switch indicates the document has passed completely through the scanner. Digital Video Output The NOM02B4−DR11G module only presents a digital output, however module performance is best understood by analyzing the analog nature of the internal circuitry. Characterization of the analog signal is presented in Table 4. Connector Pin Out Description Connections to the module are via a 9.14x25.40mm 14−pin connector (AMP part number 103308−2) located at one end of the module as shown in the package drawing. The location of pin number 1 is indicated on the package drawing. Scanner Applications A typical use of the NOM02B4−DR11G module in scanner applications is shown in Figure 6. The document to www.onsemi.com 6 NOM02B4−DR11G Device Marking and Barcode Description where Each module is marked with a tag that contains the part number, a number combining the manufacturing date code and serial number and a barcode. The barcode presents the date code and serial number in Interleave 2 of 5 barcode format as follows YYMMSSSSSS YY is the year, MM is the month, and SSSSSS is the serial number. Glass Lens Care Precautions should be taken to avoid scratching or touching the glass lens. The glass lens may be cleaned with alcohol. Figure 6. Typical Scanner Assembly www.onsemi.com 7 NOM02B4−DR11G PACKING DIMENSIONS NO. NAME MATERIAL 1 Shockproof Pad EPE 2 Packing Tray POLYFOAM 3 Conduct Electricity Sheet PE + CONDUCTIVE SHEET 4 Waterproof Bag PE 5 Packing Box−Carton KRAFT PAPER www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS IMAGE SENSOR MODULE CASE MODAJ ISSUE O MILLIMETERS DIM MIN MAX A 12.60 13.20 A1 5.63 5.93 A2 1.90 2.10 A3 5.98 6.18 A4 21.45 REF B 17.70 18.30 B1 24.32 REF B2 5.50 6.50 B3 15.85 16.15 B4 13.85 14.15 C 15.35 15.65 D 271.50 272.50 D1 256.00 REF E 2.05 2.35 F 1.51 REF H 16.00 REF J 2.00 REF K 7.00 9.00 L 6.80 REF DATE 18 MAY 2010 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEADING EDGE OF THE APPROACH ANGLE ON THE GLASS IS LOWER THAN THE TOP OF THE HOUSING. 4. BORE DEPTH IS 6.0. 5. CONNECTOR, AMP MODEL NUMBER 103308−2, 2X7 PIN, PITCH 2.54. 6. GLASS IS GLUED ON ALL 4 SIDES. 7. GLASS THICKNESS IS 1.85. 8. USE M2.3 SELF TAPPING SCREWS FOR MOUNTING. TORQUE SCREWS BETWEEN 1.80 KGF−CM AND 2.00 KGF−CM. 9. DIMENSION D1 DENOTES THE SCAN LENGTH. 10. DIMENSION K DENOTES THE POSITION OF THE FIRST PIXEL. DOCUMENT NUMBER: STATUS: NEW STANDARD: 98AON51324E ON SEMICONDUCTOR STANDARD http://onsemi.com IMAGE SENSOR MODULE MODAJ 1 © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON51324E PAGE 2 OF 2 ISSUE O REVISION RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE. DATE 18 MAY 2010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2010 May, 2010 − Rev. O Case Outline Number: MODAJ onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. 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All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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