Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
MBRS240LT3G,
NRVBS240LT3G,
NRVBS240LN
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These devices employ the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 40 VOLTS
Features
•
•
•
•
•
•
•
Compact Package with J−Bend Leads Ideal for Automated Handling
Highly Stable Oxide Passivated Junction
Guard−Ring for Overvoltage Protection
Low Forward Voltage Drop
ESD Ratings:
♦ Human Body Model = 3B (> 16000 V)
♦ Machine Model = C (> 400 V)
NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
These are Pb−Free Devices
Mechanical Characteristics
•
•
•
•
•
•
Case: Molded Epoxy
Epoxy Meets UL 94 V−0 @ 0.125 in
Weight: 95 mg (Approximately)
Cathode Polarity Band
Maximum Temperature of 260°C/10 Seconds for Soldering
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
SMB
CASE 403A
MARKING DIAGRAM
AYWW
2BL4G
G
2BL4
A
Y
WW
G
= Specific Device Code
= Assembly Location**
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
**The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package bottom (molding ejecter pin),
the front side assembly code may be blank.
ORDERING INFORMATION
Package
Shipping†
MBRS240LT3G
SMB
(Pb−Free)
2,500 /
Tape & Reel
NRVBS240LT3G*
SMB
(Pb−Free)
2,500 /
Tape & Reel
NRVBS240LNT3G*
SMB
(Pb−Free)
2,500 /
Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
January, 2020 − Rev. 9
1
Publication Order Number:
MBRS240LT3/D
MBRS240LT3G, NRVBS240LT3G, NRVBS240LN
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(At Rated VR, TC = 100°C)
Symbol
Value
Unit
VRRM
VRWM
VR
40
V
IO
Peak Repetitive Forward Current
(At Rated VR, Square Wave, 20 kHz, TC = 105°C)
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change
(Rated VR, TJ = 25°C)
2.0
4.0
25
A
A
A
Tstg, TC
−55 to +150
°C
TJ
−55 to +150
°C
dv/dt
10,000
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
Symbol
Value
Unit
RqJL
RqJA
18
78
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
see Figure 2
(IF = 2.0 A)
(IF = 4.0 A)
VF
Maximum Instantaneous Reverse Current (Note 3)
see Figure 4
(VR = 40 V)
(VR = 20 V)
IR
Value
Unit
TJ = 25°C
TJ = 125°C
0.43
0.54
0.375
0.55
TJ = 25°C
TJ = 100°C
2.0
0.5
60
40
V
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
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2
MBRS240LT3G, NRVBS240LT3G, NRVBS240LN
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
10
1
TJ = 125°C
25°C
85°C
-40°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
TJ = 125°C
85°C 25°C
-40°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
0.8
100E-3
IR , MAXIMUM REVERSE CURRENT (AMPS)
IR , REVERSE CURRENT (AMPS)
1
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
100E-3
TJ = 125°C
10E-3
85°C
1.0E-3
100°C
10E-3
1.0E-3
25°C
100E-6
100E-6
25°C
10E-6
10
10E-6
0
10
20
30
40
0
10
20
30
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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3
40
MBRS240LT3G, NRVBS240LT3G, NRVBS240LN
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO , AVERAGE FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
3.5
3.0
Freq = 20 kHz
RqJL = 18°C/W
dc
2.5
2.0
SQUARE WAVE
1.5
1.0
0.5
0
100
110
130
120
140
1.6
dc
1.4
SQUARE WAVE
Ipk/Io = p
1.2
Ipk/Io = 5.0
1.0
Ipk/Io = 10
0.8
Ipk/Io = 20
0.6
0.4
0.2
0
0
150
0.5
1.0
2.0
1.5
2.5
3.0
TL, LEAD TEMPERATURE (°C)
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
Figure 6. Forward Power Dissipation
3.5
1000
1000
SURGE CURRENT (AMPS)
C, CAPACITANCE (pF)
TJ = 25°C
100
10
100
1.0
R T, TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0
1.0E+00
1.0E-01
1.0E-02
5.0
10
15
20
25
30
35
10
40
10
1.0
100
1000
VR, REVERSE VOLTAGE (VOLTS)
PULSE WIDTH (mSEC)
Figure 7. Capacitance
Figure 8. Maximum Non−Repetitive
Forward Surge Current
10000
50%
20%
10%
5.0%
2.0%
1.0%
1.0E-03
Rtjl(t) = Rtjl*r(t)
1.0E-04
0.00001
0.0001
0.001
0.01
0.1
t, TIME (s)
Figure 9. Thermal Response
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4
1.0
10
100
1000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
SCALE 1:1
DATE 19 JUL 2012
SCALE 1:1
Polarity Band
Non−Polarity Band
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
GENERIC
MARKING DIAGRAM*
A1
SOLDERING FOOTPRINT*
2.261
0.089
AYWW
XXXXXG
G
AYWW
XXXXXG
G
Polarity Band
Non−Polarity Band
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
2.743
0.108
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42669B
SMB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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