Trench-based Schottky
Rectifier, Low Forward
Voltage, Low Leakage
NRVTSS5100E,
NRVTSAF5100E
www.onsemi.com
Features
• Fine Lithography Trench−based Schottky Technology for Very Low
•
•
•
•
•
•
Forward Voltage and Low Leakage
Fast Switching with Exceptional Temperature Stability
Low Power Loss and Lower Operating Temperature
Higher Efficiency for Achieving Regulatory Compliance
High Surge Capability
NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These are Pb−Free and Halide−Free Devices
SCHOTTKY BARRIER
RECTIFIERS
5 AMPERES
100 VOLTS
MARKING
DIAGRAMS
SMB
CASE 403A
AYWW
TE51G
G
SMA−FL
CASE 403AA
STYLE 6
E51
AYWWG
Typical Applications
• Switching Power Supplies including Wireless, Smartphone and
•
•
•
•
•
Notebook Adapters
High Frequency and DC−DC Converters
Freewheeling and OR−ing diodes
Reverse Battery Protection
Instrumentation
LED Lighting
A
Y
WW
G
Mechanical Characteristics:
•
•
•
•
•
Case: Epoxy, Molded
Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in.
Lead Finish: 100% Matte Sn (Tin)
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NRVTSS5100ET3G
SMB
(Pb−Free)
2500 /
Tape & Reel
NRVTSAF5100ET3G
SMA−FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
November, 2019 − Rev. 3
1
Publication Order Number:
NRVTSS5100E/D
NRVTSS5100E, NRVTSAF5100E
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
V
100
Average Rectified Forward Current
(TL = 100°C)
IF(AV)
5.0
A
Peak Repetitive Forward Current,
(Square Wave, 20 kHz, TL = 83°C)
IFRM
10
A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
IFSM
50
A
Storage Temperature Range
Tstg
−65 to +175
°C
Operating Junction Temperature
TJ
−55 to +175
°C
ESD Rating (Human Body Model)
1B
ESD Rating (Machine Model)
M3
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Maximum Thermal Resistance, Steady State (Note 1)
(NRVTSAF5100E)
Junction−to−Lead
RθJL
Junction−to−Ambient
RθJA
90
Junction−to−Lead
RθJL
13.1
Junction−to−Ambient
RθJA
71.1
(NRVTSS5100E)
1. Assumes 600
mm2
°C/W
25
1 oz. copper bond pad, on a FR4 board
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Instantaneous Forward Voltage (Note 2)
(iF = 3.0 A, TJ = 25°C)
(iF = 5.0 A, TJ = 25°C)
vF
(iF = 3.0 A, TJ = 125°C)
(iF = 5.0 A, TJ = 125°C)
Reverse Current (Note 2)
(Rated dc Voltage, TJ = 25°C)
(Rated dc Voltage, TJ = 125°C)
iR
Diode Capacitance
(Rated dc Voltage, TJ = 25°C, f = 1 MHz)
Cd
Typ
Max
0.56
0.65
−
0.69
0.50
0.56
−
0.62
2.6
2.2
29
5
Unit
V
mA
mA
pF
54.4
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
www.onsemi.com
2
NRVTSS5100E, NRVTSAF5100E
TYPICAL CHARACTERISTICS
100
iF, INSTANTANEOUS FORWARD
CURRENT (A)
TA = 175°C
TA = 150°C
10
TA = 25°C
TA = 125°C
TA = 85°C
1
TA = −55°C
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1 1.2
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E−01
TA = 175°C
1.E−04
TA = 85°C
TA = 175°C
TA = 150°C
1.E−02
TA = 150°C
TA = 125°C
TA = 125°C
1.E−03
TA = 85°C
1.E−04
1.E−05
1.E−05
1.E−06
20
30
40
50
60
TA = 25°C
1.E−06
TA = 25°C
70
80
90
100
1.E−07
10
20
30
40
50
60
70
80
90 100
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
VR, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
C, JUNCTION CAPACITANCE (pF)
TA = −55°C
Figure 1. Typical Instantaneous Forward
Characteristics
1.E−03
TJ = 25°C
100
0.1
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E−02
10
TA = 85°C
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
1.E−01
1.E−07
10
TA = 25°C
TA = 125°C
0.1
1.1
TA = 175°C
TA = 150°C
10
IR, INSTANTANEOUS REVERSE CURRENT (A)
IR, INSTANTANEOUS REVERSE CURRENT (A)
0.1
0.1
IF(AV), AVERAGE FORWARD CURRENT (A)
iF, INSTANTANEOUS FORWARD
CURRENT (A)
100
1
10
100
9
DC
8
7
6
Square Wave
5
4
3
2
1
0
RqJL = 13.1°C/W
0
20
40
60
80
100
120
140
160
VR, REVERSE VOLTAGE (V)
TL, LEAD TEMPERATURE (°C)
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating per Diode for
NRVTSS5100E
www.onsemi.com
3
NRVTSS5100E, NRVTSAF5100E
9
RqJL = 24.4°C/W
DC
8
7
6
Square Wave
5
4
3
2
1
18
PF(AV), AVERAGE FORWARD
POWER DISSIPATION (W)
IF(AV), AVERAGE FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
12
10
0
20
40
60
80
100 120 140
TL, LEAD TEMPERATURE (°C)
IPK/IAV = 10
14
160
IPK/IAV = 5
8
Square Wave
6
4
2
0
0
IPK/IAV
= 20
16
DC
0
1
2
3
4
5
6
IF(AV), AVERAGE FORWARD CURRENT (A)
7
Figure 8. Forward Power Dissipation
Figure 7. Current Derating per Diode for
NRVTSAF5100E
1000
R(t), (°C/W)
100
50% Duty Cycle
20%
10%
5%
10
2%
1%
1
0.1
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t, PULSE TIME (S)
Figure 9. Transient Thermal Response, Junction−to−Ambient, for
NRVTSS5100E
100
50% Duty Cycle
20%
R(t), (°C/W)
10
10%
5%
2%
1
0.1
0.0000001
1%
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
t, PULSE TIME (S)
Figure 10. Transient Thermal Response, Junction−to−Ambient, for
NRVTSAF5100E
www.onsemi.com
4
100
1000
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
SCALE 1:1
DATE 19 JUL 2012
SCALE 1:1
Polarity Band
Non−Polarity Band
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
E
b
DIM
A
A1
b
c
D
E
HE
L
L1
D
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
L
L1
c
MIN
1.95
0.05
1.96
0.15
3.30
4.06
5.21
0.76
MILLIMETERS
NOM
MAX
2.30
2.47
0.10
0.20
2.03
2.20
0.23
0.31
3.56
3.95
4.32
4.60
5.44
5.60
1.02
1.60
0.51 REF
MIN
0.077
0.002
0.077
0.006
0.130
0.160
0.205
0.030
INCHES
NOM
0.091
0.004
0.080
0.009
0.140
0.170
0.214
0.040
0.020 REF
MAX
0.097
0.008
0.087
0.012
0.156
0.181
0.220
0.063
GENERIC
MARKING DIAGRAM*
A1
SOLDERING FOOTPRINT*
2.261
0.089
AYWW
XXXXXG
G
AYWW
XXXXXG
G
Polarity Band
Non−Polarity Band
XXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
2.743
0.108
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.159
0.085
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB42669B
SMB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMA−FL
CASE 403AA−01
ISSUE O
DATE 02 MAR 2011
SCALE 2:1
E
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
D
DIM
A
b
c
D
E
E1
L
TOP VIEW
A
c
2X
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.90
1.10
1.25
1.65
0.15
0.30
2.40
2.80
4.80
5.40
4.00
4.60
0.70
1.10
SEATING
PLANE
b
2X
L
BOTTOM VIEW
RECOMMENDED
SOLDER FOOTPRINT*
5.56
1.76
1.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON55210E
SMA−FL
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
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