NSR0140M2T5G Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed switching applications, circuit protection, and voltage clamping. Extremely low forward voltage reduces conduction loss. Miniature surface mount package is excellent for hand−held and portable applications where space is limited.
Features
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• • • • •
Extremely Fast Switching Speed Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1.0 mAdc Low Reverse Current Lead−Free Plating Pb−Free Package is Available
40 V SCHOTTKY BARRIER DIODE
1 CATHODE
2 ANODE
2
MAXIMUM RATINGS
Rating Peak Reverse Voltage Reverse Voltage Forward Continuous Current (DC) Peak Forward Surge Current Symbol VRM VR IF IFSM Value 40 30 30 500 Unit V V mA mA 1 SOD−723 CASE 509AA PLASTIC 1
MARKING DIAGRAM
7E MG G
2
ESD Rating: Class 1C per Human Body Model Class A per Machine Model Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
7E = Specific Device Code M = Month Code G = Pb−Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package SOD−723 Shipping † 2 mm Pitch 8000/Tape & Reel
THERMAL CHARACTERISTICS
Characteristic Total Device Dissipation FR−5 Board, (Note 1) TA = 25°C Derate above 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range 1. FR−5 Minimum Pad. Symbol PD Max 100 1.0 RqJA TJ, Tstg 1000 −55 to +125 Unit mW mW/°C °C/W °C
NSR0140M2T5G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 0
Publication Order Number: NSR0140/D
NSR0140M2T5G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Reverse Breakdown Voltage (IR = 10 mA) Total Capacitance (VR = 1.0 V, f = 1.0 MHz) Reverse Leakage (VR = 30 V) Forward Voltage (IF = 1.0 mAdc) Symbol V(BR)R CT IR VF Min 30 − − − Typ − 2.0 300 0.28 Max − 2.5 500 0.35 Unit V pF nAdc Vdc
10 IF, FORWARD CURRENT (mA) IR , REVERSE CURRENT (μA)
1000 100 10 1.0 0.1 25°C 0.01 85°C 0.1 0.15 0.2 25°C 0.25 −40 °C 0.3 0.35 −55 °C 0.4 0.45 0.5 0.001 TA = 150°C 125°C 85°C
1.0
150 °C 125 °C 0 0.05
0.1
0
5
VF, FORWARD VOLTAGE (VOLTS)
10 15 20 25 VR, REVERSE VOLTAGE (VOLTS)
30
35
Figure 1. Typical Forward Voltage
Figure 2. Reverse Current versus Reverse Voltage
3.0 2.5 C T, CAPACITANCE (pF) 2.0 1.5 1.0 0.5 0 0 2.0 4.0 6.0 8.0 10 12 14 16 18
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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NSR0140M2T5G
PACKAGE DIMENSIONS
SOD−723 CASE 509AA−01 ISSUE O
D
−X− −Y− E
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS INCHES MIN NOM MAX MIN NOM MAX 0.49 0.52 0.55 0.019 0.020 0.022 0.25 0.28 0.32 0.0098 0.011 0.013 0.08 0.12 0.15 0.0032 0.0047 0.0059 0.95 1.00 1.05 0.037 0.039 0.041 0.55 0.60 0.65 0.022 0.024 0.026 1.35 1.40 1.45 0.053 0.055 0.057 0.15 0.20 0.25 0.006 0.0079 0.010
b
2X
0.08 (0.0032) X Y A
c
L HE
DIM A b c D E HE L
SOLDERING FOOTPRINT*
1.1 0.043 0.45 0.0177
0.50 0.0197
SCALE 10:1 mm inches
SOD−723
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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NSR0140/D
