DATA SHEET
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Schottky Barrier Diodes
HIGH CURRENT
SCHOTTKY BARRIER DIODE
NSR0320MW2T1G,
NSVR0320MW2T1G,
NSR0320MW2T3G
SOD−323
CASE 477
STYLE 1
These Schottky barrier diodes are designed for high current,
handling capability, and low forward voltage performance.
Features
1
CATHODE
• Low Forward Voltage − 0.24 Volts (Typ) @ IF = 10 mAdc
• High Current Capability
• ESD Rating:
Human Body Model: CLASS 3B
♦ Machine Model: C
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
♦
•
•
MAXIMUM RATINGS (TJ = 125°C unless otherwise noted)
Rating
Reverse Voltage
Peak Revese Voltage
Value
Unit
VR
20
Vdc
VRM
23
V
200
2.0
mW
mW/°C
A
PF
Forward Current (DC)
Continuous
IF
1
Forward Current
t = 8.3 ms Half Sinewave
IFSM
Thermal Resistance, Junction−to−Ambient
175 mm2, 1 oz. Cu, FR−4
RqJA
500
°C/W
Thermal Resistance, Junction−to−Lead
175 mm2, 1 oz. Cu, FR−4
RqJL
322
°C/W
Junction Temperature Range
TJ
−55 to
+125
°C
Storage Temperature Range
Tstg
−55 to
+150
°C
5
MARKING DIAGRAM
RD MG
G
RD = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Symbol
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
2
ANODE
A
ORDERING INFORMATION
Device
Package
Shipping†
NSR0320MW2T1G
SOD−323
(Pb−Free)
3,000 /
Tape & Reel
NSR0320MW2T3G
SOD−323
(Pb−Free)
10,000 /
Tape & Reel
NSVR0320MW2T1G
SOD−323
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the onsemi Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2011
April, 2022 − Rev. 8
Publication Order Number:
NSR0320MW2T1/D
NSR0320MW2T1G, NSVR0320MW2T1G, NSR0320MW2T3G
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Total Capacitance (VR = 5.0 V, f = 1.0 MHz)
CT
−
25
29
pF
Reverse Leakage
(VR = 15 V)
(VR = 2.0 V @ 85°C)
(VR = 15.0 V @ 85°C)
IR
−
−
−
10
200
450
50
−
−
Forward Voltage
(IF = 10 mA)
(IF = 100 mA)
(IF = 900 mA)
VF
−
−
−
0.24
0.30
0.45
0.27
0.35
0.50
V
10000
100
IR, REVERSE CURRENT (mA)
150°C
150°C
10
85°C
−55°C
1
0.0
25°C
0.1
−45°C
0.2
0.3
0.4
0.5
125°C
1000
85°C
100
10
25°C
1
0.6
0
5
10
15
20
VF, FORWARD VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 1. Forward Voltage
Figure 2. Leakage Current
140
120
CT, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
1000
mA
100
80
60
40
20
0
0
5
10
15
VR, REVERSE VOLTAGE (V)
Figure 3. Total Capacitance
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2
20
25
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
2
1
STYLE 1
SOD−323
CASE 477−02
ISSUE H
2
SCALE 4:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
HE
D
b
1
2
E
A3
A
C
NOTE 3
DATE 13 MAR 2007
1
STYLE 2
L
A1
NOTE 5
MILLIMETERS
DIM MIN
NOM MAX
A
0.80
0.90
1.00
A1 0.00
0.05
0.10
A3
0.15 REF
b
0.25
0.32
0.4
C 0.089
0.12 0.177
D
1.60
1.70
1.80
E
1.15
1.25
1.35
L
0.08
HE
2.30
2.50
2.70
INCHES
NOM MAX
0.035 0.040
0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
MIN
0.031
0.000
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
XX M
0.63
0.025
STYLE 1
0.83
0.033
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DESCRIPTION:
98ASB17533C
SOD−323
STYLE 2
XX = Specific Device Code
M = Date Code
1.60
0.063
DOCUMENT NUMBER:
XX M
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
NO POLARITY
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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