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NSS20201DMT
Product Preview
20 V, 2 A, Low VCE(sat) NPN
Transistors
ON Semiconductor’s e2 PowerEdge family of low VCE(sat)
transistors are miniature surface mount devices featuring ultra low
saturation voltage (VCE(sat)) and high current gain capability. These
are designed for use in low voltage, high speed switching applications
where affordable efficient energy control is important.
Typical applications are DC−DC converters and LED lightning,
power management…etc. In the automotive industry they can be used
in air bag deployment and in the instrument cluster. The high current
gain allows e2PowerEdge devices to be driven directly from PMU’s
control outputs, and the Linear Gain (Beta) makes them ideal
components in analog amplifiers.
Features
20 Volt, 2 Amp
NPN Low VCE(sat) Transistors
MARKING
DIAGRAM
1
2 XX MG
G
3
WDFN6
CASE 506AN
1
• NSV Prefix for Automotive and Other Applications Requiring
•
•
www.onsemi.com
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
NSV20201DMTWTBG − Wettable Flanks Device
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6
5
4
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Max
Unit
Collector−Emitter Voltage
VCEO
20
Vdc
Collector−Base Voltage
VCBO
20
Vdc
Emitter−Base Voltage
VEBO
7
Vdc
IC
2
A
ICM
3
A
Collector Current − Continuous
Collector Current − Peak
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance Junction−to−Ambient
(Notes 1 and 2)
Total Power Dissipation per Package @
TA = 25°C (Note 2)
Thermal Resistance Junction−to−Ambient
(Note 3)
Power Dissipation per Transistor @ TA = 25°C
(Note 3)
Junction and Storage Temperature Range
Symbol
Max
Unit
RqJA
55
°C/W
PD
2.27
W
RqJA
69
°C/W
PD
1.8
W
TJ, Tstg
−55 to
+150
°C
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
August, 2017 − Rev. P0
7
2
5
4
1
8
3
6,7
1
5
2
4
3,8
ORDERING INFORMATION
1. Per JESD51−7 with 100 mm2 pad area and 2 oz. Cu (Dual Operation).
2. PD per Transistor when both are turned on is one half of Total PD or 1.13 Watts.
3. Per JESD51−7 with 100 mm2 pad area and 2 oz. Cu (Single−Operation).
© Semiconductor Components Industries, LLC, 2017
6
1
Package
Shipping†
NSS20201DMTTBG
WDFN6
(Pb−Free)
3000/Tape &
Reel
NSV20201DMTWTBG
WDFN6
(Pb−Free)
3000/Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NSS20201DMT/D
NSS20201DMT
Table 1. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Collector−Emitter Breakdown Voltage (IC = 10 mA, IB = 0)
V(BR)CEO
20
V
Collector−Base Breakdown Voltage (Ic = 0.1 mA, IE = 0)
V(BR)CBO
20
V
Emitter−Base Breakdown Voltage (IE = 0.1 mA, IC = 0)
V(BR)EBO
7
Characteristic
Typ
Max
Unit
OFF CHARACTERISTICS
V
Collector Cutoff Current (VCB = 60 V, IE = 0)
ICBO
100
nA
Emitter Cutoff Current (VBE = 5.0 V)
IEBO
100
nA
ON CHARACTERISTICS
hFE
DC Current Gain (Note 4)
(IC = 100 mA, VCE = 2.0 V)
(IC = 500 mA, VCE = 2.0 V)
(IC = 1 A, VCE = 2.0 V)
(IC = 2 A, VCE = 2.0 V
250
220
180
100
Collector−Emitter Saturation Voltage (Note 4)
(IC = 500 mA, IB = 50 mA)
(IC = 700 mA, IB = 7 mA)
(IC = 2 A, IB = 200 mA)
VCE(sat)
Base*Emitter Saturation Voltage (Note 4)
(IC = 500 mA, IB = 50 mA)
(IC = 1 A, IB = 50 mA)
(IC = 1 A, IB = 100 mA)
VBE(sat)
Base−Emitter Turn−on Voltage (Note 4)
(IC = 500 mA, VCE = 2 V)
VBE(on)
V
0.100
0.200
0.330
V
1.0
1.1
1.2
0.9
V
DYNAMIC CHARACTERISTICS
Cobo
10
pF
fT
180
MHz
Delay Time (VCC = 10 V, IC = 0.5 A, IB1 = 25 mA, IB2 = −25 mA)
td
13
ns
Rise Time (VCC = 10 V, IC = 0.5 A, IB1 = 25 mA, IB2 = −25 mA)
tr
18
ns
Storage Time (VCC = 10 V, IC = 0.5 A, IB1 = 25 mA, IB2 = −25 mA)
ts
700
ns
Fall Time (VCC = 10 V, IC = 0.5 A, IB1 = 25 mA, IB2 = −25 mA)
tf
80
ns
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)
Cutoff Frequency
(IC = 50 mA, VCE = 2.0 V, f = 100 MHz)
SWITCHING TIMES
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Condition: Pulse Width = 300 msec, Duty Cycle ≤ 2%
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2
NSS20201DMT
TYPICAL CHARACTERISTICS
450
400
150°C
350
100°C
VCE = 2 V
hFE, DC CURRENT GAIN
hFE, DC CURRENT GAIN
450
300
25°C
250
TBD
200
−55°C
150
100
400
150°C
350
100°C
300
25°C
250
TBD
200
−55°C
150
100
50
50
0
0
0.01
0.1
0.001
10
Figure 2. DC Current Gain
10 mA
8.0 mA
12 mA
1.2
10
1
IB = 20 mA
16 mA
1.4
1
Figure 1. DC Current Gain
14 mA
1.6
0.1
IC, COLLECTOR CURRENT (A)
18 mA
1.8
0.01
IC, COLLECTOR CURRENT (A)
2.2
2.0
1
VCE(sat), COLLECTOR−EMITTER
SATURATION (V)
0.001
IC, COLLECTOR CURRENT (A)
VCE = 5 V
TBD
6.0 mA
1.0
0.8
4.0 mA
0.6
0.4
2.0 mA
0.2
0
150°C
100°C
TBD
0.1
−55°C
25°C
IC/IB = 50
0.01
0
1
2
3
4
5
6
0.001
0.01
0.1
1
10
VCE, COLLECTOR EMITTER VOLTAGE (V)
IC, COLLECTOR CURRENT (A)
Figure 3. Collector Current as a Function of
Collector Emitter Voltage
Figure 4. Collector−Emitter Saturation Voltage
150°C
TBD
0.1
−55°C
VBE(sat), BASE−EMITTER
SATURATION (V)
VCE(sat), COLLECTOR−EMITTER
SATURATION (V)
1
25°C
100°C
1.0
−55°C
TBD
25°C
0.5 100°C
150°C
IC/IB = 100
IC/IB = 20
0
0.01
0.001
0.01
0.1
0.001
1
0.01
0.1
1
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
Figure 5. Collector−Emitter Saturation Voltage
Figure 6. Base−Emitter Saturation Voltage
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3
10
NSS20201DMT
TYPICAL CHARACTERISTICS
1.0
VCE(sat), COLLECTOR−EMITTER
SATURATION (V)
VBE(on), BASE−EMITTER VOLTAGE (V)
1.2
1.0
−55°C
0.8
TBD
25°C
0.6
100°C
0.4
150°C
0.2
VCE = 2 V
0
0.001
0.01
0.1
1
10
0.7
0.6
TBD
0.5
IC = 2.0 A
0.4
IC = 1.0 A
0.3
0.2
IC = 0.5 A
0.1 I = 0.1 A
C
0
0.0001
0.001
0.01
0.1
1
IB, BASE CURRENT (A)
Figure 7. Base−Emitter “ON” Voltage
Figure 8. Collector Saturation Region
40
Cobo, OUTPUT CAPACITANCE (pF)
Cibo, INPUT CAPACITANCE (pF)
0.8
IC, COLLECTOR CURRENT (A)
240
TA = 25°C
f = 1 MHz
200
160
TBD
120
80
TA = 25°C
f = 1 MHz
35
30
25
TBD
20
15
10
5
0
40
0
1
2
3
4
5
6
0
7
5
10
15
20
25
VEB, BASE−EMITTER VOLTAGE (A)
VCB, COLLECTOR−BASE REVERSE VOLTAGE (V)
Figure 9. Input Capacitance
Figure 10. Output Capacitance
30
2.5
1000
TJ = 25°C
VCE = 2 V
ftest = 100 MHz
PD, POWER DISSIPATION (W)
fT, CURRENT GAIN BANDWIDTH PRODUCT (MHz)
TA = 25°C
0.9
TBD
100
2.0
1.5
TBD
1.0
0.5
0
10
1
10
100
1000
0
25
50
75
100
IC, COLLECTOR CURRENT (mA)
TEMPERATURE (°C)
Figure 11. fT, Current Gain Bandwidth Product
Figure 12. Power Derating
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4
125
150
NSS20201DMT
TYPICAL CHARACTERISTICS
R(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (°C/W)
100
Duty Cycle = 0.5
0.20
10 0.10
TBD
0.05
0.02
1 0.01
Single Pulse
0.1
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
10
100
1000
t, PULSE TIME (sec)
Figure 13. Thermal Resistance by Transistor
R(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (°C/W)
100
Duty Cycle = 0.5
0.20
10
0.10
TBD
0.05
0.02
1 0.01
Single Pulse
0.1
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
t, PULSE TIME (sec)
Figure 14. Thermal Resistance for Both Transistors
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5
NSS20201DMT
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 506AN
ISSUE G
PIN ONE
REFERENCE
ÉÉÉ
ÇÇÇ
ÇÇÇ
A
B
D
ÍÍÍ
ÍÍÍ
ÍÍÍ
ÇÇ
ÉÉ
EXPOSED Cu
PLATING
MOLD CMPD
DETAIL B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
OPTIONAL
CONSTRUCTIONS
E
DIM
A
A1
A3
b
D
D2
E
E2
e
F
K
L
L1
0.10 C
0.10 C
L
TOP VIEW
L1
DETAIL A
A3
DETAIL B
0.10 C
L
OPTIONAL
CONSTRUCTIONS
A
0.08 C
NOTE 4
A1
C
SIDE VIEW
0.10 C A
SEATING
PLANE
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
1.80
B
2X
0.82
D2
D2
L
1
3
F
1.10
6X
DETAIL A
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
2.00 BSC
0.57
0.77
2.00 BSC
0.90
1.10
0.65 BSC
0.95 BSC
0.25 REF
0.30
0.20
--0.10
E2
0.10 C A
0.45
2.30
B
PACKAGE
OUTLINE
6
K
4
6X
b
0.10 C A
e
0.05 C
B
1
NOTE 3
6X
BOTTOM VIEW
0.39
0.65
PITCH
DIMENSIONS: MILLIMETERS
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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NSS20201DMT/D