RB751S40
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
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Features
•
•
•
•
•
•
Extremely Fast Switching Speed
Extremely Low Forward Voltage − 0.28 V (Typ) @ IF = 1.0 mAdc
Low Reverse Current
Lead−Free Plating
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
40 V SCHOTTKY
BARRIER DIODE
1
CATHODE
2
1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
VRM
40
V
Reverse Voltage
VR
30
V
Forward Continuous Current (DC)
IF
30
mA
IFSM
500
mA
Peak Reverse Voltage
Peak Forward Surge Current
2
ANODE
SOD−523
CASE 502
STYLE 1
MARKING DIAGRAM
5E MG
G
ESD Rating: Class 1C per Human Body Model
Class A per Machine Model
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
(Note 1) TA = 25°C
Derate above 25°C
PD
200
mW
1.57
mW/°C
635
°C/W
Thermal Resistance,
Junction−to−Ambient
RqJA
Junction and Storage
Temperature Range
TJ, Tstg
1
5E = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
RB751S40T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
NSVRB751S40T1G
SOD−523
(Pb−Free)
3000 / Tape &
Reel
RB751S40T5G
SOD−523
(Pb−Free)
8000 / Tape &
Reel
NSVRB751S40T5G
SOD−523
(Pb−Free)
8000 / Tape &
Reel
°C
−55 to +150
2
1. FR−5 Minimum Pad.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
August, 2018 − Rev. 8
1
Publication Order Number:
RB751S40T1/D
RB751S40
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
V(BR)R
30
−
−
V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz)
CT
−
2.0
2.5
pF
Reverse Leakage
(VR = 30 V)
IR
−
300
500
nAdc
Forward Voltage
(IF = 1.0 mAdc)
VF
−
0.28
0.37
Vdc
Characteristic
Reverse Breakdown Voltage
(IR = 10 mA)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1000
IR , REVERSE CURRENT (μA)
1.0
150°C
TA = 150°C
100
125°C
10
85°C
1.0
0.1
25°C
0.01
125°C
85°C
25°C
-40°C
-55°C
0.3
0.4
0.001
0.1
0
0.05
0.1
0.15
0.2
0.25
0.35
0.45
0.5
5
0
10
15
20
25
VR, REVERSE VOLTAGE (VOLTS)
VF, FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
2.5
2.0
1.5
1.0
0.5
0
0
2.0
4.0
30
Figure 2. Reverse Current versus Reverse
Voltage
3.0
C T, CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
10
6.0
8.0
10
12
14
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Capacitance
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2
16
18
35
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
2
2
1
1
STYLE 1
STYLE 2
SOD−523
CASE 502−01
ISSUE E
SCALE 4:1
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
GENERIC
MARKING DIAGRAM*
SIDE VIEW
2X
XX
L
1
XX
2
1
STYLE 1
2X
XX
M
L2
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
= Specific Device Code
Date Code
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
1.80
0.48
2
STYLE 2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
2X
M
b
0.08
1
M
2X
DATE 28 SEP 2010
2X
STYLE 2:
NO POLARITY
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON11524D
SOD−523
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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