NSZ5V6V2T1G

NSZ5V6V2T1G Zener Voltage Regulators 200 mW SOD-523 Surface Mount This series of Zener diodes is packaged in a SOD-523 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards. Specification Features http://onsemi.com • Standard Zener Breakdown Voltage of 5.6 V • Steady State Power Rating of 200 mW • Small Body Outline Dimensions: • • • • 1 Cathode 2 Anode 0.047″ x 0.032″ (1.20 mm x 0.80 mm) Low Body Height: 0.028″ (0.7 mm) ESD Rating of Class 3 (>16 kV) per Human Body Model Tight Tolerance VZ These are Pb-Free Devices 2 1 SOD-523 CASE 502 PLASTIC Mechanical Characteristics CASE: Void‐free, transfer‐molded, thermosetting plastic MARKING DIAGRAM CT MG G Epoxy Meets UL 94, V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C 1 2 Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Total Device Dissipation FR-5 Board, (Note 1) @ TA = 25°C Derate above 25°C Thermal Resistance from Junction-to-Ambient Junction and Storage Temperature Range Symbol PD 200 1.5 RqJA TJ, Tstg 635 -65 to +150 mW mW/°C °C/W °C Max Unit CT = Specific Device Code M Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device NSZ5V6V2T1G Package SOD-523* Shipping† 3000/Tape & Reel Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR-4 Minimum Pad. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2007 1 May, 2007 - Rev. 0 Publication Order Number: NSZ5V6V2/D NSZ5V6V2T1G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types) Symbol VZ IZT ZZT IZK ZZK IR VR IF VF QVZ C Parameter Reverse Zener Voltage @ IZT Reverse Current Maximum Zener Impedance @ IZT Reverse Current Maximum Zener Impedance @ IZK Reverse Leakage Current @ VR Reverse Voltage Forward Current Forward Voltage @ IF Maximum Temperature Coefficient of VZ Max. Capacitance @VR = 0 and f = 1 MHz VZ VR IR VF IZT V IF I Figure 1. Zener Voltage Regulator ELECTRICAL CHARACTERISTICS (VF = 0.9 Max @ IF = 10 mA for all types) Zener Voltage VZ Min 5.49 100 Max 5.73 ZZK IZ = 1.0 mA W Max 200 ZZT IZ = IZT @ 10% Mod W Max 40 Max IR @ VR mA 1.0 V 2.0 dVZ/dt (mV/k) @ IZT1 = 5 mA Min -2.0 Max 2.5 Device* NSZ5V6V2T1G Test Current Izt mA 5.0 C pF Max @ VR =0 f = 1 MHz 200 80 POWER DISSIPATION (%) 60 40 20 0 0 25 50 75 100 125 150 TEMPERATURE (°C) Figure 2. Steady State Power Derating http://onsemi.com 2 NSZ5V6V2T1G PACKAGE DIMENSIONS SOD-523 CASE 502-01 ISSUE C -XA -YB 1 D 2 PL 0.08 (0.003) M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS MIN NOM MAX 1.10 1.20 1.30 0.70 0.80 0.90 0.50 0.60 0.70 0.25 0.30 0.35 0.07 0.14 0.20 0.15 0.20 0.25 1.50 1.60 1.70 INCHES NOM 0.047 0.032 0.024 0.012 0.0055 0.008 0.063 2 TXY DIM A B C D J K S MIN 0.043 0.028 0.020 0.010 0.0028 0.006 0.059 MAX 0.051 0.035 0.028 0.014 0.0079 0.010 0.067 C K J S -TSEATING PLANE SOLDERING FOOTPRINT* 1.40 0.0547 0.40 0.0157 0.40 0.0157 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT:  Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone : 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free  USA/Canada Europe, Middle East and Africa Technical Support:  Phone: 421 33 790 2910 Japan Customer Focus Center  Phone: 81-3-5773-3850 ON Semiconductor Website : www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 3 NSZ5V6V2/D