NTDV20N06LT4G-VF01

Final Product/Process Change Notification Document # : FPCN21107ZAD Issue Date: 21 March 2017 Qualify ON Semiconductor Vietnam (OSV) as an additional Automotive site for Assembly/Test of specified products in DPAK package. Title of Change: Proposed Changed Material First Ship Date: 21 September 2017 Current Material Last Order Date: N/A Current Material Last Delivery Date: N/A Product Category: Active components – Discrete components Contact information Contact your local ON Semiconductor Sales Office or Samples Contact your local ON Semiconductor Sales Office to place sample order. Sample requests are to be submitted no later than 45 days after publication of this change notification. Sample Availability Date: 15 March 2017 PPAP Availability Date: 15 May 2017 Additional Reliability Data Contact your local ON Semiconductor Sales Office or . Type of Notification This is a Final Product/Process Change Notification (FPCN) sent to customers. This FPCN is being issued 6 months prior to implementation because this change provides an alternate source to an ON manufacturing facility utilizing the same BOM. ON Semiconductor will consider this proposed change and it’s conditions acceptable, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact . Change Category: Type of Change Process – Assembly Move of all or part of assembly to a different location/site/subcontractor. Process – Assembly Change of product marking. Test Flow Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor. Production from a new equipment/tool which uses the same basic technology (replacement equipment or extension of existing equipment pool) without change of process. Equipment Description and Purpose: This Final Notification announces the plan to qualify ON Semiconductor Vietnam (OSV) as an additional Assembly and Test site for operations of Automotive discrete DPAK packaged products. Upon the expiration of this FPCN, new OSV part numbers will be available to allow specified products to be sourced from either the Seremban or Vietnam locations using the same Bill of Material. ON Semiconductor Vietnam (OSV) is qualified site for DPAK Standard discrete packaged products and is ISO TS16949 certified. Products sourced from OSV have been qualified to Automotive requirements and continue remain as Pb-free, Halide free and RoHS compliant.  Reason / Motivation for Change: TEM001092 Rev. L Change benefits for customer: o Unconstrained Automotive Sourcing o Seamless dual source Mfg alternatives, ensuring capacity availability o Instantaneous capacity available for growth; Short lead times; Lines down aversion  Risk for late release for customer: Limited capacity. Page 1 of 3 Final Product/Process Change Notification Document # : FPCN21107ZAD Issue Date: 21 March 2017 Anticipated impact on fit, form, function, reliability, product safety or manufacturability The device has been qualified and validated based on the same Product Specification. The device has successfully passed the qualification tests. Potential impacts can be identified, but due to testing performed by ON Semiconductor in relation to the PCN, associated risks are verified and excluded. No anticipated impacts. Sites Affected: All site(s) not applicable Marking of Parts/ Traceability of Change: ON Semiconductor site(s) : ON Seremban, Malaysia ON Dong Nai Province, Vietnam External Foundry/Subcon site(s) Product from ON Semiconductor Vietnam (OSV) will be marked with site code “VN” prior to the date code while the Seremban device does not have site code marking. Reliability Data Summary: QV DEVICE NAME: NTD6414ANT4G (Mosfet) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 175 °C, bias = 80% of rated V 1008 hrs 0/84 HTGB JESD22-A108 Ta = 175 °C, 100% max rated Vgss 1008 hrs 0/84 HTSL JESD22-A103 Ta = 175 °C 1008 hrs 0/84 IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -55°C to +150°C 1000 cyc 0/84 AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 80% of rated V 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 TEM001092 Rev. L 0/84 Page 2 of 3 Final Product/Process Change Notification Document # : FPCN21107ZAD Issue Date: 21 March 2017 QV DEVICE NAME: MTD6N20ET4G (TMOS) PACKAGE: DPAK Test Specification Condition Interval Result HTRB JESD22-A108 Ta = 150 °C, bias = 80% of rated V 1008 hrs 0/84 HTGB JESD22-A108 Ta = 150 °C, 100% max rated Vgss 1008 hrs 0/84 HTSL JESD22-A103 Ta = 150 °C 1008 hrs IOL MIL-STD-750 (M1037) AEC-Q101 Ta=+25°C, deltaTj=100°C max, Ton = Toff = 2min 15000 cyc TC JESD22-A104 Temp = -55°C to +150°C 1000 cyc 0/84 UHAST JESD22-A118 Ta=130°C, P=18.8 PSIG, RH=85% 96 hrs 0/84 H3TRB JESD22-A101 Temp = 85°C, RH=85%, bias = 80% of rated V 1008 hrs 0/84 PC J-STD-020 JESD-A113 MSL 1 @ 260 °C 0/336 RSH JESD22- B106 Ta = 265°C, 10 sec 0/30 SD JSTD002 Ta = 245°C, 10 sec 0/15 0/84 0/84 NOTE: AEC-1pager is attached. To access file attachments on pdf copy of PCN, please be guided by the steps below: 1. Download pdf copy of the PCN to your computer 2. Open the downloaded pdf copy of the PCN 3. Click on the paper clip icon available on the menu provided in the left/bottom portion of the screen to reveal the Attachment field 4. Then click on the attached file/s Electrical Characteristic Summary: Electrical characteristics are not impacted. List of Affected Standard Parts: Current SBN Part Number New OSV Part Number Qualification Vehicle NTDV20N06LT4G NTDV20N06LT4G-VF01 NVD5414NT4G NVD5414NT4G-VF01 NTD110N02RT4G NTD6414ANT4G MTD6N20ET4G TEM001092 Rev. L Page 3 of 3