NTHD4401P
Power MOSFET
−20 V, −3.0 A, Dual P−Channel, ChipFETt
Features
• Low RDS(on) and Fast Switching Speed in a ChipFET Package
• Leadless ChipFET Package 40% Smaller Footprint than TSOP−6
• ChipFET Package with Excellent Thermal Capabilities where Heat
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Transfer is Required
V(BR)DSS
• Pb−Free Package is Available
RDS(on) TYP
ID MAX
130 mW @ −4.5 V
−20 V
−3.0 A
Applications
200 mW @ −2.5 V
• Charge Control in Battery Chargers
• Optimized for Battery and Load Management Applications in
•
•
S1
Portable Equipment
MP3 Players, Cell Phones, Digital Cameras, PDAs
Buck and Boost DC−DC Converters
S2
G1
G2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
−20
V
Gate−to−Source Voltage
VGS
"12
V
ID
−2.1
A
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
TA = 25°C
TA = 85°C
−1.5
tv5s
TA = 25°C
−3.0
Steady
State
TA = 25°C
TA = 85°C
0.6
tv5s
TA = 25°C
2.1
PD
W
1.1
D1
D2
P−Channel MOSFET
P−Channel MOSFET
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
−9.0
A
D1 8
1 S1
1
TJ, Tstg
−55 to
150
°C
D1 7
2 G1
2
Source Current (Body Diode)
IS
−2.5
A
D2 6
3 S2
3
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
D2 5
4 G2
4
tp = 10 ms
Operating Junction and Storage Temperature
THERMAL RESISTANCE RATINGS
Rating
Symbol
Value
Unit
Junction−to−Ambient − Steady State (Note 1)
RqJA
110
°C/W
Junction−to−Ambient − t v 5 s
November, 2005 − Rev. 4
7
6
5
C4 = Specific Device Code
M = Month Code
G
= Pb−Free Package
ORDERING INFORMATION
60
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
© Semiconductor Components Industries, LLC, 2005
8
C4 M
G
IDM
Pulsed Drain Current
1
Package
Shipping †
NTHD4401PT1
ChipFET
3000/Tape & Reel
NTHD4401PT1G
ChipFET
(Pb−Free)
3000/Tape & Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTHD4401P/D
NTHD4401P
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Test Condition
Min
Typ
Max
Unit
V(Br)DSS
VGS = 0 V, ID = −250 mA
−20
−23
V
−8.0
mV/°C
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
V(Br)DSS/TJ
IDSS
VGS = 0 V
TJ = 25°C
−1.0
VDS = −16 V
TJ = 85°C
−5.0
IGSS
VDS = 0 V, VGS = "12 V
VGS(th)
VGS = VDS, ID = −250 mA
mA
"100
nA
−1.2
V
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
Gate Threshold Temperature Coefficient
Drain−to−Source On Resistance
Forward Transconductance
VGS(th)/TJ
−0.6
−0.75
2.65
RDS(on)
VGS = −4.5 V, ID = −2.1 A
VGS = −2.5 V, ID = −1.7 A
VGS = −1.8 V, ID = −1.0 A
0.130
0.200
0.34
gFS
VDS = −10 V, ID = −2.1 A
5.0
mV/°C
0.155
0.240
W
S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
Ciss
Output Capacitance
Coss
185
300
95
150
Reverse Transfer Capacitance
Crss
30
50
Total Gate Charge
QG(TOT)
3.0
6.0
Threshold Gate Charge
QG(TH)
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
0.9
td(on)
7.0
12
13
25
33
50
27
40
−0.85
−1.15
VGS = 0 V, f = 1.0 MHz,
VDS = −10 V
VGS = −4.5 V, VDS = −10 V,
ID = −2.1 A
pF
0.2
nC
0.5
SWITCHING CHARACTERISTICS (Note 3)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
tr
td(off)
VGS = −4.5 V, VDD = −16 V,
ID = −2.1 A, RG = 2.5 W
tf
ns
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
VSD
Reverse Recovery Time
trr
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V
IS = −2.5 A
V
32
VGS = 0 V, dIS/dt = 90 A/ms,
IS = −2.1 A
QRR
10
22
15
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
3. Switching characteristics are independent of operating junction temperatures.
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2
ns
nC
NTHD4401P
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted)
4
TJ = 25°C
VGS = −6 V to −3 V
VGS = −2.4 V
−2.2 V
−2 V
−ID, DRAIN CURRENT (AMPS)
−ID, DRAIN CURRENT (AMPS)
4
3
−1.8 V
2
−1.6 V
1
−1.4 V
3
2
TC = −55°C
1
25°C
100°C
−1.2 V
0
0
1
2
3
5
4
6
7
0
0.5
8
−VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
1
1.5
2
2.5
−VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
VDS ≥ −10 V
0.5
ID = −2.1 A
TJ = 25°C
0.4
0.3
0.2
0.1
0
1
2
3
4
5
6
−VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
3
0.25
TJ = 25°C
0.225
0.2
VGS = −2.5 V
0.175
0.15
VGS = −4.5 V
0.125
0.1
0.5
1.5
2.5
3.5
4.5
−ID, DRAIN CURRENT (AMPS)
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
ID = −2.1 A
VGS = −4.5 V
RDS(on), DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
RDS(on), DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
1.6
1.4
1.2
1
0.8
0.6
−50
−25
0
25
50
75
100
125
150
ID = −1.0 A
VGS = −1.8 V
1.2
1
0.8
−50
TJ, JUNCTION TEMPERATURE (°C)
−25
0
25
50
75
100
125
TJ, JUNCTION TEMPERATURE (°C)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. On−Resistance Variation with
Temperature
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3
150
NTHD4401P
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise noted)
600
10000
VDS = 0 V
VGS = 0 V
C, CAPACITANCE (pF)
−IDSS, LEAKAGE (A)
500
TJ = 150°C
1000
TJ = 100°C
100
VGS = 0 V
TJ = 25°C
Ciss
400
Crss
300
200
Coss
100
0
10
2
4
6
8
10
12
14
16
18
10
20
5
0
−VGS −VDS
5
10
15
20
−VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS)
−VDS
5
10
QT
4
8
−VGS
3
6
Q1
2
Q2
4
1
ID = −2.1 A
TJ = 25°C
0
3.5
0
0
0.5
1
1.5
2
2.5
Qg, TOTAL GATE CHARGE (nC)
2
3
100
tf
td(off)
t, TIME (ns)
12
Figure 8. Capacitance Variation
−VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
6
tr
10
td(on)
VDD = −16 V
ID = −2.1 A
VGS = −4.5 V
1
1
10
Figure 10. Resistive Switching Time Variation
vs. Gate Resistance
2.5
VGS = 0 V
TJ = 25°C
2
1.5
1
0.5
0
0.3
100
RG, GATE RESISTANCE (OHMS)
Figure 9. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
−IS, SOURCE CURRENT (AMPS)
−VGS, GATE−TO−SOURCE VOLTAGE (VOLTS)
Figure 7. Drain−to−Source Leakage Current
vs. Voltage
0.5
0.7
0.9
−VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
Figure 11. Diode Forward Voltage vs. Current
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4
NTHD4401P
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
1.0
D = 0.5
0.2
0.1
0.1
Normalized to θJA at 10s.
0.05
Chip
0.02
0.0175 Ω
0.0710 Ω
0.2706 Ω
0.0154 F
0.0854 F
0.3074 F
0.5776 Ω
0.7086 Ω
0.01
SINGLE PULSE
0.01
1.0E−03
1.0E−02
1.0E−01
1.0E+00
1.0E+01
1.7891 F
107.55 F
Ambient
1.0E+02
1.0E+03
t, TIME (s)
Figure 12. Thermal Response
SOLDERING FOOTPRINT*
2.032
0.08
2.032
0.08
0.457
0.018
0.635
0.025
1.092
0.043
0.635
0.025
0.178
0.007
0.457
0.018
0.711
0.028
0.66
0.026
SCALE 20:1
mm Ǔ
ǒinches
0.254
0.010
0.66
0.026
Figure 13. Basic
SCALE 20:1
mm Ǔ
ǒinches
Figure 14. Style 2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BASIC PAD PATTERNS
The basic pad layout with dimensions is shown in
Figure 13. This is sufficient for low power dissipation
MOSFET applications, but power semiconductor
performance requires a greater copper pad area, particularly
for the drain leads.
The minimum recommended pad pattern shown in
Figure 14 improves the thermal area of the drain
connections (pins 5, 6, 7, 8) while remaining within the
confines of the basic footprint. The drain copper area is
0.0019 sq. in. (or 1.22 sq. mm). This will assist the power
dissipation path away from the device (through the copper
leadframe) and into the board and exterior chassis (if
applicable) for the single device. The addition of a further
copper area and/or the addition of vias to other board layers
will enhance the performance still further.
ChipFET is a trademark of Vishay Siliconix.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ChipFETt
CASE1206A−03
ISSUE K
8
DATE 19 MAY 2009
1
SCALE 1:1
D
8
7
q
6
L
5
HE
5
6
7
8
4
3
2
1
E
1
2
3
e1
4
b
e
DIM
A
b
c
D
E
e
e1
L
HE
q
c
RESET
A
0.05 (0.002)
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. DRAIN
4. GATE
5. SOURCE
6. DRAIN
7. DRAIN
8. DRAIN
STYLE 2:
PIN 1. SOURCE 1
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
STYLE 3:
PIN 1. ANODE
2. ANODE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
7. CATHODE
8. CATHODE
STYLE 4:
PIN 1. COLLECTOR
2. COLLECTOR
3. COLLECTOR
4. BASE
5. EMITTER
6. COLLECTOR
7. COLLECTOR
8. COLLECTOR
MILLIMETERS
NOM
MAX
1.05
1.10
0.30
0.35
0.15
0.20
3.05
3.10
1.65
1.70
0.65 BSC
0.55 BSC
0.28
0.35
0.42
1.80
1.90
2.00
5° NOM
MIN
1.00
0.25
0.10
2.95
1.55
INCHES
NOM
0.041
0.012
0.006
0.120
0.065
0.025 BSC
0.022 BSC
0.014
0.011
0.071
0.075
5° NOM
MIN
0.039
0.010
0.004
0.116
0.061
MAX
0.043
0.014
0.008
0.122
0.067
0.017
0.079
STYLE 6:
STYLE 5:
PIN 1. ANODE
PIN 1. ANODE
2. DRAIN
2. ANODE
3. DRAIN
3. DRAIN
4. DRAIN
4. GATE
5. SOURCE
5. SOURCE
6. DRAIN
6. GATE
7. CATHODE
7. DRAIN
8. CATHODE
8. CATHODE / DRAIN
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
SURFACE.
2.032
0.08
xxx MG
G
2.362
0.093
0.65
0.025
PITCH
xxx
= Specific Device Code
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
8X
0.66
0.026
0.457
0.018
mm Ǔ
ǒinches
Basic Style
OPTIONAL SOLDERING FOOTPRINTS ON PAGE 2
DOCUMENT NUMBER:
DESCRIPTION:
98AON03078D
ChipFET
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
ChipFETt
CASE 1206A−03
ISSUE K
DATE 19 MAY 2009
ADDITIONAL SOLDERING FOOTPRINTS*
1
2.032
0.08
2.032
0.08
1
4X
0.457
0.018
2X
1.092
0.043
1.727
0.068
2.362
0.093
2.362
0.093
0.65
0.025
PITCH
4X
2X
2X
0.457
0.018
0.66
0.026
mm Ǔ
ǒinches
Styles 1 and 4
2.032
0.08
1.118
0.044
mm Ǔ
ǒinches
Style 2
2.032
0.08
2X
0.66
0.026
1
2X
0.66
0.026
1
1.092
0.043
2X
0.66
0.026
1.092
0.043
2.362
0.093
2.362
0.093
0.65
0.025
PITCH
2X
0.65
0.025
PITCH
1.118
0.044
0.457
0.018
1.118
0.044
ǒ
mm
inches
2X
Ǔ
0.457
0.018
mm Ǔ
ǒinches
Style 5
Style 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON03078D
ChipFET
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
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