NTHL060N090SC1

NTHL060N090SC1

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO-247-3

  • 描述:

  • 数据手册
  • 价格&库存
NTHL060N090SC1 数据手册
MOSFET - SiC Power, Single N-Channel 900 V, 60 mW, 46 A NTHL060N090SC1 Features • • • • • • Typ. RDS(on) = 60 mW @ VGS = 15 V Typ. RDS(on) = 43 mW @ VGS = 18 V Ultra Low Gate Charge (typ. QG(tot) = 87 nC) Low Effective Output Capacitance (typ. Coss = 113 pF) 100% UIL Tested These Devices are RoHS Compliant www.onsemi.com V(BR)DSS RDS(on) MAX ID MAX 900 V 84 mW @ 15 V 46 A Typical Applications N−CHANNEL MOSFET • UPS • DC/DC Converter • Boost Inverter D MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Symbol Value Unit Drain−to−Source Voltage VDSS 900 V Gate−to−Source Voltage VGS +22/−8 V Recommended Operation Values of Gate−to− Source Voltage VGSop +15/−5 V ID 46 A PD 221 W ID 32 A PD 110 W IDM 184 A TJ, Tstg −55 to +175 °C IS 22 A EAS 162 mJ Parameter Continuous Drain Current RqJC Power Dissipation RqJC Continuous Drain Current RqJC Power Dissipation RqJC TC < 175°C Steady State S TC = 25°C Steady TC = 100°C State Pulsed Drain Current (Note 2) G TA = 25°C Operating Junction and Storage Temperature Range Source Current (Body Diode) Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 18 A, L = 1 mH) (Note 3) G D S TO−247−3LD CASE 340CX MARKING DIAGRAM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. $Y&Z&3&K NTHL060 N090SC1 THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit Junction−to−Case (Note 1) RqJC 0.68 °C/W Junction−to−Ambient (Note 1) RqJA 40 °C/W 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2. Repetitive rating, limited by max junction temperature. 3. EAS of 162 mJ is based on starting TJ = 25°C; L = 1 mH, IAS = 18 A, VDD = 100 V, VGS = 15 V. © Semiconductor Components Industries, LLC, 2018 April, 2021 − Rev. 3 1 $Y &Z &3 &K NTHL060N090SC1 = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Lot = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Publication Order Number: NTHL060N090SC1/D NTHL060N090SC1 ELECTRICAL CHARACTERISTICS Parameter Symbol Test Conditions Min Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 1 mA 900 Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/TJ Typ Max Unit OFF CHARACTERISTICS ID = 1 mA, referenced to 25_C Zero Gate Voltage Drain Current IDSS Gate−to−Source Leakage Current IGSS Gate Threshold Voltage VGS(th) VGS = VDS, ID = 5 mA Recommended Gate Voltage VGOP V 574 mV/_C mA VGS = 0 V, VDS = 900 V, TJ = 25_C 100 VGS = 0 V, VDS = 900 V, TJ = 175_C 250 VGS = +22/−8 V, VDS = 0 V ±1 mA ON CHARACTERISTICS Drain−to−Source On Resistance Forward Transconductance RDS(on) gFS 1.8 2.7 −5 VGS = 15 V, ID = 20 A, TJ = 25_C 60 4.3 V +15 V 84 mW VGS = 18 V, ID = 20 A, TJ = 25_C 43 VGS = 15 V, ID = 20 A, TJ = 175_C 76 VDS = 20 V, ID = 20 A 17 S 1770 pF 135 CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS 11 Total Gate Charge QG(tot) 87 Threshold Gate Charge QG(th) 17 Gate−to−Source Charge QGS Gate−to−Drain Charge QGD Gate Resistance VGS = 0 V, f = 1 MHz, VDS = 450 V VGS = −5/15 V, VDS = 720 V, ID = 10 A 113 nC 27 26 RG f = 1 MHz 3.0 W SWITCHING CHARACTERISTICS Turn-On Delay Time td(on) 22 40 tr 33 66 31 74 11 20 Rise Time Turn−Off Delay Time td(off) Fall Time tf VGS = −5/15 V, VDS = 720 V, ID = 20 A, RG = 2.5 W, Inductive Load Turn-On Switching Loss EON Turn-Off Switching Loss EOFF 23 Total Switching Loss ETOT 487 ns mJ 464 DRAIN−SOURCE DIODE CHARACTERISTICS Continuous Drain−to−Source Diode Forward Current ISD Pulsed Drain−to−Source Diode Forward Current (Note 2) ISDM Forward Diode Voltage VSD Reverse Recovery Time tRR VGS = −5 V, TJ = 25_C VGS = −5 V, TJ = 25_C VGS = −5 V, ISD = 10 A, TJ = 25_C 22 A 184 A 3.9 V 18 ns Reverse Recovery Charge QRR 84 nC Reverse Recovery Energy EREC 1.0 mJ Peak Reverse Recovery Current IRRM VGS = −5/15 V, ISD = 30 A, dIS/dt = 1000 A/ms, VDS = 720 V 9.0 A Charge Time ta 10 ns Discharge Time tb 8.0 ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2 NTHL060N090SC1 TYPICAL CHARACTERISTICS Figure 1. On−Region Characteristics Figure 2. Normalized On−Resistance vs. Drain Current and Gate Voltage Figure 3. On−Resistance Variation with Temperature Figure 4. On−Resistance vs. Gate−to−Source Voltage Figure 5. Transfer Characteristics Figure 6. Diode Forward Voltage vs. Current www.onsemi.com 3 NTHL060N090SC1 TYPICAL CHARACTERISTICS Figure 7. Gate−to−Source Voltage vs. Total Charge Figure 8. Capacitance vs. Drain−to−Source Voltage Figure 9. Unclamped Inductive Switching Capability Figure 10. Maximum Continuous Drain Current vs. Case Temperature Figure 11. Safe Operating Area Figure 12. Single Pulse Maximum Power Dissipation www.onsemi.com 4 NTHL060N090SC1 TYPICAL CHARACTERISTICS Figure 13. Junction−to−Ambient Thermal Response PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity NTHL060N090SC1 NTHL060N090SC1 TO−247 Long Lead Tube N/A N/A 30 Units www.onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−247−3LD CASE 340CX ISSUE A DATE 06 JUL 2020 GENERIC MARKING DIAGRAM* XXXXXXXXX AYWWG DOCUMENT NUMBER: DESCRIPTION: XXXXX A Y WW G = Specific Device Code = Assembly Location = Year = Work Week = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. Some products may not follow the Generic Marking. 98AON93302G TO−247−3LD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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