NTMFS6B14N
MOSFET – Power, Single,
N-Channel
100 V, 15 mW, 50 A
Features
•
•
•
•
Small Footprint (5x6 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low QG and Capacitance to Minimize Driver Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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V(BR)DSS
RDS(ON) MAX
ID MAX
100 V
15 mW @ 10 V
50 A
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
100
V
Gate−to−Source Voltage
VGS
±20
V
ID
50
A
Parameter
Continuous Drain
Current RqJC
(Notes 1, 2, 3)
TC = 25°C
Power Dissipation
RqJC (Notes 1, 2)
Continuous Drain
Current RqJA
(Notes 1, 2, 3)
Steady
State
TC = 100°C
TC = 25°C
TC = 100°C
TA = 25°C
Power Dissipation
RqJA (Notes 1 & 2)
Pulsed Drain Current
Steady
State
W
77
ID
PD
D
1.3
180
A
TJ, Tstg
−55 to
+ 150
°C
IS
60
A
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 24 A)
EAS
29
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Source Current (Body Diode)
MARKING
DIAGRAM
W
3.1
IDM
Operating Junction and Storage Temperature
N−CHANNEL MOSFET
A
10
6.4
TA = 100°C
TA = 25°C, tp = 10 ms
S (1,2,3)
32
TA = 100°C
TA = 25°C
G (4)
32
PD
D (5)
1
DFN5
(SO−8FL)
CASE 488AA
STYLE 1
A
Y
W
ZZ
S
S
S
G
D
6B14N
AYWZZ
D
D
= Assembly Location
= Year
= Work Week
= Lot Traceability
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
ORDERING INFORMATION
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
Symbol
Value
Unit
RqJC
1.6
°C/W
RqJA
40
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2015
May, 2019 − Rev. 1
1
Publication Order Number:
NTMFS6B14N/D
NTMFS6B14N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
100
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/
TJ
Typ
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
IDSS
Gate−to−Source Leakage Current
V
80
VGS = 0 V,
VDS = 80 V
mV/°C
TJ = 25 °C
10
TJ = 125°C
100
IGSS
VDS = 0 V, VGS = 20 V
VGS(TH)
VGS = VDS, ID = 250 mA
100
mA
nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Threshold Temperature Coefficient
VGS(TH)/TJ
Drain−to−Source On Resistance
RDS(on)
2.0
4.0
−8.5
V
mV/°C
VGS = 10 V
ID = 20 A
12.2
15
mW
VGS = 6 V
ID = 10 A
18.5
23
mW
CHARGES, CAPACITANCES & GATE RESISTANCE
Input Capacitance
CISS
1300
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
18
Total Gate Charge
QG(TOT)
20
Threshold Gate Charge
QG(TH)
2.2
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
6.5
Plateau Voltage
VGP
5.4
V
Gate Resistance
RG
1.0
W
VGS = 0 V, f = 1 MHz, VDS = 50 V
VGS = 10 V, VDS = 50 V; ID = 20 A
TJ = 25 °C
260
pF
nC
6.4
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
tr
td(OFF)
9.6
VGS = 10 V, VDS = 50 V,
ID = 20 A, RG = 1.0 W
tf
39
ns
17
6.8
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
VSD
TJ = 25°C
0.83
TJ = 125°C
0.8
tRR
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V,
IS = 20 A
1.2
V
45
VGS = 0 V, dIS/dt = 100 A/ms,
IS = 20 A
QRR
23
ns
22
50
nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
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2
NTMFS6B14N
TYPICAL CHARACTERISTICS
100
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
6.5 V
60
6.0 V
40
5.5 V
20
4.0 V
5.0 V
1.0
0.5
2.0
1.5
2.5
3.0
70
60
50
40
30
TJ = 25°C
20
TJ = 125°C
0
6
5
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
Figure 2. Transfer Characteristics
36
28
20
12
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0
8.5 9.0 9.5 10
VGS, GATE VOLTAGE (V)
7
8
30
TJ = 25°C
27
24
VGS = 6.0 V
21
18
15
VGS = 10 V
12
9
6
3
10
15
25
20
30
ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
100K
2.2
TJ = 150°C
ID = 20 A
VGS = 10 V
10K
IDSS, LEAKAGE (nA)
RDS(on), NORMALIZED DRAIN−TO−
SOURCE RESISTANCE
4
Figure 1. On−Region Characteristics
ID = 20 A
TJ = 25°C
1.8
3
2
VGS, GATE−TO−SOURCE VOLTAGE (V)
44
2.0
1
TJ = −55°C
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
52
4
80
10
0
4.5 V
0
VDS ≤ 10 V
90
7.0 V
80
0
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
100
VGS = 10 V
1.6
1.4
1.2
1.0
0.8
TJ = 125°C
1K
100
TJ = 25°C
10
0.6
0.4
−50
−25
0
25
50
75
100
125
150
1
10
20
30
40
50
60
70
80
90
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
100
NTMFS6B14N
TYPICAL CHARACTERISTICS
Coss
Crss
100
VGS = 0 V
TJ = 25°C
f = 1 MHz
10
1
100
7
Qgd
Qgs
6
5
4
3
TJ = 25°C
VDS = 50 V
ID = 20 A
2
1
0
2
0
4
6
8
10
12
14
16
20
18
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Qg, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
VDS = 50 V
ID = 20 A
VGS = 10 V
18
100
tr
td(off)
10
9
8
20
1000
t, TIME (ns)
10
QT
10
IS, SOURCE CURRENT (A)
1
VGS, GATE−TO−SOURCE VOLTAGE (V)
1000
td(on)
tf
TJ = 25°C
16
14
12
10
8
6
4
2
1
1
10
0
100
0.3
0.4
0.5
0.6
0.7
0.8
0.9
RG, GATE RESISTANCE (W)
VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
Figure 10. Diode Forward Voltage vs. Current
1000
ID, DRAIN CURRENT (A)
C, CAPACITANCE (pF)
Ciss
11
100
VGS ≤ 10 V
Single Pulse
TC = 25°C
500 ms
10
1 ms
1
0.01
10 ms
RDS(on) Limit
Thermal Limit
Package Limit
0.1
0.1
1
10
100
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
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4
NTMFS6B14N
TYPICAL CHARACTERISTICS
100
35
IPEAK, DRAIN CURRENT (A)
GFS, SMALL−SIGNAL FORWARD
TRANSFER CONDUCTANCE (S)
40
30
25
20
15
10
5
0
0
5
10
15
20
25
30
35
40
45
10
25°C
100°C
1
50
0.0001
0.01
0.001
ID, DRAIN CURRENT (A)
TAV, TIME IN AVALANCHE (sec)
Figure 12. GFS vs. ID
Figure 13. IPEAK vs. TAV
100
50% Duty Cycle
R(t) (°C/W)
10
1
20%
10%
5%
2%
1%
0.1
NTMFS6B14N, 650 mm2, Cu Single Layer Pad
Single Pulse
0.01
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 14. Thermal Response
DEVICE ORDERING INFORMATION
Marking
Package
Shipping†
NTMFS6B14NT1G
6B14N
DFN5
(Pb−Free)
1500 / Tape & Reel
NTMFS6B14NT3G
6B14N
DFN5
(Pb−Free)
5000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE N
1
DATE 25 JUN 2018
SCALE 2:1
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
A
2
B
D1
2X
0.20 C
4X
E1
2
q
E
c
1
2
3
A1
4
TOP VIEW
C
DETAIL A
0.10 C
SEATING
PLANE
A
0.10 C
SIDE VIEW
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.00
5.15
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.00
6.30
6.15
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.575
0.71
1.20
1.35
1.50
0.51
0.575
0.71
0.125 REF
3.00
3.40
3.80
0_
−−−
12 _
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
GENERIC
MARKING DIAGRAM*
DETAIL A
1
0.10
b
C A B
0.05
c
8X
XXXXXX
AYWZZ
e/2
e
L
1
4
K
RECOMMENDED
SOLDERING FOOTPRINT*
E2
PIN 5
(EXPOSED PAD)
L1
M
2X
0.495
4.560
2X
1.530
G
D2
2X
BOTTOM VIEW
XXXXXX = Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
0.475
3.200
4.530
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
1.330
STYLE 2:
2X
PIN 1. ANODE
0.905
2. ANODE
3. ANODE
4. NO CONNECT
0.965
5. CATHODE
1
4X
1.000
4X 0.750
1.270
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98AON14036D
DFN5 5x6, 1.27P (SO−8FL)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
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