NTP4813NLG

NTP4813NLG

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    SOT78

  • 描述:

    MOSFET N-CH 30V 40A TO220

  • 数据手册
  • 价格&库存
NTP4813NLG 数据手册
NTP4813NL Power MOSFET 30 V, 51 A, Single N−Channel, TO−220AB Features • • • • • Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses Optimized Gate Charge to Minimize Switching Losses Low RG These Devices are Pb−Free and are RoHS Compliant http://onsemi.com V(BR)DSS Applications ID MAX 13.1 mW @ 10 V 30 V • Power Motor Control • High Current, High Side Switching • DC−DC Converters RDS(ON) MAX 51 A 22 mW @ 4.5 V D MAXIMUM RATINGS (TJ = 25°C unless otherwise stated) Parameter Drain−to−Source Voltage Gate−to−Source Voltage Symbol Value Unit VDSS 30 V VGS ±20 V ID 12.8 A Continuous Drain Current RqJA (Note 1) TA = 25°C Power Dissipation RqJA (Note 1) TA = 25°C PD 3.75 W Continuous Drain Current RqJA (Note 2) TA = 25°C ID 10.2 A Power Dissipation RqJA (Note 2) TA = 85°C Steady State TA = 85°C W Continuous Drain Current RqJC (Note 1) TC = 25°C ID 51 A Power Dissipation RqJC (Note 1) TC = 25°C PD 60 W TA = 25°C IDM 154 A TA = 25°C IDmaxPkg 95 A TJ, TSTG −55 to +175 °C TC = 85°C Operating Junction and Storage Temperature Source Current (Body Diode) 4 Drain 4 2.40 Current Limited by Package MARKING DIAGRAM & PIN ASSIGNMENT 7.9 PD tp=10ms S N−CHANNEL MOSFET 9.9 TA = 25°C Pulsed Drain Current G TO−220AB CASE 221A STYLE 5 39.5 IS 50 A Drain to Source dV/dt dV/dt 6 V/ns Single Pulse Drain−to−Source Avalanche Energy (VDD = 24 V, VGS = 10 V, IL = 18 Apk, L = 0.3 mH, RG = 25 W) EAS 48.6 mJ Lead Temperature for Soldering Purposes (1/8” from case for 10 s) TL 260 °C 1 2 NTP4813NLG AYWW 1 Gate 3 A Y WW G 3 Source 2 Drain = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © Semiconductor Components Industries, LLC, 2012 October, 2012 − Rev. 0 1 Publication Order Number: NTP4813NL/D NTP4813NL THERMAL RESISTANCE MAXIMUM RATINGS Symbol Value Junction−to−Case (Drain) Parameter RqJC 2.5 Junction−to−Ambient – Steady State (Note 1) RqJA 40 Junction−to−Ambient – Steady State (Note 2) RqJA 62.5 Unit °C/W 1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu. 2. Surface−mounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA 30 Drain−to−Source Breakdown Voltage Temperature Coefficient V(BR)DSS/ TJ Typ Max Unit OFF CHARACTERISTICS Zero Gate Voltage Drain Current Gate−to−Source Leakage Current IDSS V 24.5 VGS = 0 V, VDS = 24 V mV/°C TJ = 25 °C 1 TJ = 125°C 10 IGSS VDS = 0 V, VGS = ±20 V VGS(TH) VGS = VDS, ID = 250 mA mA ±100 nA 2.5 V ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Negative Threshold Temperature Coefficient VGS(TH)/TJ Drain−to−Source On Resistance RDS(on) 1.5 5.5 mV/°C VGS = 10 V ID = 20 A 10.5 13.1 VGS = 4.5 V ID = 20 A 17.6 22 mW Forward Transconductance gFS VDS = 15 V, ID = 10 A 6.7 S Gate Resistance RG TA = 25°C 0.80 W CHARGES AND CAPACITANCES Input Capacitance CISS Output Capacitance COSS Reverse Transfer Capacitance CRSS 120 Total Gate Charge QG(TOT) 7.7 Threshold Gate Charge QG(TH) Gate−to−Source Charge QGS Gate−to−Drain Charge Total Gate Charge 895 VGS = 0 V, f = 1.0 MHz, VDS = 12 V VGS = 4.5 V, VDS = 15 V; ID = 30 A QGD QG(TOT) 220 1.6 3.4 pF 10.8 nC 3.6 VGS = 11.5 V, VDS = 15 V; ID = 30 A 17 td(ON) 10 tr VGS = 4.5 V, VDS = 15 V, ID = 15 A, RG = 3.0 W 21.5 nC SWITCHING CHARACTERISTICS (Note 4) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time td(OFF) 12 tf 3.2 td(ON) 6.3 tr td(OFF) VGS = 11.5 V, VDS = 15 V, ID = 15 A, RG = 3.0 W tf 13.4 17.6 1.6 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 2 ns ns NTP4813NL ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ Max TJ = 25°C 0.95 1.2 TJ = 125°C 0.85 Unit DRAIN−SOURCE DIODE CHARACTERISTICS Forward Diode Voltage Reverse Recovery Time Charge Time Discharge Time Reverse Recovery Charge VSD VGS = 0 V, IS = 30 A tRR ta tb V 14.8 VGS = 0 V, dIs/dt = 100 A/ms, IS = 30 A QRR 8.3 6.5 5.3 3. Pulse Test: pulse width v 300 ms, duty cycle v 2%. 4. Switching characteristics are independent of operating junction temperatures. http://onsemi.com 3 ns nC NTP4813NL TYPICAL PERFORMANCE CURVES ID, DRAIN CURRENT (A) 50 60 TJ = 25°C 4.5 V 40 4V 30 3.8 V 20 3.6 V 10 VDS ≥ 10 V 50 40 30 20 TJ = 125°C TJ = 25°C 10 3V 0 1 2 5 4 3 0 TJ = −55°C 1 2 3 4 6 5 VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V) Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 0 RDS(on), DRAIN−TO−SOURCE RESISTANCE (W) 10 V 6V 5V ID, DRAIN CURRENT (A) 60 0.030 ID = 20 A TJ = 25°C 0.03 TJ = 25°C 0.0275 0.025 0.025 0.02 VGS = 4.5 V 0.0175 0.020 0.015 0.0125 0.015 7 VGS = 10 V 0.01 0.0075 0.010 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 VGS, GATE−TO−SOURCE VOLTAGE (V) 0.005 10 25 30 35 40 45 Figure 4. On−Resistance vs. Drain Current and Gate Voltage 100,000 VGS = 0 V TJ = 150°C 10,000 IDSS, LEAKAGE (nA) RDS(on), DRAIN−TO−SOURCE RESISTANCE (NORMALIZED) 20 ID, DRAIN CURRENT (A) Figure 3. On−Resistance vs. Gate−to−Source Voltage 1.8 1.7 ID = 20 A 1.6 VGS = 10 V 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 −50 −25 0 15 TJ = 125°C 1000 100 TJ = 25°C 25 50 75 100 125 150 175 10 5 10 15 20 25 TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 5. On−Resistance Variation with Temperature Figure 6. Drain−to−Source Leakage Current vs. Drain Voltage http://onsemi.com 4 30 NTP4813NL 1000 TJ = 25°C 900 Ciss C, CAPACITANCE (pF) 800 700 600 500 400 300 Coss 200 100 0 Crss 5 0 10 15 20 25 VGS, GATE−TO−SOURCE VOLTAGE (V) TYPICAL PERFORMANCE CURVES 15 13.5 12 QT 10.5 9 7.5 6 Q2 Q1 4.5 ID = 30 A VDD = 15 V VGS = 11.5 V TJ = 25°C 3 1.5 0 0 1 2 3 VDS, DRAIN−TO−SOURCE VOLTAGE (V) Figure 7. Capacitance Variation 4 5 6 7 8 9 10 11 12 13 14 15 16 QG, TOTAL GATE CHARGE (nC) Figure 8. Gate−To−Source and Drain−To−Source Voltage vs. Total Charge 100 30 VGS = 0 V IS, SOURCE CURRENT (A) t, TIME (ns) tr td(off) 10 td(on) VDD = 15 V ID = 30 A VGS = 11.5 V tf 1 1 10 RG, GATE RESISTANCE (W) 25 20 15 10 5 0 0.5 100 100 ms 10 1 0.1 1 ms 10 ms dc 10 1 VDS, DRAIN−TO−SOURCE VOLTAGE (V) 100 EAS, SINGLE PULSE DRAIN−TO−SOURCE AVALANCHE ENERGY (mJ) ID, DRAIN CURRENT (A) 10 ms RDS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.7 0.8 1.0 0.9 Figure 10. Diode Forward Voltage vs. Current VGS = 20 V SINGLE PULSE TC = 25°C 100 0.6 VSD, SOURCE−TO−DRAIN VOLTAGE (V) Figure 9. Resistive Switching Time Variation vs. Gate Resistance 1000 TJ = 25°C 50 ID = 18 A 45 40 35 30 25 20 15 10 5 0 25 Figure 11. Maximum Rated Forward Biased Safe Operating Area 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) Figure 12. Maximum Avalanche Energy vs. Starting Junction Temperature http://onsemi.com 5 150 NTP4813NL TYPICAL PERFORMANCE CURVES I D, DRAIN CURRENT (AMPS) 100 125°C 10 100°C 25°C 1 0.1 1 10 100 PULSE WIDTH (ms) 1000 Figure 13. Avalanche Characteristics ORDERING INFORMATION Device NTP4813NLT4G Package Shipping† TO−220AB (Pb−Free) 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 NTP4813NL PACKAGE DIMENSIONS TO−220, SINGLE GAUGE CASE 221AB ISSUE A −T− B F T SEATING PLANE C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. 4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM) 4 DIM A B C D F G H J K L N Q R S T U V Z A Q U 1 2 3 H K Z L R V J G D N INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.020 0.024 0.235 0.255 0.000 0.050 0.045 ----0.080 STYLE 5: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 0.508 0.61 5.97 6.47 0.00 1.27 1.15 ----2.04 GATE DRAIN SOURCE DRAIN ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 http://onsemi.com 7 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NTD4813N/D
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