NUF2030XV6T1

NUF2030XV6, NUF2042XV6 USB Upstream Terminator with ESD Protection These devices are designed for applications requiring Line Termination, EMI Filtering and ESD Protection. They are intended for use in upstream USB ports, cellular phones, wireless equipment and computer applications. These devices offer an integrated solution in a small package (SOT−563) reducing PCB space and cost. http://onsemi.com CIRCUIT DESCRIPTION Features: • Provides USB Line Termination, Filtering and ESD Protection • Single IC Offers Cost Savings • Bidirectional EMI Filtering Prevents Noise from Entering/Leaving • • • the System Compliance with IEC61000−4−2 (Level 4) 8 kV (Contact) 15 kV (Air) ESD Ratings: Machine Model = C : Human Body Model = 3B These are Pb−Free Devices D1(0) VBUS D2(0) 6 5 4 RS Benefits: C1 RS C1 1 2 3 D1(i) GND D2(i) • SOT−563 Package Minimizes PCB Space • Integrated Circuit Increases System Reliability versus Discrete • Component Implementation TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances Typical Applications: • USB Hubs • Computer Peripherals Using USB Symbol Value Unit PD 225 mW TJ(max) 125 °C Operating Temperature Range TJ −55 to +125 °C Storage Temperature Range Tstg −55 to +125 °C Lead Solder Temperature (10 second duration) TL 260 °C Steady State Power Maximum Junction Temperature Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. © Semiconductor Components Industries, LLC, 2005 July, 2005 − Rev. 2 1 SOT−563 CASE 463A MARKING DIAGRAM MAXIMUM RATINGS (TA = 25°C) Rating 6 1 1 xx M G G xx = Specific Device Code (see table on page 5) M = Month Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Publication Order Number: NUF2030XV6/D NUF2030XV6, NUF2042XV6 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) VBR @ 1 mA (V) Line Capacitance Vdc = 2.5 V f = 1 MHz (pF) (Note 1) IR @ 3.3 V (nA) VRWM (V) Min Typ Max Min Typ Max NUF2030XV6T1 5.25 5.6 6.8 8.0 − 10 NUF2042XV6T1 5.25 5.6 6.8 8.0 − 10 Device Min Typ 100 − 100 37.6 Max Min Typ Max 30 36 17.6 22 26.4 42 56.4 17.6 22 26.4 1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded. 2. For other resistance value (e.g. 33 W), please contact your local ON Semiconductor sales representative. http://onsemi.com 2 Series Resistor RS (W) NUF2030XV6, NUF2042XV6 TYPICAL CHARACTERISTICS 0 0 −10 −5 −20 −30 S41 (dB) S21 (dB) −10 −15 −20 −40 −50 −60 −25 −70 −30 1.E+06 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 FREQUENCY (Hz) 1.E+08 1.E+09 1.E+10 FREQUENCY (Hz) Figure 2. Analog Cross−Talk (NUF2030) Figure 1. Insertion Loss Characteristics (NUF2030) 0 0 −10 −5 −20 −30 S41 (dB) S21 (dB) −10 −15 −20 −40 −50 −60 −25 −70 −30 1.E+06 1.E+07 1.E+08 1.E+09 −80 1.E+06 1.E+10 1.E+07 FREQUENCY (Hz) 1.E+10 Figure 4. Analog Cross−Talk (NUF2042) 80 60 70 CAPACITANCE (pF) 50 CAPACITANCE (pF) 1.E+09 FREQUENCY (Hz) Figure 3. Insertion Loss Characteristics (NUF2042) 40 30 20 10 0 1.E+08 60 50 40 30 20 10 0 1 2 3 4 0 5 0 REVERSE VOLTAGE (V) 1 2 3 4 REVERSE VOLTAGE (V) Figure 6. Typical Capacitance (NUF2042) Figure 5. Typical Capacitance (NUF2030) http://onsemi.com 3 5 NUF2030XV6, NUF2042XV6 24.5 RS = Typical 24.0 RS (W) 23.5 23.0 22.5 22.0 21.5 −20 −10 0 10 20 30 40 50 TEMPERATURE (°C) Figure 7. RS versus Temperature (NUF2030 and NUF2042) http://onsemi.com 4 60 70 NUF2030XV6, NUF2042XV6 ORDERING INFORMATION Device Marking Package Shipping † NUF2030XV6T1 30 SOT−563* 4000 / Tape & Reel NUF2030XV6T1G 30 SOT−563* 4000 / Tape & Reel NUF2042XV6T1 22 SOT−563* 4000 / Tape & Reel NUF2042XV6T1G 22 SOT−563* 4000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *These packages are inherently Pb−Free. http://onsemi.com 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT−563, 6 LEAD CASE 463A ISSUE H 6 1 SCALE 4:1 DOCUMENT NUMBER: DESCRIPTION: 98AON11126D SOT−563, 6 LEAD DATE 26 JAN 2021 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com SOT−563, 6 LEAD CASE 463A ISSUE H DATE 26 JAN 2021 GENERIC MARKING DIAGRAM* XX MG 1 XX = Specific Device Code M = Month Code G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DOCUMENT NUMBER: DESCRIPTION: 98AON11126D SOT−563, 6 LEAD Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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