NUF2101M
USB Filter with ESD
Protection
This device is designed for applications requiring Line
Termination, EMI Filtering and ESD Protection. It is intended for
use in downstream USB 1.1 ports, Cellular phones, Wireless
equipment and computer applications. This device offers an integrated
solution in a small package (TSOP−6, Case 318G) reducing PCB
space and cost.
Features:
• Provides USB Line Termination, Filtering and ESD Protection
• Single IC Offers Cost Savings by Replacing 4 Resistors,
http://onsemi.com
SCHEMATIC
RS
D+OUT
1
6
2 Capacitors, and 5 TVs diodes
15 k
• EMI Filtering Prevents Noise from Entering/Leaving the System
• IEC61000−4−2 (Level 4)
•
•
D+IN
8 kV (Contact)
15 kV (Air)
ESD Ratings: Machine Model = C
Human Body Model = 3B
Pb−Free Package is Available
VBUS
2
5
15 k
D−OUT
D−IN
4
3
Benefits:
• TSOP−6 Package Minimizes PCB Space
• Integrated Circuit Increases System Reliability versus Discrete
1
Component Implementation
TSOP−6
CASE 318G
STYLE 10
• TVs Devices Provide ESD Protection That is Better than a Discrete
Implementation because the Small IC minimizes Parasitic
Inductances
MARKING DIAGRAM
Typical Applications:
• USB Hubs
• Computer Motherboards
6VMG
G
1
MAXIMUM RATINGS (TA = 25°C)
Rating
Steady State Power
Maximum Junction Temperature
Symbol
Value
Unit
PD
225
mW
TJ(max)
125
°C
Operating Temperature Range
TJ
−55 to +125
°C
Storage Temperature Range
Tstg
−55 to +125
°C
Lead Solder Temperature
(10 second duration)
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 1
1
6V
= Specific Device Code
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
M
ORDERING INFORMATION
Device
NUF2101MT1
NUF2101MT1G
Package
Shipping †
TSOP−6
3000/Tape & Reel
TSOP−6
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NUF2101M/D
NUF2101M
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Device
Device
Marking
VRWM
(Volts)
Min
Max
Max IR
@ VRWM
= 5.25 V
VBUS to
GND
(mA)
NUF2101MT1
6V
5.25
6.0
8.0
1.0
0.1
55
26.3
30
33.7
13
15
17
NUF2101MT1G
6V
5.25
6.0
8.0
1.0
0.1
55
26.3
30
33.7
13
15
17
VBR @
1 mA
(Volts)
Pulldown
Resistor
Rpd (kW)
Max IR
@ VRWM
= 3.3 V
VBUS Pin
(mA)
Typical Line
Capacitance
(pF)
(Notes 2, 3)
Min
Nom
Max
Min
Nom
Max
Series Resistor
RS (W) (Note 1)
1. For other RS values (i.e. RS = 30 W) contact your local ON Semiconductor sales representative.
2. Measured at 25°C, VR = 0 V, f = 1 MHz, Pins 2, 3, 4 or 5 to GND with Pin 1 also grounded.
3. For other capacitance values contact your local ON Semiconductor sales representative.
http://onsemi.com
2
NUF2101M
TYPICAL CHARACTERISTICS
0
0
−5
−10
S41 (dB)
S21 (dB)
−10
−15
−20
−30
−40
−25
−50
−30
−35
−20
1
10
100
1000
FREQUENCY (MHz)
−60
10
10000
100
32
16000
31
15500
Rpd
16500
30
15000
29
14500
28
14000
27
−35
10000
Figure 2. Analog Cross−Talk
33
−15
5
45
25
TEMPERATURE (°C)
65
13500
−35
85
−15
Figure 3. RS vs. Temperature
5
45
25
TEMPERATURE (°C)
Figure 4. Rpd vs. Temperature
58
56
CAPACITANCE (pF)
RS
Figure 1. Insertion Loss Characteristics
1000
FREQUENCY (MHz)
54
52
50
48
46
44
42
40
0
1
2
3
Vr, REVERSE VOLTAGE (V)
Figure 5. Typical Capacitance
http://onsemi.com
3
4
65
85
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
1
SCALE 2:1
D
H
ÉÉ
ÉÉ
6
E1
1
NOTE 5
5
2
L2
4
GAUGE
PLANE
E
3
L
b
SEATING
PLANE
C
DETAIL Z
e
DIM
A
A1
b
c
D
E
E1
e
L
L2
M
c
A
0.05
M
DATE 12 JUN 2012
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D
AND E1 ARE DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.
A1
DETAIL Z
MIN
0.90
0.01
0.25
0.10
2.90
2.50
1.30
0.85
0.20
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.38
0.50
0.18
0.26
3.00
3.10
2.75
3.00
1.50
1.70
0.95
1.05
0.40
0.60
0.25 BSC
10°
−
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 2:
PIN 1. EMITTER 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. BASE 2
6. COLLECTOR 2
STYLE 3:
PIN 1. ENABLE
2. N/C
3. R BOOST
4. Vz
5. V in
6. V out
STYLE 4:
PIN 1. N/C
2. V in
3. NOT USED
4. GROUND
5. ENABLE
6. LOAD
STYLE 5:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 6:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 7:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. N/C
5. COLLECTOR
6. EMITTER
STYLE 8:
PIN 1. Vbus
2. D(in)
3. D(in)+
4. D(out)+
5. D(out)
6. GND
STYLE 9:
PIN 1. LOW VOLTAGE GATE
2. DRAIN
3. SOURCE
4. DRAIN
5. DRAIN
6. HIGH VOLTAGE GATE
STYLE 10:
PIN 1. D(OUT)+
2. GND
3. D(OUT)−
4. D(IN)−
5. VBUS
6. D(IN)+
STYLE 11:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1/GATE 2
STYLE 12:
PIN 1. I/O
2. GROUND
3. I/O
4. I/O
5. VCC
6. I/O
STYLE 13:
PIN 1. GATE 1
2. SOURCE 2
3. GATE 2
4. DRAIN 2
5. SOURCE 1
6. DRAIN 1
STYLE 14:
PIN 1. ANODE
2. SOURCE
3. GATE
4. CATHODE/DRAIN
5. CATHODE/DRAIN
6. CATHODE/DRAIN
STYLE 15:
PIN 1. ANODE
2. SOURCE
3. GATE
4. DRAIN
5. N/C
6. CATHODE
STYLE 16:
PIN 1. ANODE/CATHODE
2. BASE
3. EMITTER
4. COLLECTOR
5. ANODE
6. CATHODE
STYLE 17:
PIN 1. EMITTER
2. BASE
3. ANODE/CATHODE
4. ANODE
5. CATHODE
6. COLLECTOR
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.60
XXXAYWG
G
1
6X
3.20
XXX
A
Y
W
G
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
DESCRIPTION:
98ASB14888C
TSOP−6
1
IC
0.95
XXX MG
G
= Specific Device Code
=Assembly Location
= Year
= Work Week
= Pb−Free Package
STANDARD
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
*This information is generic. Please refer to device data sheet
for actual part marking. Pb−Free indicator, “G” or microdot “
G”, may or may not be present.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
© Semiconductor Components Industries, LLC, 2019
www.onsemi.com
onsemi,
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Email Requests to: orderlit@onsemi.com
onsemi Website: www.onsemi.com
◊
TECHNICAL SUPPORT
North American Technical Support:
Voice Mail: 1 800−282−9855 Toll Free USA/Canada
Phone: 011 421 33 790 2910
Europe, Middle East and Africa Technical Support:
Phone: 00421 33 790 2910
For additional information, please contact your local Sales Representative
