NUF3102MU

NUF3102MU Low Capacitance 3 Line EMI Filter with ESD Protection in UDFN8 Package This device is a 3 line EMI filter array for wireless applications. Greater than -25 dB attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF3102MU has a cut-off frequency of 150 MHz and can be used in applications for data rate up to 58 MHz or 116 Mbps. This UDFN package is specifically designed to enhance EMI filtering for low-profile or slim design electronics especially where space and height is a premium. It also offers ESD protection-clamping transients from static discharges. ESD protection is provided across all capacitors. Features http://onsemi.com R1 1 Cd R2 2 Cd R1 3 Cd Cd 6 Cd 7 Cd 8 • EMI Filtering and ESD Protection • Integration of 19 Discrete Components • Compliance with IEC61000-4-2 (Level 4) • • • • > 8 kV (Contact) > 15 kV (Air) UDFN Package, 1.2 x 1.8 mm Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C Human Body Model = 3B This is a Pb-Free Device* 4 Cd Cd 5 (Top View) 8 1 UDFN8 CASE 517AD MARKING DIAGRAM 32 M G 1 Benefits • Reduces EMI/RFI Emmisions on a Data Line • Low Profile Package; Typical Height of 0.5 mm • Design-Friendly and Easy-to-Use Pin Configurations, Particularly for Portable Electronics 32 = Specific Device Code M = Month Code G = Pb-Free Package (Note: Microdot may be in either location) • Integrated Solution Offers Cost and Space Savings in UDFN Package • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass • • • • • • • Filter Response Integrated Solution Improves System Reliability EMI Filtering and ESD Protection for Data Lines Keypad Interface and Protection for Portable Electronics Bottom Connector Interface for Mobile Handsets Notebook Computers and Digital Cameras LCD Display Interface in Mobile Handsets Camera Display Interface in Mobile Handsets PIN CONNECTIONS 1 4 Applications 8 5 ORDERING INFORMATION Device NUF3102MUTAG Package UDFN8 (Pb-Free) Shipping† 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2007 1 September, 2007 - Rev. 1 Publication Order Number: NUF3102MU/D NUF3102MU MAXIMUM RATINGS Parameter ESD Discharge IEC61000-4-2 Contact Discharge Machine Model Human Body Model Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) TOP TSTG TL Symbol VPP 14 0.4 8.0 -40 to 85 -55 to 150 260 °C °C °C Value Unit kV Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Resistance Capacitance (Notes 1 and 2) Cut-Off Frequency (Note 3) Symbol VRWM VBR IR R1 R2 Cd f3dB IR = 1.0 mA VRWM = 3.3 V IR = 10 mA IR = 10 mA VR = 2.5 V, f = 1.0 MHz Above this frequency, appreciable attenuation occurs 85 40 10 100 47 13 150 6.0 7.0 Test Conditions Min Typ Max 5.0 8.0 100 115 54 16 Unit V V nA W W pF MHz 1. Measured at 25°C. 2. Total Line Capacitance is two times the Diode Capacitance (Cd). 3. 50 W source and 50 W load termination. http://onsemi.com 2 NUF3102MU TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 -5 -10 -15 S21 (dB) S41 (dB) 10.0E+6 100E+6 FREQUENCY (Hz) 1.0E+9 10.0E+9 -20 -25 -30 -35 -40 -45 -50 1.0E+6 -60 10.0E+6 100E+6 1.0E+9 10.0E+9 -10 -20 -30 -40 -50 0 FREQUENCY (Hz) Figure 1. Insertion Loss Characteristic (P1-P8) (P3-P6) Figure 2. Analog Crosstalk Curve 2.0 NORMALIZED CAPACITANCE 1.10 1.08 1.06 RESISTANCE (%) 1.5 1.04 1.02 1.00 0.98 0.96 0.94 0.92 1.0 0.5 0 0 1.0 2.0 3.0 4.0 5.0 0.90 -40 -20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 3. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V) Figure 4. Typical Normalized Resistance over Temperature http://onsemi.com 3 NUF3102MU PACKAGE DIMENSIONS UDFN8, 1.8x1.2, 0.4P CASE 517AD-01 ISSUE O D 2X A B A3 2X 0.10 C 0.10 C 8X 0.08 C 8X L 8X K BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT:  Literature Distribution Center for ON Semiconductor  P.O. Box 5163, Denver, Colorado 80217 USA  Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada  Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada  Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free  USA/Canada Europe, Middle East and Africa Technical Support:  Phone: 421 33 790 2910 Japan Customer Focus Center  Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ÉÉ ÉÉ D2 1 8 PIN ONE REFERENCE E A1 TOP VIEW (A3) A DETAIL A SIDE VIEW A1 C SEATING PLANE 6X e 4 E2 5 8X b 0.10 C A B 0.05 C NOTE 3 7X http://onsemi.com 4 ÇÇ ÉÉ 0.10 C DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D D2 E E2 e K L MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.00 0.03 0.05 0.127 REF 0.15 0.20 0.25 1.80 BSC 0.90 1.00 1.10 1.20 BSC 0.20 0.30 0.40 0.40 BSC 0.20 ----0.20 0.25 0.30 SOLDERING FOOTPRINT* 1.35 0.35 0.30 1.05 0.20 8X 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NUF3102MU/D