NUF6106FCT1

NUF6106FCT1

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    FlipChip15

  • 描述:

    NUF6106FCT1

  • 详情介绍
  • 数据手册
  • 价格&库存
NUF6106FCT1 数据手册
NUF6106FCT1 6 Channel EMI Pi−Filter Array with ESD Protection This device is a 6 channel EMI filter array for data lines. Greater than −20 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection − clamping transients from static discharges to protect delicate data line circuitry. Features http://onsemi.com CIRCUIT DESCRIPTION R1 A1 D1 C1 R2 A2 D3 C3 R3 A3 D5 C5 R4 A4 D7 C7 R5 Symbol VPP 8.0 16 1.6 PR PT TJ Top Tstg 100 600 150 −40 to +85 −55 to +150 mW mW °C °C °C Value Unit kV A6 D11 C11 C12 D12 B3 A5 D9 C9 C10 R6 C6 D10 C5 C8 D8 B2 C4 C6 D6 C3 C4 D4 B1 C2 C2 D2 C1 • • • • • • • • • • EMI Filtering and ESD Protection for Data Lines Integration of 30 Discretes Offers Cost and Space Savings Exceeds IEC61000−4−2 (Level 4) Specifications Low Profile Flip−Chip Packaging MSL 1 EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players Typical Applications MAXIMUM RATINGS (TA = 25°C) Rating ESD Discharge IEC61000−4−2, − Contact Discharge Human Body Model Machine Model DC Power per Resistor DC Power per Package Junction Temperature Operating Temperature Range Storage Temperature Range A1 FLIP−CHIP CASE 499D PLASTIC DEVICE MARKING ON NUF6106YYWW NUF6106= Specific Device Code YY = Year WW = Work Week ORDERING INFORMATION Device NUF6106FCT1 Package Flip−Chip Shipping† 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2004 1 March, 2004 − Rev. 0 Publication Order Number: NUF6106FC/D NUF6106FCT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol VBR IR RI/O Cline IZ = 10 mA VRM = 3.3 V per line IR = 20 mA VR = 2.5 V, f = 1 MHz (Note 1) Characteristic Min 6.0 − 80 − Typ 7.0 − 100 21 Max 8.0 0.1 120 23 Unit V mA W pF 1. Measured from Input/Output Pins to Ground TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 −5 −10 −15 S21 (dB) −20 −25 −30 −35 −40 −45 1.0E+07 Channel 3 or Channel 4 1.0E+08 1.0E+09 1.0E+10 Channel 2 or Channel 5 S41 (dB) Channel 1 or Channel 6 0 −10 −20 −30 Channel 2 to Channel 3 −40 −50 −60 −70 −80 −90 1.0E+07 1.0E+08 1.0E+09 1.0E+10 Channel 3 to Channel 4 Channel 1 to Channel 2 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Insertion Loss Characteristics (S21 Measurement) Figure 2. Analog Crosstalk Curve (S41 Measurement) 30 25 CAPACITANCE (pF) 20 15 10 5 0 RESISTANCE (W) 0 1 2 3 4 5 110 108 106 104 102 100 98 96 94 92 90 −40 −20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 3. Typical Line Capacitance vs. Reverse Bias Voltage Figure 4. Typical Resistance Over Temperature http://onsemi.com 2 NUF6106FCT1 Printed Circuit Board Recommendations Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 500 mm Pitch 300 mm Solder Ball 250 mm +25 250 mm −0 Round NSMD 350 mm ±25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max Copper Solder Mask NSMD SMD Figure 5. Solder Mask versus Non−Solder Mask Definition Controlled Atmosphere 250 225°C Min 235°C Max 183 °C 150 140 to 160 °C 100 2 to 5 °C/s 200 TEMPERATURE (°C) 50 0 0 1 to 5 °C/s 1 2 3 4 5 1 to 2 min 30−100 sec TIME (minutes) Figure 6. Solder Reflow Profile http://onsemi.com 3 NUF6106FCT1 PACKAGE DIMENSIONS 15 PIN FLIP−CHIP CSP CASE 499D−01 ISSUE O 4X D 0.10 C A B TERMINAL A1 LOCATOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX −−− 0.700 0.210 0.270 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.340 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC 0.10 C A2 0.05 C SEATING PLANE C 15 X b B A 1 2 3 4 5 6 0.05 C A B 0.03 C ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. ÈÈ ÈÈ D1 e /2 e e1 4 E DIM A A1 A2 D E b e e1 D1 E1 A1 C A E1 http://onsemi.com NUF6106FC/D
NUF6106FCT1
1. 物料型号: - 型号:NUF6106FCT1

2. 器件简介: - 该器件是一个6通道EMI滤波器阵列,用于数据线。在800MHz至2.2GHz的频率范围内,可以获得大于-20dB的衰减。同时提供ESD保护,限制静电放电产生的瞬变,以保护敏感的数据线电路。

3. 引脚分配: - 该器件为15引脚的倒装芯片CSP封装(型号499D-01)。

4. 参数特性: - ESD放电:IEC61000-4-2人体模型接触放电8.0kV,机器模型16kV。 - 每个电阻的直流功率(PR):100mW。 - 每个封装的直流功率(PT):600mW。 - 结温(TJ):150°C。 - 工作温度范围(Top):-40至+85°C。 - 存储温度范围(Tstg):-55至+150°C。

5. 功能详解: - 提供数据线的EMI滤波和ESD保护。 - 集成了30个离散元件,节省成本和空间。 - 超过IEC61000-4-2(4级)规范。 - 低轮廓倒装芯片封装。

6. 应用信息: - 典型应用包括数据线的EMI滤波和ESD保护,如手机、手持设备、笔记本电脑、MP3播放器等。

7. 封装信息: - 封装类型:FLIP-CHIP CASE 499D。 - 标记信息:NUF6106YYWW(NUF6106为特定设备代码,YY为年份,WW为工作周)。 - 订购信息:NUF6106FCT1倒装芯片,3000/卷带&卷轴。
NUF6106FCT1 价格&库存

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NUF6106FCT1
  •  国内价格 香港价格
  • 3000+4.223903000+0.54636

库存:0