NUF6106FCT1G

NUF6106FCT1G

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    FlipChip15

  • 描述:

    RC (Pi) EMI Filter 2nd Order Low Pass 6 Channel R = 100 Ohms, C = 21pF (Total) 15-WFBGA, FCBGA

  • 数据手册
  • 价格&库存
NUF6106FCT1G 数据手册
NUF6106FCT1 6 Channel EMI Pi−Filter Array with ESD Protection This device is a 6 channel EMI filter array for data lines. Greater than −20 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection − clamping transients from static discharges to protect delicate data line circuitry. http://onsemi.com CIRCUIT DESCRIPTION Features • • • • • EMI Filtering and ESD Protection for Data Lines Integration of 30 Discretes Offers Cost and Space Savings Exceeds IEC61000−4−2 (Level 4) Specifications Low Profile Flip−Chip Packaging MSL 1 R1 A1 C1 D2 R2 C2 D3 C3 C4 D4 B1 EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Portables Notebook Computers MP3 Players R3 A3 C3 D5 C5 C6 D6 R4 A4 C4 D7 C7 C8 D8 B2 MAXIMUM RATINGS (TA = 25°C) Rating C2 A2 Typical Applications • • • • • C1 D1 R5 Symbol Value Unit ESD Discharge IEC61000−4−2, − Contact Discharge Human Body Model Machine Model VPP DC Power per Resistor PR 100 mW DC Power per Package PT 600 mW Junction Temperature TJ 150 °C Operating Temperature Range Top −40 to +85 °C Storage Temperature Range Tstg −55 to +150 °C A5 kV 8.0 16 1.6 C5 D9 C9 C10 D10 R6 A6 C6 D11 C11 C12 D12 B3 A1 FLIP−CHIP CASE 499D PLASTIC DEVICE MARKING ON NUF6106YYWW NUF6106= Specific Device Code YY = Year WW = Work Week ORDERING INFORMATION Device Package Shipping† NUF6106FCT1 Flip−Chip 3000/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.  Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 0 1 Publication Order Number: NUF6106FC/D NUF6106FCT1 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Min Typ Max Unit 6.0 7.0 8.0 V VRM = 3.3 V per line − − 0.1 A RI/O IR = 20 mA 80 100 120  Cline VR = 2.5 V, f = 1 MHz (Note 1) − 21 23 pF VBR Characteristic IZ = 10 mA IR 1. Measured from Input/Output Pins to Ground TYPICAL PERFORMANCE CURVES (TA = 25°C unless otherwise specified) 0 0 −5 −10 −10 Channel 1 or Channel 6 −20 Channel 1 to Channel 2 −30 S41 (dB) S21 (dB) −15 −20 −25 −30 Channel 2 to Channel 3 −40 Channel 3 to Channel 4 −50 −60 Channel 2 or Channel 5 −35 −70 Channel 3 or Channel 4 −40 −45 1.0E+07 1.0E+08 −80 1.0E+09 −90 1.0E+07 1.0E+10 1.0E+08 1.0E+09 1.0E+10 FREQUENCY (Hz) FREQUENCY (Hz) Figure 1. Insertion Loss Characteristics (S21 Measurement) Figure 2. Analog Crosstalk Curve (S41 Measurement) 110 30 108 106 RESISTANCE () CAPACITANCE (pF) 25 20 15 10 104 102 100 98 96 94 5 92 0 0 1 2 3 4 90 −40 5 REVERSE VOLTAGE (V) −20 0 20 40 60 TEMPERATURE (°C) Figure 3. Typical Line Capacitance vs. Reverse Bias Voltage Figure 4. Typical Resistance Over Temperature http://onsemi.com 2 80 NUF6106FCT1 Printed Circuit Board Recommendations 500 m Pitch 300 m Solder Ball Parameter 250 m +25 250 m −0 PCB Pad Size Pad Shape Round Pad Type NSMD 350 m ±25 Solder Mask Opening 125 m Solder Stencil Thickness Stencil Aperture 250 x 250 m sq. Solder Flux Ratio 50/50 Solder Paste Type No Clean Type 3 or Finer Trace Finish OSP Cu Trace Width 150 m Max Copper Solder Mask NSMD SMD Figure 5. Solder Mask versus Non−Solder Mask Definition Controlled Atmosphere 250 225°C Min 235°C Max TEMPERATURE (°C) 200 183 °C 2 to 5 °C/s 150 140 to 160 °C 100 50 1 to 5 °C/s 0 0 1 2 3 4 1 to 2 min 30−100 sec TIME (minutes) Figure 6. Solder Reflow Profile http://onsemi.com 3 5 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 15 PIN FLIPCHIP CSP CASE 499D−01 ISSUE O DATE 18−OCT−2002 SCALE 4:1 4X 0.10 C TERMINAL A1 LOCATOR D ÈÈ ÈÈ A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E A1 0.10 C A2 A MILLIMETERS MIN MAX 0.700 −−− 0.210 0.270 0.380 0.430 2.960 BSC 1.330 BSC 0.290 0.340 0.500 BSC 0.435 BSC 2.500 BSC 0.870 BSC GENERIC DEVICE MARKING 0.05 C ÈÈ ÈÈ SEATING PLANE D1 e /2 C DIM A A1 A2 D E b e e1 D1 E1 e C 15 X b 0.05 C A B 0.03 C DOCUMENT NUMBER: DESCRIPTION: E1 B A 1 2 3 4 5 98AON11990D 15 PIN FLIPCHIP CSP 6 e1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com ◊ TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative
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