NUF8402MNT4G

NUF8402MN 8 Line EMI Filter with ESD Protection This device is an 8 line EMI filter array for wireless applications. Greater than −35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. Features 1 Cd 2 Cd 3 Cd 4 Cd 5 Cd 6 Cd 7 Cd 8 Cd Cd Cd 9 Cd 10 Cd 11 Cd 12 Cd 13 Cd 14 Cd 15 http://onsemi.com 16 • EMI Filtering and ESD Protection • Integration of 24 Discrete Components • Compliance with IEC61000−4−2 (Level 4) • • • • > 18 kV (Contact) DFN Package, 1.6 x 4.0 mm Moisture Sensitivity Level 1 ESD Ratings: Human Body Model = 3B Machine Model = C This is a Pb−Free Device* Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution Offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response • Integrated Solution Improves System Reliability Applications • • • • • EMI Filtering and ESD Protection for Data Lines Wireless Phones Handheld Products Notebook Computers LCD Displays 1 2 3 4 5 6 7 8 (Top View) MARKING DIAGRAM 1 16 DFN CASE 506AC 842 AYW GND 1 842 A Y W = Specific Device Code = Assembly Location = Year = Work Week 16 15 14 13 12 11 (Bottom View) 10 9 Figure 1. Pin Connections *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ORDERING INFORMATION Device NUF8402MNT4G Package DFN16 (Pb−Free) Shipping† 4000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2005 1 May, 2005 − Rev. 2 Publication Order Number: NUF8402MN/D NUF8402MN MAXIMUM RATINGS Parameter ESD Discharge IEC61000−4−2 Operating Temperature Range Storage Temperature Range Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 seconds) Contact Discharge Symbol VPP TOP TSTG TL Value 18 −40 to 85 −55 to 150 260 Unit kV °C °C °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Parameter Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Resistance Capacitance (Notes 1 and 2) Cut−Off Frequency (Note 3) Symbol VRWM VBR IR RA Cd f3dB Above this frequency, appreciable attenuation occurs IR = 1.0 mA VRWM = 3.3 V IR = 20 mA 85 15 100 17 105 6.0 7.0 Test Conditions Min Typ Max 5.0 8.0 100 115 20 Unit V V nA W pF MHz 1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz. 2. Total Line Capacitance is 2 times the Diode Capacitance (Cd). 3. 50 W source and 50 W load termination. http://onsemi.com 2 NUF8402MN TYPICAL PERFORMANCE CURVES (TA= 25°C unless otherwise specified) 0 −5 −10 −15 S21 (dB) S41 (dB) 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10 −20 −25 −30 −35 −40 −45 −50 1.E+06 0 −10 −20 −30 −40 −50 −60 −70 −80 1.E+06 1.E+07 1.E+08 FREQUENCY (Hz) 1.E+09 1.E+10 Figure 2. Insertion Loss Characteristic (S21 Measurement) 2.0 110 108 106 CAPACITANCE (pF) RESISTANCE (W) 1.5 104 102 100 98 96 94 92 0 0 1.0 2.0 3.0 4.0 5.0 90 −40 Figure 3. Analog Crosstalk Curve (S41 Measurement) 1.0 0.5 −20 0 20 40 60 80 REVERSE VOLTAGE (V) TEMPERATURE (°C) Figure 4. Typical Capacitance vs. Reverse Biased Voltage (Normalized Capacitance Cd at 2.5 V) 102.0 NORMALIZED CAPACITANCE (%) 101.5 101.0 100.5 100.0 99.5 99.0 98.5 98.0 −60 −40 −20 0 20 Figure 5. Typical Resistance over Temperature 40 60 80 100 TEMPERATURE (°C) Figure 6. Normalized Capacitance over Temperature (Normalized @ 255C, VR = 2.5 V, f = 1 MHz) http://onsemi.com 3 NUF8402MN PACKAGE DIMENSIONS DFN16 CASE 506AC−01 ISSUE B D A B PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO TERMINAL AND IS MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.18 0.30 4.00 BSC 3.10 3.30 1.60 BSC 0.30 0.50 0.50 BSC 0.20 −−− 0.20 0.40 E (A3) 0.15 C 2X TOP VIEW 0.15 C 0.10 C 16X (A3) A 0.08 C SIDE VIEW A1 D2 C SEATING PLANE DIM A A1 A3 b D D2 E E2 e K L 16X L 1 SOLDERING FOOTPRINT* 8 2X 0.25 x 0.40 mm TEST PAD SIZE e 4.10 14X 0.50 E2 K 16 9 16X b NOTE 3 PITCH 16X 0.10 C A B 0.05 C 0.50 1.91 BOTTOM VIEW 16X 0.28 16X 0.51 SCALE 16:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 NUF8402MN/D