NUP6012PMU

NUP6012PMU Six-Line Transient Voltage Suppressor Array ESD Protection Diodes with Ultra−Low (0.7 pF) Capacitance The six−line voltage transient suppressor array is designed to protect voltage−sensitive components that require ultra−low capacitance from ESD and transient voltage events. This device features a common anode design which protects six independent high speed data lines in a single six−lead UDFN low profile package. Excellent clamping capability, low capacitance, low leakage, and fast response time make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs. Features http://onsemi.com D1 D2 D3 D4 D5 D6 • • • • • • • • • • • • Low Capacitance Data Lines (0.7 pF Typical) Protects up to Six Data Lines UDFN Package, 1.6 x 1.6 mm Low Profile of 0.50 mm for Ultra Slim Design ESD Rating: IEC61000−4−2: Level 4 − Contact (14 kV) D1, D2, D3, D4 ,D5 and D6 Pins = 5.2 V Minimum Protection RoHS Compliant This is a Pb−Free Device USB 2.0 High−Speed Interface Cell Phones MP3 Players SIM Card Protection Rating Operating Junction Temperature Range Storage Temperature Range Lead Solder Temperature – Maximum (10 seconds) IEC 61000−4−2 Contact Value −40 to 125 −55 to 150 260 14000 Unit °C °C °C V MARKING DIAGRAM 6 1 XX M G UDFN6 1.6x1.6 MU SUFFIX CASE 517AP 1 XX MG G = Specific Device Code = Date Code = Pb−Free Package Typical Applications (Note: Microdot may be in either location) PIN CONNECTIONS D1 1 D2 2 D3 3 GND 6 5 4 D6 D5 D4 MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified) Symbol TJ TSTG TL ESD ORDERING INFORMATION Device NUP6012PMUTAG Package Shipping† Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. UDFN6 3000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2008 June, 2008− Rev. 0 1 Publication Order Number: NUP6012PMU/D NUP6012PMU ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT IF VF Ppk C Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Forward Current Forward Voltage @ IF Peak Power Dissipation Max. Capacitance @ VR = 0 and f = 1.0 MHz IPP VC VBR VRWM IF I IR VF IT V Uni−Directional TVS ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified) Parameter Reverse Working Voltage (D1, D2, D3, D4, D5 and D6) Breakdown Voltage (D1, D2, D3, D4, D5 and D6) Reverse Leakage Current (D1, D2, D3, D4, D5 and D6) Capacitance (D1, D2, D3, D4, D5 and D6) (Note 1) IT = 1 mA, (Note 2) @ VRWM VR = 0 V, f = 1 MHz (Line to GND) Conditions Symbol VRWM VBR IR CJ Min − 5.2 − − Typ − 5.5 − 0.7 Max 4.0 − 1.0 0.9 Unit V V mA pF 1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT. Figure 1. ESD Clamping Voltage Screenshot Positive 8 kV Contact per IEC61000−4−2 Figure 2. ESD Clamping Voltage Screenshot Negative 8 kV Contact per IEC61000−4−2 http://onsemi.com 2 NUP6012PMU PACKAGE DIMENSIONS UDFN6, 1.6x1.6, 0.5P CASE 517AP−01 ISSUE O D 2X A B L1 E DETAIL A 0.10 C L 2X 0.10 C DETAIL B (A3) A A1 0.05 C 6X 0.05 C SIDE VIEW A1 C SEATING PLANE DETAIL A 6X L D2 1 3 E2 6X K e 6 5 6X b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 3 ÉÉÉ ÉÉÉ ÉÉÉ DETAIL B ÉÉÉ ÉÉÉ PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. DIM A A1 A3 b D E e D2 E2 K L L1 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.20 0.30 1.60 BSC 1.60 BSC 0.50 BSC 1.10 1.30 0.45 0.65 0.20 −−− 0.20 0.40 0.00 0.15 OPTIONAL CONSTRUCTION EXPOSED Cu MOLD CMPD TOP VIEW A3 OPTIONAL CONSTRUCTION SOLDERMASK DEFINED MOUNTING FOOTPRINT* 1.26 0.52 6X 0.61 1.90 1 0.50 PITCH 6X 0.32 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NUP6012PMU/D